---
_id: '7844'
abstract:
- lang: eng
  text: "The CMID (Coated Metal Interconnected Device) technology described here has
    its origins in MID (Moulded Intercon-\r\nnected Device) technology, which in itself
    is based on laser direct structuring (LDS). CMIDs are metallic base bodies \r\ncoated
    with LDS-compatiblepowder, allowing conductor paths to be structured and metallised
    on the coating. The metallic base bodies enable the heat management to be optimised
    and allow power electronic topologies to be implemented in addition to control
    electronics. Furthermore, in the context of 3D electronics, miniaturisation can
    be advanced through the use of unused spaces and housing parts. This is shown
    by manufacturing techniques and demonstrators of motor integrated inverters."
author:
- first_name: Holger
  full_name: Borcherding, Holger
  id: '1693'
  last_name: Borcherding
- first_name: André
  full_name: Springer, André
  id: '71733'
  last_name: Springer
- first_name: Tobias
  full_name: Müller, Tobias
  id: '59014'
  last_name: Müller
- first_name: Patrick
  full_name: Ehlert, Patrick
  id: '62091'
  last_name: Ehlert
- first_name: Andreas
  full_name: Tolksdorf, Andreas
  last_name: Tolksdorf
citation:
  ama: Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. <i>Integration
    of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID)</i>.
    Vol 165. (VDE ETG, ed.). VDE-Verlag; 2022:500-507.
  apa: 'Borcherding, H., Springer, A., Müller, T., Ehlert, P., &#38; Tolksdorf, A.
    (2022). Integration of power electronic circuits using Coated Metal Interconnect
    Devices (CMID). In VDE ETG (Ed.), <i>  ETG-Fb. 165: CIPS 2022 : 12th International
    Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17,
    2022, Berlin, Germany</i> (Vol. 165, pp. 500–507). VDE-Verlag.'
  bjps: '<b>Borcherding H <i>et al.</i></b> (2022) <i>Integration of Power Electronic
    Circuits Using Coated Metal Interconnect Devices (CMID)</i>, VDE ETG (ed.). Berlin:
    VDE-Verlag.'
  chicago: 'Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert, and
    Andreas Tolksdorf. <i>Integration of Power Electronic Circuits Using Coated Metal
    Interconnect Devices (CMID)</i>. Edited by VDE ETG. <i>  ETG-Fb. 165: CIPS 2022 :
    12th International Conference on Integrated Power Electronics Systems, Proceedings,
    March, 15 – 17, 2022, Berlin, Germany</i>. Vol. 165.  ETG-Fachberichte. Berlin:
    VDE-Verlag, 2022.'
  chicago-de: 'Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert
    und Andreas Tolksdorf. 2022. <i>Integration of power electronic circuits using
    Coated Metal Interconnect Devices (CMID)</i>. Hg. von VDE ETG. <i>  ETG-Fb. 165:
    CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems,
    Proceedings, March, 15 – 17, 2022, Berlin, Germany</i>. Bd. 165.  ETG-Fachberichte.
    Berlin: VDE-Verlag.'
  din1505-2-1: '<span style="font-variant:small-caps;">Borcherding, Holger</span>
    ; <span style="font-variant:small-caps;">Springer, André</span> ; <span style="font-variant:small-caps;">Müller,
    Tobias</span> ; <span style="font-variant:small-caps;">Ehlert, Patrick</span>
    ; <span style="font-variant:small-caps;">Tolksdorf, Andreas</span> ; <span style="font-variant:small-caps;">VDE
    ETG</span> (Hrsg.): <i>Integration of power electronic circuits using Coated Metal
    Interconnect Devices (CMID)</i>, <i> ETG-Fachberichte</i>. Bd. 165. Berlin : VDE-Verlag,
    2022'
  havard: H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration
    of power electronic circuits using Coated Metal Interconnect Devices (CMID), VDE-Verlag,
    Berlin, 2022.
  ieee: 'H. Borcherding, A. Springer, T. Müller, P. Ehlert, and A. Tolksdorf, <i>Integration
    of power electronic circuits using Coated Metal Interconnect Devices (CMID)</i>,
    vol. 165. Berlin: VDE-Verlag, 2022, pp. 500–507.'
  mla: 'Borcherding, Holger, et al. “Integration of Power Electronic Circuits Using
    Coated Metal Interconnect Devices (CMID).” <i>  ETG-Fb. 165: CIPS 2022 : 12th
    International Conference on Integrated Power Electronics Systems, Proceedings,
    March, 15 – 17, 2022, Berlin, Germany</i>, edited by VDE ETG, vol. 165, VDE-Verlag,
    2022, pp. 500–07.'
  short: H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration
    of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID), VDE-Verlag,
    Berlin, 2022.
  ufg: '<b>Borcherding, Holger u. a.</b>: Integration of power electronic circuits
    using Coated Metal Interconnect Devices (CMID), Bd. 165, hg. von VDE ETG, Berlin
    2022 ( ETG-Fachberichte).'
  van: 'Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. Integration of
    power electronic circuits using Coated Metal Interconnect Devices (CMID). VDE
    ETG, editor.   ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated
    Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany.
    Berlin: VDE-Verlag; 2022. ( ETG-Fachberichte; vol. 165).'
conference:
  end_date: 2022-03-17
  location: Berlin
  name: 12th Int. Conference on Integrated Power Electronics Systems
  start_date: 2022-03-15
corporate_editor:
- VDE ETG
date_created: 2022-04-29T15:50:44Z
date_updated: 2024-08-08T13:37:57Z
department:
- _id: DEP6020
- _id: DEP7037
- _id: DEP5018
intvolume: '       165'
language:
- iso: eng
main_file_link:
- url: https://content-select.com/goto/62610b94-22cc-42ee-a46f-3c198677ec64/514/language:de
page: 500-507
place: Berlin
publication: "\t ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated
  Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany"
publication_identifier:
  eisbn:
  - 978-3-8007-5758-9
  isbn:
  - 978-3-8007-5757-2
publication_status: published
publisher: VDE-Verlag
quality_controlled: '1'
series_title: ' ETG-Fachberichte'
status: public
title: Integration of power electronic circuits using Coated Metal Interconnect Devices
  (CMID)
type: conference_editor_article
user_id: '83781'
volume: 165
year: '2022'
...