[{"publication_status":"published","title":"Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis","editor":[{"first_name":"Frank","full_name":"Berger, Frank","last_name":"Berger"}],"citation":{"short":"M. Blauth, F. Berger, J. Song, in: F. Berger, Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), Proceedings / ICEC 2014 , VDE-Verlag, Berlin, 2014, pp. 496–501.","ufg":"<b>Blauth, Michael et. al. (2014)</b>: Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis, in: Frank Berger/Verband der Elektrotechnik, Elektronik, Informationstechnik (Hgg.): <i>Proceedings / ICEC 2014 </i>, Berlin, S. 496–501.","mla":"Blauth, Michael, et al. “Optimization of the Number of Contact Springs in a Connector by Means of Analytical and Numerical Analysis.” <i>Proceedings / ICEC 2014 </i>, edited by Frank Berger and Verband der Elektrotechnik, Elektronik, Informationstechnik, VDE-Verlag, 2014, pp. 496–501.","ieee":"M. Blauth, F. Berger, and J. Song, “Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis,” in <i>Proceedings / ICEC 2014 </i>, Dresden, Germany, 2014, pp. 496–501.","apa":"Blauth, M., Berger, F., &#38; Song, J. (2014). Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis. In F. Berger &#38; Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), <i>Proceedings / ICEC 2014 </i> (pp. 496–501). Berlin: VDE-Verlag.","ama":"Blauth M, Berger F, Song J. Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis. In: Berger F, Verband der Elektrotechnik, Elektronik, Informationstechnik, eds. <i>Proceedings / ICEC 2014 </i>. Berlin: VDE-Verlag; 2014:496-501.","havard":"M. Blauth, F. Berger, J. Song, Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis, in: F. Berger, Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), Proceedings / ICEC 2014 , VDE-Verlag, Berlin, 2014: pp. 496–501.","van":"Blauth M, Berger F, Song J. Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis. In: Berger F, Verband der Elektrotechnik, Elektronik, Informationstechnik, editors. Proceedings / ICEC 2014 . Berlin: VDE-Verlag; 2014. p. 496–501.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Blauth, Michael</span> ; <span style=\"font-variant:small-caps;\">Berger, Frank</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span>: Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis. In: <span style=\"font-variant:small-caps;\">Berger, F.</span> ; <span style=\"font-variant:small-caps;\">Verband der Elektrotechnik, Elektronik, Informationstechnik</span> (Hrsg.): <i>Proceedings / ICEC 2014 </i>. Berlin : VDE-Verlag, 2014, S. 496–501","bjps":"<b>Blauth M, Berger F and Song J</b> (2014) Optimization of the Number of Contact Springs in a Connector by Means of Analytical and Numerical Analysis. In Berger F and Verband der Elektrotechnik, Elektronik, Informationstechnik (eds), <i>Proceedings / ICEC 2014 </i>. Berlin: VDE-Verlag, pp. 496–501.","chicago-de":"Blauth, Michael, Frank Berger und Jian Song. 2014. Optimization of the Number of Contact Springs in a Connector by means of Analytical and Numerical Analysis. In: <i>Proceedings / ICEC 2014 </i>, hg. von Frank Berger und Verband der Elektrotechnik, Elektronik, Informationstechnik, 496–501. Berlin: VDE-Verlag.","chicago":"Blauth, Michael, Frank Berger, and Jian Song. “Optimization of the Number of Contact Springs in a Connector by Means of Analytical and Numerical Analysis.” In <i>Proceedings / ICEC 2014 </i>, edited by Frank Berger and Verband der Elektrotechnik, Elektronik, Informationstechnik, 496–501. Berlin: VDE-Verlag, 2014."},"conference":{"end_date":"2014-06-26","start_date":"2014-06-22","name":"The 27th International Conference on Electrical Contacts","location":"Dresden, Germany"},"date_created":"2020-10-08T08:02:58Z","author":[{"first_name":"Michael","full_name":"Blauth, Michael","id":"49095","last_name":"Blauth"},{"last_name":"Berger","full_name":"Berger, Frank","first_name":"Frank"},{"last_name":"Song","full_name":"Song, Jian","id":"5297","first_name":"Jian"}],"user_id":"74004","place":"Berlin","language":[{"iso":"eng"}],"status":"public","year":2014,"department":[{"_id":"DEP6012"}],"page":"496 - 501","type":"conference","_id":"3653","publication":"Proceedings / ICEC 2014 ","date_updated":"2023-03-15T13:49:48Z","publisher":"VDE-Verlag","corporate_editor":["Verband der Elektrotechnik, Elektronik, Informationstechnik","ETG, the Power Engineering Society within VDE","ITG, Information Technology Society within VDE"],"publication_identifier":{"isbn":["978-3-8007-3624-9"]}},{"corporate_editor":["Verband der Elektrotechnik, Elektronik, Informationstechnik","ETG : the Power Engineering Society within VDE","ITG : Information Technology Society within VDE"],"publisher":"VDE-Verlag","type":"conference","_id":"3655","publication":"Proceedings / ICEC 2014 ","date_updated":"2023-03-15T13:49:48Z","publication_identifier":{"isbn":["978-3-8007-3624-9"]},"conference":{"name":"The 27th International Conference on Electrical Contacts","location":"Dresden, Germany","start_date":"2014-06-22","end_date":"2014-06-26"},"author":[{"first_name":"Wanbin","full_name":"Ren, Wanbin","last_name":"Ren"},{"last_name":"Zhi","full_name":"Zhi, Hongxu","first_name":"Hongxu"},{"full_name":"Xue, Shengjun","first_name":"Shengjun","last_name":"Xue"},{"first_name":"Guofu","full_name":"Zhai, Guofu","last_name":"Zhai"},{"id":"5297","full_name":"Song, Jian","first_name":"Jian","last_name":"Song"}],"date_created":"2020-10-08T09:42:59Z","title":"Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts","publication_status":"published","editor":[{"last_name":"Berger","first_name":"Frank","full_name":"Berger, Frank"}],"citation":{"apa":"Ren, W., Zhi, H., Xue, S., Zhai, G., &#38; Song, J. (2014). Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In F. Berger &#38; Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), <i>Proceedings / ICEC 2014 </i> (pp. 158–162). Berlin: VDE-Verlag.","ieee":"W. Ren, H. Zhi, S. Xue, G. Zhai, and J. Song, “Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts,” in <i>Proceedings / ICEC 2014 </i>, Dresden, Germany, 2014, pp. 158–162.","ama":"Ren W, Zhi H, Xue S, Zhai G, Song J. Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In: Berger F, Verband der Elektrotechnik, Elektronik, Informationstechnik, eds. <i>Proceedings / ICEC 2014 </i>. Berlin: VDE-Verlag; 2014:158-162.","ufg":"<b>Ren, Wanbin et. al. (2014)</b>: Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts, in: Frank Berger/Verband der Elektrotechnik, Elektronik, Informationstechnik (Hgg.): <i>Proceedings / ICEC 2014 </i>, Berlin, S. 158–162.","short":"W. Ren, H. Zhi, S. Xue, G. Zhai, J. Song, in: F. Berger, Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), Proceedings / ICEC 2014 , VDE-Verlag, Berlin, 2014, pp. 158–162.","mla":"Ren, Wanbin, et al. “Numerical Simulation and Experimental Verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet Contacts.” <i>Proceedings / ICEC 2014 </i>, edited by Frank Berger and Verband der Elektrotechnik, Elektronik, Informationstechnik, VDE-Verlag, 2014, pp. 158–62.","bjps":"<b>Ren W <i>et al.</i></b> (2014) Numerical Simulation and Experimental Verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet Contacts. In Berger F and Verband der Elektrotechnik, Elektronik, Informationstechnik (eds), <i>Proceedings / ICEC 2014 </i>. Berlin: VDE-Verlag, pp. 158–162.","chicago":"Ren, Wanbin, Hongxu Zhi, Shengjun Xue, Guofu Zhai, and Jian Song. “Numerical Simulation and Experimental Verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet Contacts.” In <i>Proceedings / ICEC 2014 </i>, edited by Frank Berger and Verband der Elektrotechnik, Elektronik, Informationstechnik, 158–62. Berlin: VDE-Verlag, 2014.","chicago-de":"Ren, Wanbin, Hongxu Zhi, Shengjun Xue, Guofu Zhai und Jian Song. 2014. Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In: <i>Proceedings / ICEC 2014 </i>, hg. von Frank Berger und Verband der Elektrotechnik, Elektronik, Informationstechnik, 158–162. Berlin: VDE-Verlag.","van":"Ren W, Zhi H, Xue S, Zhai G, Song J. Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In: Berger F, Verband der Elektrotechnik, Elektronik, Informationstechnik, editors. Proceedings / ICEC 2014 . Berlin: VDE-Verlag; 2014. p. 158–62.","havard":"W. Ren, H. Zhi, S. Xue, G. Zhai, J. Song, Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts, in: F. Berger, Verband der Elektrotechnik, Elektronik, Informationstechnik (Eds.), Proceedings / ICEC 2014 , VDE-Verlag, Berlin, 2014: pp. 158–162.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Ren, Wanbin</span> ; <span style=\"font-variant:small-caps;\">Zhi, Hongxu</span> ; <span style=\"font-variant:small-caps;\">Xue, Shengjun</span> ; <span style=\"font-variant:small-caps;\">Zhai, Guofu</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span>: Numerical Simulation and experimental verification for Contact Spot Temperature and Electrical Contact Resistance of Rivet contacts. In: <span style=\"font-variant:small-caps;\">Berger, F.</span> ; <span style=\"font-variant:small-caps;\">Verband der Elektrotechnik, Elektronik, Informationstechnik</span> (Hrsg.): <i>Proceedings / ICEC 2014 </i>. Berlin : VDE-Verlag, 2014, S. 158–162"},"status":"public","year":2014,"department":[{"_id":"DEP6012"}],"page":"158 - 162","user_id":"74004","language":[{"iso":"eng"}],"place":"Berlin"}]