[{"keyword":["Electrical and Electronic Engineering","Surfaces","Coatings and Films","Safety","Risk","Reliability and Quality","Condensed Matter Physics","Atomic and Molecular Physics","and Optics","Electronic","Optical and Magnetic Materials"],"abstract":[{"lang":"eng","text":"Lifetime is an important feature defining the reliability of electrical connectors. In general practice, the lifetime tests required for reliability estimation are time and labor intensive. In our previous work, a data driven method using a statistical process, with an application of probability distributions such as standard normal distribution and generalized extreme value (GEV) distribution with negative skewness to predict degradation paths, was introduced for estimation of the lifetime and FIT rate with the help of electrical contact resistance data collected from short term tests. The proposed method proved its significance by showing the possibility of drastic reduction in the lifetime test duration required for reliability determination. In this work, a non-parametric distribution free method using percentiles of actual measured contact resistances is used for determining the lifetime as against the percentiles of probability distribution used in previous work, thereby simplifying the process further and leading to an even more precise estimation. The lifetimes calculated from parametric and non-parametric methods are compared to highlight the significance of distribution free method in reliability estimation."}],"user_id":"83781","year":"2023","department":[{"_id":"DEP6012"}],"status":"public","article_type":"original","date_updated":"2025-06-26T07:51:25Z","doi":"10.1016/j.microrel.2023.115216","external_id":{"isi":["001106942700001"]},"type":"scientific_journal_article","publisher":"Elsevier ","_id":"11348","article_number":"115216","publication":"Microelectronics Reliability","title":"Comparison of different statistical methods for prediction of lifetime of electrical connectors with short term tests","has_accepted_license":"1","intvolume":"       150","author":[{"first_name":"Abhay Rammurti","full_name":"Shukla, Abhay Rammurti","last_name":"Shukla","id":"74188"},{"first_name":"Robert","last_name":"Martin","full_name":"Martin, Robert"},{"full_name":"Probst, Roman","id":"69156","last_name":"Probst","first_name":"Roman"},{"last_name":"Song","id":"5297","full_name":"Song, Jian","first_name":"Jian"}],"isi":"1","publication_identifier":{"issn":["0026-2714"],"unknown":["1872-941X"]},"citation":{"short":"A.R. Shukla, R. Martin, R. Probst, J. Song, Microelectronics Reliability 150 (2023).","apa":"Shukla, A. R., Martin, R., Probst, R., &#38; Song, J. (2023). Comparison of different statistical methods for prediction of lifetime of electrical connectors with short term tests. <i>Microelectronics Reliability</i>, <i>150</i>, Article 115216. <a href=\"https://doi.org/10.1016/j.microrel.2023.115216\">https://doi.org/10.1016/j.microrel.2023.115216</a>","mla":"Shukla, Abhay Rammurti, et al. “Comparison of Different Statistical Methods for Prediction of Lifetime of Electrical Connectors with Short Term Tests.” <i>Microelectronics Reliability</i>, vol. 150, 115216, 2023, <a href=\"https://doi.org/10.1016/j.microrel.2023.115216\">https://doi.org/10.1016/j.microrel.2023.115216</a>.","ufg":"<b>Shukla, Abhay Rammurti u. a.</b>: Comparison of different statistical methods for prediction of lifetime of electrical connectors with short term tests, in: <i>Microelectronics Reliability</i> 150 (2023).","chicago-de":"Shukla, Abhay Rammurti, Robert Martin, Roman Probst und Jian Song. 2023. Comparison of different statistical methods for prediction of lifetime of electrical connectors with short term tests. <i>Microelectronics Reliability</i> 150. doi:<a href=\"https://doi.org/10.1016/j.microrel.2023.115216\">10.1016/j.microrel.2023.115216</a>, .","havard":"A.R. Shukla, R. Martin, R. Probst, J. Song, Comparison of different statistical methods for prediction of lifetime of electrical connectors with short term tests, Microelectronics Reliability. 150 (2023).","bjps":"<b>Shukla AR <i>et al.</i></b> (2023) Comparison of Different Statistical Methods for Prediction of Lifetime of Electrical Connectors with Short Term Tests. <i>Microelectronics Reliability</i> <b>150</b>.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Shukla, Abhay Rammurti</span> ; <span style=\"font-variant:small-caps;\">Martin, Robert</span> ; <span style=\"font-variant:small-caps;\">Probst, Roman</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span>: Comparison of different statistical methods for prediction of lifetime of electrical connectors with short term tests. In: <i>Microelectronics Reliability</i> Bd. 150. Amsterdam, Elsevier  (2023)","chicago":"Shukla, Abhay Rammurti, Robert Martin, Roman Probst, and Jian Song. “Comparison of Different Statistical Methods for Prediction of Lifetime of Electrical Connectors with Short Term Tests.” <i>Microelectronics Reliability</i> 150 (2023). <a href=\"https://doi.org/10.1016/j.microrel.2023.115216\">https://doi.org/10.1016/j.microrel.2023.115216</a>.","ieee":"A. R. Shukla, R. Martin, R. Probst, and J. Song, “Comparison of different statistical methods for prediction of lifetime of electrical connectors with short term tests,” <i>Microelectronics Reliability</i>, vol. 150, Art. no. 115216, 2023, doi: <a href=\"https://doi.org/10.1016/j.microrel.2023.115216\">10.1016/j.microrel.2023.115216</a>.","ama":"Shukla AR, Martin R, Probst R, Song J. Comparison of different statistical methods for prediction of lifetime of electrical connectors with short term tests. <i>Microelectronics Reliability</i>. 2023;150. doi:<a href=\"https://doi.org/10.1016/j.microrel.2023.115216\">10.1016/j.microrel.2023.115216</a>","van":"Shukla AR, Martin R, Probst R, Song J. Comparison of different statistical methods for prediction of lifetime of electrical connectors with short term tests. Microelectronics Reliability. 2023;150."},"place":"Amsterdam","volume":150,"publication_status":"published","language":[{"iso":"eng"}],"date_created":"2024-04-18T08:55:38Z"},{"doi":"https://doi.org/10.1016/j.microrel.2022.114567","date_updated":"2024-08-08T08:45:25Z","article_type":"original","issue":"8","publisher":"Elsevier","type":"scientific_journal_article","abstract":[{"lang":"eng","text":"A new model for the reliability prediction was developed and validated in previous investigations in order to enable the determination of the failure in time (FIT) of electrical connectors from highly accelerated life tests (HALT). The established testing method considers the influence of temperature, thermal cycling and vibration on the failure rates of electrical connectors. Various stress levels, i.e. the combinations of different test parameters, were derived from the ZVEI Technical Guideline TLF 0214 for low voltage automotive connectors. The applied vibrational load was initially defined as a sinusoidal test mode. The aim of this study is to investigate the influence of the vibration test mode on the failure rates. Two commonly used automotive connectors are chosen and subjected to stresses in HALT under two different types of vibrational load. The sinusoidal test mode along with the random vibration test mode are taken into account. The influence of the vibration test modes is subsequently determined by comparing the numbers of failures. Additionally, the principles of determining the coefficient of vibration are discussed and the specific coefficients for the chosen connectors are calculated based on the test results. A guideline, derived from this investigation, to select an appropriate vibration mode and vibration level is provided in order to compare the reliability of different electrical connectors."}],"keyword":["Acceleration factor","Coefficient of vibration","Sine sweep","Random vibration","Failure rate"],"status":"public","department":[{"_id":"DEP6012"}],"user_id":"83781","year":"2022","title":"The influence of the vibration test mode on the failure rate of electrical connectors","has_accepted_license":"1","language":[{"iso":"eng"}],"date_created":"2022-06-14T14:59:08Z","publication_status":"published","volume":135,"place":"Amsterdam","citation":{"chicago":"Krüger, Kevin, Haomiao Yuan, and Jian Song. “The Influence of the Vibration Test Mode on the Failure Rate of Electrical Connectors.” <i>Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service</i> 135, no. 8 (2022). <a href=\"https://doi.org/10.1016/j.microrel.2022.114567\">https://doi.org/10.1016/j.microrel.2022.114567</a>.","bjps":"<b>Krüger K, Yuan H and Song J</b> (2022) The Influence of the Vibration Test Mode on the Failure Rate of Electrical Connectors. <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> <b>135</b>.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Krüger, Kevin</span> ; <span style=\"font-variant:small-caps;\">Yuan, Haomiao</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span>: The influence of the vibration test mode on the failure rate of electrical connectors. In: <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> Bd. 135. Amsterdam, Elsevier (2022), Nr. 8","van":"Krüger K, Yuan H, Song J. The influence of the vibration test mode on the failure rate of electrical connectors. Microelectronics reliability : an internat journal &#38; world abstracting service. 2022;135(8).","ama":"Krüger K, Yuan H, Song J. The influence of the vibration test mode on the failure rate of electrical connectors. <i>Microelectronics reliability : an internat journal &#38; world abstracting service</i>. 2022;135(8). doi:<a href=\"https://doi.org/10.1016/j.microrel.2022.114567\">https://doi.org/10.1016/j.microrel.2022.114567</a>","ieee":"K. Krüger, H. Yuan, and J. Song, “The influence of the vibration test mode on the failure rate of electrical connectors,” <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i>, vol. 135, no. 8, Art. no. 114567, 2022, doi: <a href=\"https://doi.org/10.1016/j.microrel.2022.114567\">https://doi.org/10.1016/j.microrel.2022.114567</a>.","ufg":"<b>Krüger, Kevin/Yuan, Haomiao/Song, Jian</b>: The influence of the vibration test mode on the failure rate of electrical connectors, in: <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> 135 (2022), H. 8.","chicago-de":"Krüger, Kevin, Haomiao Yuan und Jian Song. 2022. The influence of the vibration test mode on the failure rate of electrical connectors. <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> 135, Nr. 8. doi:<a href=\"https://doi.org/10.1016/j.microrel.2022.114567\">https://doi.org/10.1016/j.microrel.2022.114567</a>, .","short":"K. Krüger, H. Yuan, J. Song, Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service 135 (2022).","mla":"Krüger, Kevin, et al. “The Influence of the Vibration Test Mode on the Failure Rate of Electrical Connectors.” <i>Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service</i>, vol. 135, no. 8, 114567, 2022, <a href=\"https://doi.org/10.1016/j.microrel.2022.114567\">https://doi.org/10.1016/j.microrel.2022.114567</a>.","apa":"Krüger, K., Yuan, H., &#38; Song, J. (2022). The influence of the vibration test mode on the failure rate of electrical connectors. <i>Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service</i>, <i>135</i>(8), Article 114567. <a href=\"https://doi.org/10.1016/j.microrel.2022.114567\">https://doi.org/10.1016/j.microrel.2022.114567</a>","havard":"K. Krüger, H. Yuan, J. Song, The influence of the vibration test mode on the failure rate of electrical connectors, Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service. 135 (2022)."},"publication_identifier":{"issn":["0026-2714"]},"ddc":["620"],"author":[{"full_name":"Krüger, Kevin","last_name":"Krüger","id":"76831","first_name":"Kevin"},{"first_name":"Haomiao","full_name":"Yuan, Haomiao","last_name":"Yuan","id":"61860"},{"first_name":"Jian","id":"5297","last_name":"Song","full_name":"Song, Jian"}],"intvolume":"       135","article_number":"114567","_id":"8353","publication":"Microelectronics reliability : an internat. journal & world abstracting service"},{"publisher":"Elsevier","type":"scientific_journal_article","date_updated":"2024-08-05T07:30:51Z","doi":"10.1016/j.microrel.2022.114684","issue":"November 2022","status":"public","year":"2022","user_id":"83781","department":[{"_id":"DEP6012"}],"abstract":[{"lang":"eng","text":"Failure in time (FIT) is an important measure for the reliability of electrical connectors. Due to the very long lifetime of connectors, the tests for the determination of FIT rate are time and labour intensive. In this paper a data driven method using a statistical process to estimate the FIT rate of electrical connectors with data of electrical contact resistance development in short term tests is proposed. The results of prediction are then compared with the results from long term tests. The study shows a strong correlation between contact resistance development in short term tests and the development of the number of failures in later stages of tests. In order to predict the development of degradation precisely, the distribution of resistance data in many different tests with different connectors is investigated. The Generalized Extreme Value Distribution, which reveals an ideal fitting, has been implemented for the prediction of the failure rates of connectors, thereby enabling a remarkable time-lapse of lifetime tests. This method can also be employed in the prognosis and management of system health through the forecast of health of connectors in different systems in operation."}],"keyword":["Electrical connectors","Prediction of lifetime","FIT","Correlation between data in short and long term tests","Time-lapse of lifetime tests"],"citation":{"havard":"J. Song, A.R. Shukla, R. Probst, Prediction of failure in time (FIT) of electrical connectors with short term tests, Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service. 138 (2022).","mla":"Song, Jian, et al. “Prediction of Failure in Time (FIT) of Electrical Connectors with Short Term Tests.” <i>Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service</i>, vol. 138, no. November 2022, 114684, 2022, <a href=\"https://doi.org/10.1016/j.microrel.2022.114684\">https://doi.org/10.1016/j.microrel.2022.114684</a>.","apa":"Song, J., Shukla, A. R., &#38; Probst, R. (2022). Prediction of failure in time (FIT) of electrical connectors with short term tests. <i>Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service</i>, <i>138</i>(November 2022), Article 114684. <a href=\"https://doi.org/10.1016/j.microrel.2022.114684\">https://doi.org/10.1016/j.microrel.2022.114684</a>","short":"J. Song, A.R. Shukla, R. Probst, Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service 138 (2022).","chicago-de":"Song, Jian, Abhay Rammurti Shukla und Roman Probst. 2022. Prediction of failure in time (FIT) of electrical connectors with short term tests. <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> 138, Nr. November 2022. doi:<a href=\"https://doi.org/10.1016/j.microrel.2022.114684\">10.1016/j.microrel.2022.114684</a>, .","ufg":"<b>Song, Jian/Shukla, Abhay Rammurti/Probst, Roman</b>: Prediction of failure in time (FIT) of electrical connectors with short term tests, in: <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> 138 (2022), H. November 2022.","ieee":"J. Song, A. R. Shukla, and R. Probst, “Prediction of failure in time (FIT) of electrical connectors with short term tests,” <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i>, vol. 138, no. November 2022, Art. no. 114684, 2022, doi: <a href=\"https://doi.org/10.1016/j.microrel.2022.114684\">10.1016/j.microrel.2022.114684</a>.","van":"Song J, Shukla AR, Probst R. Prediction of failure in time (FIT) of electrical connectors with short term tests. Microelectronics reliability : an internat journal &#38; world abstracting service. 2022;138(November 2022).","ama":"Song J, Shukla AR, Probst R. Prediction of failure in time (FIT) of electrical connectors with short term tests. <i>Microelectronics reliability : an internat journal &#38; world abstracting service</i>. 2022;138(November 2022). doi:<a href=\"https://doi.org/10.1016/j.microrel.2022.114684\">10.1016/j.microrel.2022.114684</a>","din1505-2-1":"<span style=\"font-variant:small-caps;\">Song, Jian</span> ; <span style=\"font-variant:small-caps;\">Shukla, Abhay Rammurti</span> ; <span style=\"font-variant:small-caps;\">Probst, Roman</span>: Prediction of failure in time (FIT) of electrical connectors with short term tests. In: <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> Bd. 138. Amsterdam, Elsevier (2022), Nr. November 2022","bjps":"<b>Song J, Shukla AR and Probst R</b> (2022) Prediction of Failure in Time (FIT) of Electrical Connectors with Short Term Tests. <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> <b>138</b>.","chicago":"Song, Jian, Abhay Rammurti Shukla, and Roman Probst. “Prediction of Failure in Time (FIT) of Electrical Connectors with Short Term Tests.” <i>Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service</i> 138, no. November 2022 (2022). <a href=\"https://doi.org/10.1016/j.microrel.2022.114684\">https://doi.org/10.1016/j.microrel.2022.114684</a>."},"place":"Amsterdam","publication_status":"published","volume":138,"date_created":"2022-12-11T13:13:46Z","language":[{"iso":"eng"}],"author":[{"first_name":"Jian","last_name":"Song","id":"5297","full_name":"Song, Jian"},{"full_name":"Shukla, Abhay Rammurti","last_name":"Shukla","id":"72757","first_name":"Abhay Rammurti"},{"full_name":"Probst, Roman","last_name":"Probst","id":"69156","first_name":"Roman"}],"intvolume":"       138","publication_identifier":{"issn":["0026-2714"]},"title":"Prediction of failure in time (FIT) of electrical connectors with short term tests","publication":"Microelectronics reliability : an internat. journal & world abstracting service","article_number":"114684","_id":"9206"},{"type":"scientific_journal_article","publisher":"Elsevier","issue":"November 2022","date_updated":"2024-08-05T07:33:56Z","doi":"https://doi.org/10.1016/j.microrel.2022.114633","department":[{"_id":"DEP6012"}],"user_id":"83781","year":"2022","status":"public","keyword":["Electrical connectors","Life test","Thermal cycling","Upper temperature Duration","Temperature difference","Cycling frequency"],"abstract":[{"lang":"eng","text":"A new acceleration model for the reliability prediction of electrical connectors has recently been published. This model enables the evaluation of failure rates gained in highly accelerated life tests (HALT) and considers thermal and vibrational loading. However, since the initial study only covered a small set of test parameters, further study of the model is required. Previous studies have sufficiently investigated the influence of the vibration test mode on the failure rate of electrical connectors. Therefore, this study now focuses on the influence of the thermal cycling test. A commonly used automotive connector is chosen and subjected to stresses in HALT covering various upper temperatures, test durations and thermal cycling frequencies. Additionally, the principles of determining the coefficient of temperature difference and the coefficient of the thermal cycling frequency are presented, since these coefficients are connector specific and required for the acceleration model. Based on the numbers of failures in test, the influence of the various thermal cycling tests is discussed, and the coefficients are calculated for the chosen connector. In conclusion a guideline to select an appropriate upper temperature and test duration in order to compare the reliability of different electrical connectors is provided."}],"publication_identifier":{"issn":["0026-2714"]},"author":[{"first_name":"Kevin","full_name":"Krüger, Kevin","id":"76831","last_name":"Krüger"},{"last_name":"Song","id":"5297","full_name":"Song, Jian","first_name":"Jian"}],"intvolume":"       138","volume":138,"publication_status":"published","date_created":"2022-12-11T13:17:29Z","language":[{"iso":"eng"}],"citation":{"apa":"Krüger, K., &#38; Song, J. (2022). The influence of thermal cycling test parameters on the failure rate of electrical connectors. <i>Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service</i>, <i>138</i>(November 2022), Article 114633. <a href=\"https://doi.org/10.1016/j.microrel.2022.114633\">https://doi.org/10.1016/j.microrel.2022.114633</a>","mla":"Krüger, Kevin, and Jian Song. “The Influence of Thermal Cycling Test Parameters on the Failure Rate of Electrical Connectors.” <i>Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service</i>, vol. 138, no. November 2022, 114633, 2022, <a href=\"https://doi.org/10.1016/j.microrel.2022.114633\">https://doi.org/10.1016/j.microrel.2022.114633</a>.","short":"K. Krüger, J. Song, Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service 138 (2022).","chicago-de":"Krüger, Kevin und Jian Song. 2022. The influence of thermal cycling test parameters on the failure rate of electrical connectors. <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> 138, Nr. November 2022. doi:<a href=\"https://doi.org/10.1016/j.microrel.2022.114633\">https://doi.org/10.1016/j.microrel.2022.114633</a>, .","ufg":"<b>Krüger, Kevin/Song, Jian</b>: The influence of thermal cycling test parameters on the failure rate of electrical connectors, in: <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> 138 (2022), H. November 2022.","havard":"K. Krüger, J. Song, The influence of thermal cycling test parameters on the failure rate of electrical connectors, Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service. 138 (2022).","din1505-2-1":"<span style=\"font-variant:small-caps;\">Krüger, Kevin</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span>: The influence of thermal cycling test parameters on the failure rate of electrical connectors. In: <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> Bd. 138. Amsterdam, Elsevier (2022), Nr. November 2022","bjps":"<b>Krüger K and Song J</b> (2022) The Influence of Thermal Cycling Test Parameters on the Failure Rate of Electrical Connectors. <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i> <b>138</b>.","chicago":"Krüger, Kevin, and Jian Song. “The Influence of Thermal Cycling Test Parameters on the Failure Rate of Electrical Connectors.” <i>Microelectronics Reliability : An Internat. Journal &#38; World Abstracting Service</i> 138, no. November 2022 (2022). <a href=\"https://doi.org/10.1016/j.microrel.2022.114633\">https://doi.org/10.1016/j.microrel.2022.114633</a>.","ieee":"K. Krüger and J. Song, “The influence of thermal cycling test parameters on the failure rate of electrical connectors,” <i>Microelectronics reliability : an internat. journal &#38; world abstracting service</i>, vol. 138, no. November 2022, Art. no. 114633, 2022, doi: <a href=\"https://doi.org/10.1016/j.microrel.2022.114633\">https://doi.org/10.1016/j.microrel.2022.114633</a>.","van":"Krüger K, Song J. The influence of thermal cycling test parameters on the failure rate of electrical connectors. Microelectronics reliability : an internat journal &#38; world abstracting service. 2022;138(November 2022).","ama":"Krüger K, Song J. The influence of thermal cycling test parameters on the failure rate of electrical connectors. <i>Microelectronics reliability : an internat journal &#38; world abstracting service</i>. 2022;138(November 2022). doi:<a href=\"https://doi.org/10.1016/j.microrel.2022.114633\">https://doi.org/10.1016/j.microrel.2022.114633</a>"},"place":"Amsterdam","title":"The influence of thermal cycling test parameters on the failure rate of electrical connectors","publication":"Microelectronics reliability : an internat. journal & world abstracting service","_id":"9207","article_number":"114633"}]