---
_id: '11348'
abstract:
- lang: eng
text: Lifetime is an important feature defining the reliability of electrical connectors.
In general practice, the lifetime tests required for reliability estimation are
time and labor intensive. In our previous work, a data driven method using a statistical
process, with an application of probability distributions such as standard normal
distribution and generalized extreme value (GEV) distribution with negative skewness
to predict degradation paths, was introduced for estimation of the lifetime and
FIT rate with the help of electrical contact resistance data collected from short
term tests. The proposed method proved its significance by showing the possibility
of drastic reduction in the lifetime test duration required for reliability determination.
In this work, a non-parametric distribution free method using percentiles of actual
measured contact resistances is used for determining the lifetime as against the
percentiles of probability distribution used in previous work, thereby simplifying
the process further and leading to an even more precise estimation. The lifetimes
calculated from parametric and non-parametric methods are compared to highlight
the significance of distribution free method in reliability estimation.
article_number: '115216'
article_type: original
author:
- first_name: Abhay Rammurti
full_name: Shukla, Abhay Rammurti
id: '74188'
last_name: Shukla
- first_name: Robert
full_name: Martin, Robert
last_name: Martin
- first_name: Roman
full_name: Probst, Roman
id: '69156'
last_name: Probst
- first_name: Jian
full_name: Song, Jian
id: '5297'
last_name: Song
citation:
ama: Shukla AR, Martin R, Probst R, Song J. Comparison of different statistical
methods for prediction of lifetime of electrical connectors with short term tests.
Microelectronics Reliability. 2023;150. doi:10.1016/j.microrel.2023.115216
apa: Shukla, A. R., Martin, R., Probst, R., & Song, J. (2023). Comparison of
different statistical methods for prediction of lifetime of electrical connectors
with short term tests. Microelectronics Reliability, 150, Article
115216. https://doi.org/10.1016/j.microrel.2023.115216
bjps: Shukla AR et al. (2023) Comparison of Different Statistical
Methods for Prediction of Lifetime of Electrical Connectors with Short Term Tests.
Microelectronics Reliability 150.
chicago: Shukla, Abhay Rammurti, Robert Martin, Roman Probst, and Jian Song. “Comparison
of Different Statistical Methods for Prediction of Lifetime of Electrical Connectors
with Short Term Tests.” Microelectronics Reliability 150 (2023). https://doi.org/10.1016/j.microrel.2023.115216.
chicago-de: Shukla, Abhay Rammurti, Robert Martin, Roman Probst und Jian Song. 2023.
Comparison of different statistical methods for prediction of lifetime of electrical
connectors with short term tests. Microelectronics Reliability 150. doi:10.1016/j.microrel.2023.115216,
.
din1505-2-1: 'Shukla, Abhay Rammurti
; Martin, Robert ; Probst,
Roman ; Song, Jian: Comparison
of different statistical methods for prediction of lifetime of electrical connectors
with short term tests. In: Microelectronics Reliability Bd. 150. Amsterdam,
Elsevier (2023)'
havard: A.R. Shukla, R. Martin, R. Probst, J. Song, Comparison of different statistical
methods for prediction of lifetime of electrical connectors with short term tests,
Microelectronics Reliability. 150 (2023).
ieee: 'A. R. Shukla, R. Martin, R. Probst, and J. Song, “Comparison of different
statistical methods for prediction of lifetime of electrical connectors with short
term tests,” Microelectronics Reliability, vol. 150, Art. no. 115216, 2023,
doi: 10.1016/j.microrel.2023.115216.'
mla: Shukla, Abhay Rammurti, et al. “Comparison of Different Statistical Methods
for Prediction of Lifetime of Electrical Connectors with Short Term Tests.” Microelectronics
Reliability, vol. 150, 115216, 2023, https://doi.org/10.1016/j.microrel.2023.115216.
short: A.R. Shukla, R. Martin, R. Probst, J. Song, Microelectronics Reliability
150 (2023).
ufg: 'Shukla, Abhay Rammurti u. a.: Comparison of different statistical methods
for prediction of lifetime of electrical connectors with short term tests, in:
Microelectronics Reliability 150 (2023).'
van: Shukla AR, Martin R, Probst R, Song J. Comparison of different statistical
methods for prediction of lifetime of electrical connectors with short term tests.
Microelectronics Reliability. 2023;150.
date_created: 2024-04-18T08:55:38Z
date_updated: 2025-06-26T07:51:25Z
department:
- _id: DEP6012
doi: 10.1016/j.microrel.2023.115216
external_id:
isi:
- '001106942700001'
has_accepted_license: '1'
intvolume: ' 150'
isi: '1'
keyword:
- Electrical and Electronic Engineering
- Surfaces
- Coatings and Films
- Safety
- Risk
- Reliability and Quality
- Condensed Matter Physics
- Atomic and Molecular Physics
- and Optics
- Electronic
- Optical and Magnetic Materials
language:
- iso: eng
place: Amsterdam
publication: Microelectronics Reliability
publication_identifier:
issn:
- 0026-2714
unknown:
- 1872-941X
publication_status: published
publisher: 'Elsevier '
status: public
title: Comparison of different statistical methods for prediction of lifetime of electrical
connectors with short term tests
type: scientific_journal_article
user_id: '83781'
volume: 150
year: '2023'
...
---
_id: '8353'
abstract:
- lang: eng
text: A new model for the reliability prediction was developed and validated in
previous investigations in order to enable the determination of the failure in
time (FIT) of electrical connectors from highly accelerated life tests (HALT).
The established testing method considers the influence of temperature, thermal
cycling and vibration on the failure rates of electrical connectors. Various stress
levels, i.e. the combinations of different test parameters, were derived from
the ZVEI Technical Guideline TLF 0214 for low voltage automotive connectors. The
applied vibrational load was initially defined as a sinusoidal test mode. The
aim of this study is to investigate the influence of the vibration test mode on
the failure rates. Two commonly used automotive connectors are chosen and subjected
to stresses in HALT under two different types of vibrational load. The sinusoidal
test mode along with the random vibration test mode are taken into account. The
influence of the vibration test modes is subsequently determined by comparing
the numbers of failures. Additionally, the principles of determining the coefficient
of vibration are discussed and the specific coefficients for the chosen connectors
are calculated based on the test results. A guideline, derived from this investigation,
to select an appropriate vibration mode and vibration level is provided in order
to compare the reliability of different electrical connectors.
article_number: '114567'
article_type: original
author:
- first_name: Kevin
full_name: Krüger, Kevin
id: '76831'
last_name: Krüger
- first_name: Haomiao
full_name: Yuan, Haomiao
id: '61860'
last_name: Yuan
- first_name: Jian
full_name: Song, Jian
id: '5297'
last_name: Song
citation:
ama: 'Krüger K, Yuan H, Song J. The influence of the vibration test mode on the
failure rate of electrical connectors. Microelectronics reliability : an internat
journal & world abstracting service. 2022;135(8). doi:https://doi.org/10.1016/j.microrel.2022.114567'
apa: 'Krüger, K., Yuan, H., & Song, J. (2022). The influence of the vibration
test mode on the failure rate of electrical connectors. Microelectronics Reliability :
An Internat. Journal & World Abstracting Service, 135(8), Article
114567. https://doi.org/10.1016/j.microrel.2022.114567'
bjps: 'Krüger K, Yuan H and Song J (2022) The Influence of the Vibration
Test Mode on the Failure Rate of Electrical Connectors. Microelectronics reliability :
an internat. journal & world abstracting service 135.'
chicago: 'Krüger, Kevin, Haomiao Yuan, and Jian Song. “The Influence of the Vibration
Test Mode on the Failure Rate of Electrical Connectors.” Microelectronics Reliability :
An Internat. Journal & World Abstracting Service 135, no. 8 (2022). https://doi.org/10.1016/j.microrel.2022.114567.'
chicago-de: 'Krüger, Kevin, Haomiao Yuan und Jian Song. 2022. The influence of the
vibration test mode on the failure rate of electrical connectors. Microelectronics
reliability : an internat. journal & world abstracting service 135, Nr.
8. doi:https://doi.org/10.1016/j.microrel.2022.114567,
.'
din1505-2-1: 'Krüger, Kevin ; Yuan, Haomiao ; Song,
Jian: The influence of the vibration test mode on the failure rate of electrical
connectors. In: Microelectronics reliability : an internat. journal & world
abstracting service Bd. 135. Amsterdam, Elsevier (2022), Nr. 8'
havard: 'K. Krüger, H. Yuan, J. Song, The influence of the vibration test mode on
the failure rate of electrical connectors, Microelectronics Reliability : An Internat.
Journal & World Abstracting Service. 135 (2022).'
ieee: 'K. Krüger, H. Yuan, and J. Song, “The influence of the vibration test mode
on the failure rate of electrical connectors,” Microelectronics reliability :
an internat. journal & world abstracting service, vol. 135, no. 8, Art.
no. 114567, 2022, doi: https://doi.org/10.1016/j.microrel.2022.114567.'
mla: 'Krüger, Kevin, et al. “The Influence of the Vibration Test Mode on the Failure
Rate of Electrical Connectors.” Microelectronics Reliability : An Internat.
Journal & World Abstracting Service, vol. 135, no. 8, 114567, 2022, https://doi.org/10.1016/j.microrel.2022.114567.'
short: 'K. Krüger, H. Yuan, J. Song, Microelectronics Reliability : An Internat.
Journal & World Abstracting Service 135 (2022).'
ufg: 'Krüger, Kevin/Yuan, Haomiao/Song, Jian: The influence of the vibration
test mode on the failure rate of electrical connectors, in: Microelectronics
reliability : an internat. journal & world abstracting service 135 (2022),
H. 8.'
van: 'Krüger K, Yuan H, Song J. The influence of the vibration test mode on the
failure rate of electrical connectors. Microelectronics reliability : an internat
journal & world abstracting service. 2022;135(8).'
date_created: 2022-06-14T14:59:08Z
date_updated: 2024-08-08T08:45:25Z
ddc:
- '620'
department:
- _id: DEP6012
doi: https://doi.org/10.1016/j.microrel.2022.114567
has_accepted_license: '1'
intvolume: ' 135'
issue: '8'
keyword:
- Acceleration factor
- Coefficient of vibration
- Sine sweep
- Random vibration
- Failure rate
language:
- iso: eng
place: Amsterdam
publication: 'Microelectronics reliability : an internat. journal & world abstracting
service'
publication_identifier:
issn:
- 0026-2714
publication_status: published
publisher: Elsevier
status: public
title: The influence of the vibration test mode on the failure rate of electrical
connectors
type: scientific_journal_article
user_id: '83781'
volume: 135
year: '2022'
...
---
_id: '9206'
abstract:
- lang: eng
text: Failure in time (FIT) is an important measure for the reliability of electrical
connectors. Due to the very long lifetime of connectors, the tests for the determination
of FIT rate are time and labour intensive. In this paper a data driven method
using a statistical process to estimate the FIT rate of electrical connectors
with data of electrical contact resistance development in short term tests is
proposed. The results of prediction are then compared with the results from long
term tests. The study shows a strong correlation between contact resistance development
in short term tests and the development of the number of failures in later stages
of tests. In order to predict the development of degradation precisely, the distribution
of resistance data in many different tests with different connectors is investigated.
The Generalized Extreme Value Distribution, which reveals an ideal fitting, has
been implemented for the prediction of the failure rates of connectors, thereby
enabling a remarkable time-lapse of lifetime tests. This method can also be employed
in the prognosis and management of system health through the forecast of health
of connectors in different systems in operation.
article_number: '114684'
author:
- first_name: Jian
full_name: Song, Jian
id: '5297'
last_name: Song
- first_name: Abhay Rammurti
full_name: Shukla, Abhay Rammurti
id: '72757'
last_name: Shukla
- first_name: Roman
full_name: Probst, Roman
id: '69156'
last_name: Probst
citation:
ama: 'Song J, Shukla AR, Probst R. Prediction of failure in time (FIT) of electrical
connectors with short term tests. Microelectronics reliability : an internat
journal & world abstracting service. 2022;138(November 2022). doi:10.1016/j.microrel.2022.114684'
apa: 'Song, J., Shukla, A. R., & Probst, R. (2022). Prediction of failure in
time (FIT) of electrical connectors with short term tests. Microelectronics
Reliability : An Internat. Journal & World Abstracting Service, 138(November
2022), Article 114684. https://doi.org/10.1016/j.microrel.2022.114684'
bjps: 'Song J, Shukla AR and Probst R (2022) Prediction of Failure in Time
(FIT) of Electrical Connectors with Short Term Tests. Microelectronics reliability :
an internat. journal & world abstracting service 138.'
chicago: 'Song, Jian, Abhay Rammurti Shukla, and Roman Probst. “Prediction of Failure
in Time (FIT) of Electrical Connectors with Short Term Tests.” Microelectronics
Reliability : An Internat. Journal & World Abstracting Service 138, no.
November 2022 (2022). https://doi.org/10.1016/j.microrel.2022.114684.'
chicago-de: 'Song, Jian, Abhay Rammurti Shukla und Roman Probst. 2022. Prediction
of failure in time (FIT) of electrical connectors with short term tests. Microelectronics
reliability : an internat. journal & world abstracting service 138, Nr.
November 2022. doi:10.1016/j.microrel.2022.114684,
.'
din1505-2-1: 'Song, Jian ; Shukla,
Abhay Rammurti ; Probst, Roman:
Prediction of failure in time (FIT) of electrical connectors with short term tests.
In: Microelectronics reliability : an internat. journal & world abstracting
service Bd. 138. Amsterdam, Elsevier (2022), Nr. November 2022'
havard: 'J. Song, A.R. Shukla, R. Probst, Prediction of failure in time (FIT) of
electrical connectors with short term tests, Microelectronics Reliability : An
Internat. Journal & World Abstracting Service. 138 (2022).'
ieee: 'J. Song, A. R. Shukla, and R. Probst, “Prediction of failure in time (FIT)
of electrical connectors with short term tests,” Microelectronics reliability :
an internat. journal & world abstracting service, vol. 138, no. November
2022, Art. no. 114684, 2022, doi: 10.1016/j.microrel.2022.114684.'
mla: 'Song, Jian, et al. “Prediction of Failure in Time (FIT) of Electrical Connectors
with Short Term Tests.” Microelectronics Reliability : An Internat. Journal
& World Abstracting Service, vol. 138, no. November 2022, 114684, 2022,
https://doi.org/10.1016/j.microrel.2022.114684.'
short: 'J. Song, A.R. Shukla, R. Probst, Microelectronics Reliability : An Internat.
Journal & World Abstracting Service 138 (2022).'
ufg: 'Song, Jian/Shukla, Abhay Rammurti/Probst, Roman: Prediction of failure
in time (FIT) of electrical connectors with short term tests, in: Microelectronics
reliability : an internat. journal & world abstracting service 138 (2022),
H. November 2022.'
van: 'Song J, Shukla AR, Probst R. Prediction of failure in time (FIT) of electrical
connectors with short term tests. Microelectronics reliability : an internat journal
& world abstracting service. 2022;138(November 2022).'
date_created: 2022-12-11T13:13:46Z
date_updated: 2024-08-05T07:30:51Z
department:
- _id: DEP6012
doi: 10.1016/j.microrel.2022.114684
intvolume: ' 138'
issue: November 2022
keyword:
- Electrical connectors
- Prediction of lifetime
- FIT
- Correlation between data in short and long term tests
- Time-lapse of lifetime tests
language:
- iso: eng
place: Amsterdam
publication: 'Microelectronics reliability : an internat. journal & world abstracting
service'
publication_identifier:
issn:
- 0026-2714
publication_status: published
publisher: Elsevier
status: public
title: Prediction of failure in time (FIT) of electrical connectors with short term
tests
type: scientific_journal_article
user_id: '83781'
volume: 138
year: '2022'
...
---
_id: '9207'
abstract:
- lang: eng
text: A new acceleration model for the reliability prediction of electrical connectors
has recently been published. This model enables the evaluation of failure rates
gained in highly accelerated life tests (HALT) and considers thermal and vibrational
loading. However, since the initial study only covered a small set of test parameters,
further study of the model is required. Previous studies have sufficiently investigated
the influence of the vibration test mode on the failure rate of electrical connectors.
Therefore, this study now focuses on the influence of the thermal cycling test.
A commonly used automotive connector is chosen and subjected to stresses in HALT
covering various upper temperatures, test durations and thermal cycling frequencies.
Additionally, the principles of determining the coefficient of temperature difference
and the coefficient of the thermal cycling frequency are presented, since these
coefficients are connector specific and required for the acceleration model. Based
on the numbers of failures in test, the influence of the various thermal cycling
tests is discussed, and the coefficients are calculated for the chosen connector.
In conclusion a guideline to select an appropriate upper temperature and test
duration in order to compare the reliability of different electrical connectors
is provided.
article_number: '114633'
author:
- first_name: Kevin
full_name: Krüger, Kevin
id: '76831'
last_name: Krüger
- first_name: Jian
full_name: Song, Jian
id: '5297'
last_name: Song
citation:
ama: 'Krüger K, Song J. The influence of thermal cycling test parameters on the
failure rate of electrical connectors. Microelectronics reliability : an internat
journal & world abstracting service. 2022;138(November 2022). doi:https://doi.org/10.1016/j.microrel.2022.114633'
apa: 'Krüger, K., & Song, J. (2022). The influence of thermal cycling test parameters
on the failure rate of electrical connectors. Microelectronics Reliability :
An Internat. Journal & World Abstracting Service, 138(November
2022), Article 114633. https://doi.org/10.1016/j.microrel.2022.114633'
bjps: 'Krüger K and Song J (2022) The Influence of Thermal Cycling Test Parameters
on the Failure Rate of Electrical Connectors. Microelectronics reliability :
an internat. journal & world abstracting service 138.'
chicago: 'Krüger, Kevin, and Jian Song. “The Influence of Thermal Cycling Test Parameters
on the Failure Rate of Electrical Connectors.” Microelectronics Reliability :
An Internat. Journal & World Abstracting Service 138, no. November 2022
(2022). https://doi.org/10.1016/j.microrel.2022.114633.'
chicago-de: 'Krüger, Kevin und Jian Song. 2022. The influence of thermal cycling
test parameters on the failure rate of electrical connectors. Microelectronics
reliability : an internat. journal & world abstracting service 138, Nr.
November 2022. doi:https://doi.org/10.1016/j.microrel.2022.114633,
.'
din1505-2-1: 'Krüger, Kevin ; Song, Jian: The influence of thermal cycling
test parameters on the failure rate of electrical connectors. In: Microelectronics
reliability : an internat. journal & world abstracting service Bd. 138.
Amsterdam, Elsevier (2022), Nr. November 2022'
havard: 'K. Krüger, J. Song, The influence of thermal cycling test parameters on
the failure rate of electrical connectors, Microelectronics Reliability : An Internat.
Journal & World Abstracting Service. 138 (2022).'
ieee: 'K. Krüger and J. Song, “The influence of thermal cycling test parameters
on the failure rate of electrical connectors,” Microelectronics reliability :
an internat. journal & world abstracting service, vol. 138, no. November
2022, Art. no. 114633, 2022, doi: https://doi.org/10.1016/j.microrel.2022.114633.'
mla: 'Krüger, Kevin, and Jian Song. “The Influence of Thermal Cycling Test Parameters
on the Failure Rate of Electrical Connectors.” Microelectronics Reliability :
An Internat. Journal & World Abstracting Service, vol. 138, no. November
2022, 114633, 2022, https://doi.org/10.1016/j.microrel.2022.114633.'
short: 'K. Krüger, J. Song, Microelectronics Reliability : An Internat. Journal
& World Abstracting Service 138 (2022).'
ufg: 'Krüger, Kevin/Song, Jian: The influence of thermal cycling test parameters
on the failure rate of electrical connectors, in: Microelectronics reliability :
an internat. journal & world abstracting service 138 (2022), H. November
2022.'
van: 'Krüger K, Song J. The influence of thermal cycling test parameters on the
failure rate of electrical connectors. Microelectronics reliability : an internat
journal & world abstracting service. 2022;138(November 2022).'
date_created: 2022-12-11T13:17:29Z
date_updated: 2024-08-05T07:33:56Z
department:
- _id: DEP6012
doi: https://doi.org/10.1016/j.microrel.2022.114633
intvolume: ' 138'
issue: November 2022
keyword:
- Electrical connectors
- Life test
- Thermal cycling
- Upper temperature Duration
- Temperature difference
- Cycling frequency
language:
- iso: eng
place: Amsterdam
publication: 'Microelectronics reliability : an internat. journal & world abstracting
service'
publication_identifier:
issn:
- 0026-2714
publication_status: published
publisher: Elsevier
status: public
title: The influence of thermal cycling test parameters on the failure rate of electrical
connectors
type: scientific_journal_article
user_id: '83781'
volume: 138
year: '2022'
...