@misc{10403,
  abstract     = {{Due to the increasingly widespread use of efficient power electronics, DC grids today offer more and more advantages over AC grids. Based on comparative measurements, this paper shows that an efficiency increase through DC can be achieved even with little recuperation potential of an existing system. In addition, other advantages such as peak load reduction by -43 %, power quality improvement and reliability are documented.}},
  author       = {{Warkentin, Slavi and Puls, Simon and Riethmüller, Simon and Blank, Frederic and Borcherding, Holger}},
  booktitle    = {{PCIM Europe 2023 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management}},
  isbn         = {{978-3-8007-6091-6}},
  location     = {{Nürnberg}},
  pages        = {{PP167}},
  publisher    = {{VDE Verlag}},
  title        = {{{Measured Advantages of a Production Plant with DC Grid in terms of Energy Efficiency, Peak Power Reduction and Power Quality}}},
  doi          = {{10.30420/566091273}},
  year         = {{2023}},
}

@misc{12007,
  abstract     = {{In this paper a research process to verify thermal management for double-sided cooled SiC-power semiconductors will be discussed. In the context of previous researches a high performance cooling system for these semiconductors was developed. In many cases, prototypes of power semiconductors are used in research projects. This often leads to the fact that only small numbers are available or that they are not available right from the start. Close cooperation with semiconductor manufacturers, like Infineon Technologies AG in this case, within these projects offers the opportunity to get information about the internal structure of the semiconductors and their packages. This information, the use of special PCB manufacturing methods, as well as thermal simulation are used to build up a heat source that mimics the semiconductor including the package and thus gives us the opportunity to verify the performance of our thermal management for high integrated power electronics.}},
  author       = {{Cepin, Simon and Borcherding, Holger}},
  booktitle    = {{PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management}},
  isbn         = {{978-3-8007-6091-6}},
  location     = {{Nürnberg}},
  publisher    = {{VDE}},
  title        = {{{Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors}}},
  doi          = {{10.30420/566091341}},
  year         = {{2023}},
}