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Berlin: VDE-Verlag.","ieee":"M. Blauth, F. Berger, and J. Song, “Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis,” in <i>Proceedings / ICEC 2014 </i>, Dresden, Germany, 2014, pp. 496–501.","mla":"Blauth, Michael, et al. “Optimization of the Number of Contact Springs in a Connector by Means of Analytical and Numerical Analysis.” <i>Proceedings / ICEC 2014 </i>, edited by Frank Berger and Verband der Elektrotechnik, Elektronik, Informationstechnik, VDE-Verlag, 2014, pp. 496–501.","short":"M. Blauth, F. Berger, J. Song, in: F. Berger, Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), Proceedings / ICEC 2014 , VDE-Verlag, Berlin, 2014, pp. 496–501.","ufg":"<b>Blauth, Michael et. al. (2014)</b>: Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis, in: Frank Berger/Verband der Elektrotechnik, Elektronik, Informationstechnik (Hgg.): <i>Proceedings / ICEC 2014 </i>, Berlin, S. 496–501.","chicago":"Blauth, Michael, Frank Berger, and Jian Song. “Optimization of the Number of Contact Springs in a Connector by Means of Analytical and Numerical Analysis.” In <i>Proceedings / ICEC 2014 </i>, edited by Frank Berger and Verband der Elektrotechnik, Elektronik, Informationstechnik, 496–501. Berlin: VDE-Verlag, 2014.","chicago-de":"Blauth, Michael, Frank Berger und Jian Song. 2014. Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis. In: <i>Proceedings / ICEC 2014 </i>, hg. von Frank Berger und Verband der Elektrotechnik, Elektronik, Informationstechnik, 496–501. Berlin: VDE-Verlag.","bjps":"<b>Blauth M, Berger F and Song J</b> (2014) Optimization of the Number of Contact Springs in a Connector by Means of Analytical and Numerical Analysis. In Berger F and Verband der Elektrotechnik, Elektronik, Informationstechnik (eds), <i>Proceedings / ICEC 2014 </i>. Berlin: VDE-Verlag, pp. 496–501.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Blauth, Michael</span> ; <span style=\"font-variant:small-caps;\">Berger, Frank</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span>: Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis. In: <span style=\"font-variant:small-caps;\">Berger, F.</span> ; <span style=\"font-variant:small-caps;\">Verband der Elektrotechnik, Elektronik, Informationstechnik</span> (Hrsg.): <i>Proceedings / ICEC 2014 </i>. Berlin : VDE-Verlag, 2014, S. 496–501","van":"Blauth M, Berger F, Song J. Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis. In: Berger F, Verband der Elektrotechnik, Elektronik, Informationstechnik, editors. Proceedings / ICEC 2014 . Berlin: VDE-Verlag; 2014. p. 496–501.","havard":"M. Blauth, F. Berger, J. Song, Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis, in: F. Berger, Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), Proceedings / ICEC 2014 , VDE-Verlag, Berlin, 2014: pp. 496–501."},"conference":{"location":"Dresden, Germany","name":"The 27th International Conference on Electrical Contacts","end_date":"2014-06-26","start_date":"2014-06-22"},"date_created":"2020-10-08T08:02:58Z","author":[{"last_name":"Blauth","first_name":"Michael","full_name":"Blauth, Michael","id":"49095"},{"first_name":"Frank","full_name":"Berger, Frank","last_name":"Berger"},{"last_name":"Song","id":"5297","full_name":"Song, Jian","first_name":"Jian"}],"publication_identifier":{"isbn":["978-3-8007-3624-9"]},"type":"conference","_id":"3653","date_updated":"2023-03-15T13:49:48Z","publication":"Proceedings / ICEC 2014 ","publisher":"VDE-Verlag","corporate_editor":["Verband der Elektrotechnik, Elektronik, Informationstechnik","ETG, the Power Engineering Society within VDE","ITG, Information Technology Society within VDE"]},{"publisher":"VDE-Verlag","corporate_editor":["Verband der Elektrotechnik, Elektronik, Informationstechnik","ETG : the Power Engineering Society within VDE","ITG : Information Technology Society within VDE"],"publication":"Proceedings / ICEC 2014 ","date_updated":"2023-03-15T13:49:48Z","_id":"3655","type":"conference","publication_identifier":{"isbn":["978-3-8007-3624-9"]},"author":[{"full_name":"Ren, Wanbin","first_name":"Wanbin","last_name":"Ren"},{"last_name":"Zhi","first_name":"Hongxu","full_name":"Zhi, Hongxu"},{"first_name":"Shengjun","full_name":"Xue, Shengjun","last_name":"Xue"},{"first_name":"Guofu","full_name":"Zhai, Guofu","last_name":"Zhai"},{"last_name":"Song","first_name":"Jian","full_name":"Song, Jian","id":"5297"}],"date_created":"2020-10-08T09:42:59Z","conference":{"start_date":"2014-06-22","end_date":"2014-06-26","name":"The 27th International Conference on Electrical Contacts","location":"Dresden, Germany"},"citation":{"havard":"W. Ren, H. Zhi, S. Xue, G. Zhai, J. Song, Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts, in: F. Berger, Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), Proceedings / ICEC 2014 , VDE-Verlag, Berlin, 2014: pp. 158–162.","van":"Ren W, Zhi H, Xue S, Zhai G, Song J. Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In: Berger F, Verband der Elektrotechnik, Elektronik, Informationstechnik, editors. Proceedings / ICEC 2014 . Berlin: VDE-Verlag; 2014. p. 158–62.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Ren, Wanbin</span> ; <span style=\"font-variant:small-caps;\">Zhi, Hongxu</span> ; <span style=\"font-variant:small-caps;\">Xue, Shengjun</span> ; <span style=\"font-variant:small-caps;\">Zhai, Guofu</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span>: Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In: <span style=\"font-variant:small-caps;\">Berger, F.</span> ; <span style=\"font-variant:small-caps;\">Verband der Elektrotechnik, Elektronik, Informationstechnik</span> (Hrsg.): <i>Proceedings / ICEC 2014 </i>. Berlin : VDE-Verlag, 2014, S. 158–162","bjps":"<b>Ren W <i>et al.</i></b> (2014) Numerical Simulation and Experimental Verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet Contacts. In Berger F and Verband der Elektrotechnik, Elektronik, Informationstechnik (eds), <i>Proceedings / ICEC 2014 </i>. Berlin: VDE-Verlag, pp. 158–162.","chicago-de":"Ren, Wanbin, Hongxu Zhi, Shengjun Xue, Guofu Zhai und Jian Song. 2014. Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In: <i>Proceedings / ICEC 2014 </i>, hg. von Frank Berger und Verband der Elektrotechnik, Elektronik, Informationstechnik, 158–162. Berlin: VDE-Verlag.","chicago":"Ren, Wanbin, Hongxu Zhi, Shengjun Xue, Guofu Zhai, and Jian Song. “Numerical Simulation and Experimental Verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet Contacts.” In <i>Proceedings / ICEC 2014 </i>, edited by Frank Berger and Verband der Elektrotechnik, Elektronik, Informationstechnik, 158–62. Berlin: VDE-Verlag, 2014.","short":"W. Ren, H. Zhi, S. Xue, G. Zhai, J. Song, in: F. Berger, Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), Proceedings / ICEC 2014 , VDE-Verlag, Berlin, 2014, pp. 158–162.","ufg":"<b>Ren, Wanbin et. al. (2014)</b>: Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts, in: Frank Berger/Verband der Elektrotechnik, Elektronik, Informationstechnik (Hgg.): <i>Proceedings / ICEC 2014 </i>, Berlin, S. 158–162.","mla":"Ren, Wanbin, et al. “Numerical Simulation and Experimental Verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet Contacts.” <i>Proceedings / ICEC 2014 </i>, edited by Frank Berger and Verband der Elektrotechnik, Elektronik, Informationstechnik, VDE-Verlag, 2014, pp. 158–62.","ieee":"W. Ren, H. Zhi, S. Xue, G. Zhai, and J. Song, “Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts,” in <i>Proceedings / ICEC 2014 </i>, Dresden, Germany, 2014, pp. 158–162.","apa":"Ren, W., Zhi, H., Xue, S., Zhai, G., &#38; Song, J. (2014). Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In F. Berger &#38; Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), <i>Proceedings / ICEC 2014 </i> (pp. 158–162). Berlin: VDE-Verlag.","ama":"Ren W, Zhi H, Xue S, Zhai G, Song J. Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In: Berger F, Verband der Elektrotechnik, Elektronik, Informationstechnik, eds. <i>Proceedings / ICEC 2014 </i>. Berlin: VDE-Verlag; 2014:158-162."},"editor":[{"last_name":"Berger","full_name":"Berger, Frank","first_name":"Frank"}],"publication_status":"published","title":"Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts","page":"158 - 162","department":[{"_id":"DEP6012"}],"status":"public","year":2014,"user_id":"74004","place":"Berlin","language":[{"iso":"eng"}]}]