[{"title":"Additively-Manufactured Terahertz Waveguides","citation":{"ieee":"S. Joshi, A. Starsaja, A. N. Shrotri, O. Stübbe, and S. Preu, Additively-Manufactured Terahertz Waveguides. Piscataway, NJ: IEEE, 2026. doi: 10.1109/irmmw-thz61557.2025.11320095.","ama":"Joshi S, Starsaja A, Shrotri AN, Stübbe O, Preu S. Additively-Manufactured Terahertz Waveguides. IEEE; 2026. doi:10.1109/irmmw-thz61557.2025.11320095","chicago":"Joshi, Suraj, Annamarija Starsaja, Abhijeet Narendra Shrotri, Oliver Stübbe, and Sascha Preu. Additively-Manufactured Terahertz Waveguides. 2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). Piscataway, NJ: IEEE, 2026. https://doi.org/10.1109/irmmw-thz61557.2025.11320095.","apa":"Joshi, S., Starsaja, A., Shrotri, A. N., Stübbe, O., & Preu, S. (2026). Additively-Manufactured Terahertz Waveguides. In 2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), Helsinki, Finland . IEEE. https://doi.org/10.1109/irmmw-thz61557.2025.11320095","ufg":"Joshi, Suraj u. a.: Additively-Manufactured Terahertz Waveguides, Piscataway, NJ 2026.","havard":"S. Joshi, A. Starsaja, A.N. Shrotri, O. Stübbe, S. Preu, Additively-Manufactured Terahertz Waveguides, IEEE, Piscataway, NJ, 2026.","mla":"Joshi, Suraj, et al. “Additively-Manufactured Terahertz Waveguides.” 2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), IEEE, 2026, https://doi.org/10.1109/irmmw-thz61557.2025.11320095.","bjps":"Joshi S et al. (2026) Additively-Manufactured Terahertz Waveguides. Piscataway, NJ: IEEE.","van":"Joshi S, Starsaja A, Shrotri AN, Stübbe O, Preu S. Additively-Manufactured Terahertz Waveguides. 2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). Piscataway, NJ: IEEE; 2026.","din1505-2-1":"Joshi, Suraj ; Starsaja, Annamarija ; Shrotri, Abhijeet Narendra ; Stübbe, Oliver ; Preu, Sascha: Additively-Manufactured Terahertz Waveguides. Piscataway, NJ : IEEE, 2026","chicago-de":"Joshi, Suraj, Annamarija Starsaja, Abhijeet Narendra Shrotri, Oliver Stübbe und Sascha Preu. 2026. Additively-Manufactured Terahertz Waveguides. 2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). Piscataway, NJ: IEEE. doi:10.1109/irmmw-thz61557.2025.11320095, .","short":"S. Joshi, A. Starsaja, A.N. Shrotri, O. Stübbe, S. Preu, Additively-Manufactured Terahertz Waveguides, IEEE, Piscataway, NJ, 2026."},"publication_status":"published","abstract":[{"lang":"eng","text":"Additive manufacturing (AM) paves the way for low-cost production of optical and terahertz (THz) components such as waveguides, fibers, and lenses [1]–[3]. This work addresses the fabrication and THz characterization of a 3D-printed waveguide composed of cyclic olefin copolymer (TOPAS). Such a waveguide is a convenient and inexpensive tool in the development of THz interconnects, and in applications such as biomedical sensing."}],"year":"2026","author":[{"full_name":"Joshi, Suraj","first_name":"Suraj","last_name":"Joshi"},{"last_name":"Starsaja","full_name":"Starsaja, Annamarija","first_name":"Annamarija"},{"first_name":"Abhijeet Narendra","id":"74090","full_name":"Shrotri, Abhijeet Narendra","last_name":"Shrotri","orcid":"0000-0003-2116-156X"},{"last_name":"Stübbe","full_name":"Stübbe, Oliver","id":"51864","first_name":"Oliver","orcid":"0000-0001-7293-6893"},{"first_name":"Sascha","last_name":"Preu","full_name":"Preu, Sascha"}],"conference":{"start_date":"2025-08-17","end_date":"2025-08-22","location":"Helsinki, Finland ","name":"50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)"},"department":[{"_id":"DEP5020"},{"_id":"DEP6020"}],"publisher":"IEEE","status":"public","publication":"2025 50th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)","date_created":"2026-01-16T14:49:35Z","type":"conference_editor_article","user_id":"83781","date_updated":"2026-01-21T07:34:28Z","_id":"13339","doi":"10.1109/irmmw-thz61557.2025.11320095","place":"Piscataway, NJ","keyword":["Optical fibers","Optical fiber sensors","Optical interconnections","Biomedical optical imaging","Optical device fabrication","Production","Optical waveguide components","Three-dimensional printing","Optical waveguides","Lenses"],"language":[{"iso":"eng"}]},{"article_number":"3520","doi":"10.3390/s24113520","_id":"11495","type":"scientific_journal_article","user_id":"83781","intvolume":" 24","department":[{"_id":"DEP4028"}],"abstract":[{"lang":"eng","text":"To evaluate the suitability of an analytical instrument, essential figures of merit such as the limit of detection (LOD) and the limit of quantification (LOQ) can be employed. However, as the definitions k nown in the literature are mostly applicable to one signal per sample, estimating the LOD for substances with instruments yielding multidimensional results like electronic noses (eNoses) is still challenging. In this paper, we will compare and present different approaches to estimate the LOD for eNoses by employing commonly used multivariate data analysis and regression techniques, including principal component analysis (PCA), principal component regression (PCR), as well as partial least squares regression (PLSR). These methods could subsequently be used to assess the suitability of eNoses to help control and steer processes where volatiles are key process parameters. As a use case, we determined the LODs for key compounds involved in beer maturation, namely acetaldehyde, diacetyl, dimethyl sulfide, ethyl acetate, isobutanol, and 2-phenylethanol, and discussed the suitability of our eNose for that dertermination process. The results of the methods performed demonstrated differences of up to a factor of eight. For diacetyl, the LOD and the LOQ were sufficiently low to suggest potential for monitoring via eNose. "}],"issue":"11","quality_controlled":"1","publisher":"MDPI","isi":"1","article_type":"original","publication_status":"published","oa":"1","language":[{"iso":"eng"}],"keyword":["multidimensional sensor arrays","MOS sensors","beer fermentation","process control","gas analysis","metal oxide semiconductors","intentional data analysis","chemometrics","PLSR","PCA","first-order calibration"],"date_created":"2024-06-03T07:43:48Z","publication":"Sensors","publication_identifier":{"issn":["1424-8220 "]},"date_updated":"2025-06-25T13:00:14Z","author":[{"first_name":"Julia","full_name":"Kruse, Julia","id":"82298","last_name":"Kruse"},{"last_name":"Wörner","full_name":"Wörner, Julius","first_name":"Julius","id":"79011"},{"last_name":"Schneider","first_name":"Jan","full_name":"Schneider, Jan","id":"13209","orcid":"0000-0001-6401-8873"},{"last_name":"Dörksen","first_name":"Helene","full_name":"Dörksen, Helene","id":"46416"},{"first_name":"Miriam","id":"64952","last_name":"Pein-Hackelbusch","full_name":"Pein-Hackelbusch, Miriam","orcid":"0000-0002-7920-0595"}],"main_file_link":[{"open_access":"1","url":"https://www.mdpi.com/1424-8220/24/11/3520"}],"year":"2024","external_id":{"isi":["001245424000001"],"pmid":["38894312"]},"pmid":"1","status":"public","title":"Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses ","citation":{"short":"J. Kruse, J. Wörner, J. Schneider, H. Dörksen, M. Pein-Hackelbusch, Sensors 24 (2024).","din1505-2-1":"Kruse, Julia ; Wörner, Julius ; Schneider, Jan ; Dörksen, Helene ; Pein-Hackelbusch, Miriam: Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses . In: Sensors Bd. 24, MDPI (2024), Nr. 11","chicago-de":"Kruse, Julia, Julius Wörner, Jan Schneider, Helene Dörksen und Miriam Pein-Hackelbusch. 2024. Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses . Sensors 24, Nr. 11. doi:10.3390/s24113520, .","apa":"Kruse, J., Wörner, J., Schneider, J., Dörksen, H., & Pein-Hackelbusch, M. (2024). Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses . Sensors, 24(11), Article 3520. https://doi.org/10.3390/s24113520","chicago":"Kruse, Julia, Julius Wörner, Jan Schneider, Helene Dörksen, and Miriam Pein-Hackelbusch. “Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses .” Sensors 24, no. 11 (2024). https://doi.org/10.3390/s24113520.","van":"Kruse J, Wörner J, Schneider J, Dörksen H, Pein-Hackelbusch M. Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses . Sensors. 2024;24(11).","havard":"J. Kruse, J. Wörner, J. Schneider, H. Dörksen, M. Pein-Hackelbusch, Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses , Sensors. 24 (2024).","mla":"Kruse, Julia, et al. “Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses .” Sensors, vol. 24, no. 11, 3520, 2024, https://doi.org/10.3390/s24113520.","bjps":"Kruse J et al. (2024) Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses . Sensors 24.","ufg":"Kruse, Julia u. a.: Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses , in: Sensors 24 (2024), H. 11.","ieee":"J. Kruse, J. Wörner, J. Schneider, H. Dörksen, and M. Pein-Hackelbusch, “Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses ,” Sensors, vol. 24, no. 11, Art. no. 3520, 2024, doi: 10.3390/s24113520.","ama":"Kruse J, Wörner J, Schneider J, Dörksen H, Pein-Hackelbusch M. Methods for Estimating the Detection and Quantification Limits of Key Substances in Beer Maturation with Electronic Noses . Sensors. 2024;24(11). doi:10.3390/s24113520"},"volume":24},{"doi":"10.1109/irmmw-thz60956.2024.10697740","_id":"11977","place":"Piscataway, NJ","intvolume":" 2024","user_id":"83781","type":"conference_editor_article","publisher":"IEEE","abstract":[{"lang":"eng","text":"Additive manufacturing of lenses offers quick prototyping and characterization. This paper explains the additive manufacturing and characterization of axicon lenses using TOPAS material for Terahertz sensing applications. The beam patterns of additively manufactured axicon lens prototypes are characterized around 0.3 THz with silicon-based THz-camera to evaluate the depth of focus."}],"conference":{"end_date":"2024-09-06","start_date":"2024-09-01","name":"49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)","location":"Perth, Australia "},"department":[{"_id":"DEP5020"},{"_id":"DEP6020"}],"publication_status":"published","series_title":"International Conference on Infrared, Millimeter, and Terahertz Waves","language":[{"iso":"eng"}],"keyword":["Additives","Prototypes","Three-dimensional printing","Sensors","Lenses"],"date_updated":"2024-10-08T11:47:36Z","date_created":"2024-10-08T08:11:34Z","publication":"2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)","publication_identifier":{"eissn":["2162-2035"]},"status":"public","year":"2024","author":[{"orcid":"0000-0003-2116-156X","last_name":"Shrotri","first_name":"Abhijeet Narendra","full_name":"Shrotri, Abhijeet Narendra","id":"74090"},{"first_name":"Benedikt","full_name":"Krause, Benedikt","last_name":"Krause"},{"orcid":"0000-0001-7293-6893","first_name":"Oliver","last_name":"Stübbe","id":"51864","full_name":"Stübbe, Oliver"},{"full_name":"Pfeiffer, Ullrich","first_name":"Ullrich","last_name":"Pfeiffer"},{"full_name":"Preu, Sascha","last_name":"Preu","first_name":"Sascha"}],"volume":2024,"citation":{"ama":"Shrotri AN, Krause B, Stübbe O, Pfeiffer U, Preu S. Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera. Vol 2024. IEEE; 2024. doi:10.1109/irmmw-thz60956.2024.10697740","ieee":"A. N. Shrotri, B. Krause, O. Stübbe, U. Pfeiffer, and S. Preu, Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera, vol. 2024. Piscataway, NJ: IEEE, 2024. doi: 10.1109/irmmw-thz60956.2024.10697740.","chicago-de":"Shrotri, Abhijeet Narendra, Benedikt Krause, Oliver Stübbe, Ullrich Pfeiffer und Sascha Preu. 2024. Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera. 2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). Bd. 2024. International Conference on Infrared, Millimeter, and Terahertz Waves. Piscataway, NJ: IEEE. doi:10.1109/irmmw-thz60956.2024.10697740, .","din1505-2-1":"Shrotri, Abhijeet Narendra ; Krause, Benedikt ; Stübbe, Oliver ; Pfeiffer, Ullrich ; Preu, Sascha: Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera, International Conference on Infrared, Millimeter, and Terahertz Waves. Bd. 2024. Piscataway, NJ : IEEE, 2024","short":"A.N. Shrotri, B. Krause, O. Stübbe, U. Pfeiffer, S. Preu, Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera, IEEE, Piscataway, NJ, 2024.","ufg":"Shrotri, Abhijeet Narendra u. a.: Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera, Bd. 2024, Piscataway, NJ 2024 (International Conference on Infrared, Millimeter, and Terahertz Waves).","mla":"Shrotri, Abhijeet Narendra, et al. “Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera.” 2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), vol. 2024, IEEE, 2024, https://doi.org/10.1109/irmmw-thz60956.2024.10697740.","havard":"A.N. Shrotri, B. Krause, O. Stübbe, U. Pfeiffer, S. Preu, Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera, IEEE, Piscataway, NJ, 2024.","bjps":"Shrotri AN et al. (2024) Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera. Piscataway, NJ: IEEE.","van":"Shrotri AN, Krause B, Stübbe O, Pfeiffer U, Preu S. Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera. 2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). Piscataway, NJ: IEEE; 2024. (International Conference on Infrared, Millimeter, and Terahertz Waves; vol. 2024).","chicago":"Shrotri, Abhijeet Narendra, Benedikt Krause, Oliver Stübbe, Ullrich Pfeiffer, and Sascha Preu. Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera. 2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). Vol. 2024. International Conference on Infrared, Millimeter, and Terahertz Waves. Piscataway, NJ: IEEE, 2024. https://doi.org/10.1109/irmmw-thz60956.2024.10697740.","apa":"Shrotri, A. N., Krause, B., Stübbe, O., Pfeiffer, U., & Preu, S. (2024). Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera. In 2024 49th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) (Vol. 2024). IEEE. https://doi.org/10.1109/irmmw-thz60956.2024.10697740"},"title":"Evaluation of Additively Manufactured Axicon Lenses Using a THz-Camera"},{"title":"Task-fidelity Assessment for Programming Tasks Using Semantic Code Analysis","citation":{"chicago":"Wehmeier, Leon, Sebastian Eilermann, Oliver Niggemann, and Andreas Deuter. Task-Fidelity Assessment for Programming Tasks Using Semantic Code Analysis. Edited by IEEE ASEE Frontiers in Education Conference, Institute of Electrical and Electronics Engineers, and American Society for Engineering Education. FIE 2023 : College Station, TX, USA, October 18-21, 2023 : Conference Proceedings / 2023 IEEE Frontiers in Education Conference (FIE). [Piscataway, NJ]: IEEE, 2024. https://doi.org/10.1109/fie58773.2023.10342916.","apa":"Wehmeier, L., Eilermann, S., Niggemann, O., & Deuter, A. (2024). Task-fidelity Assessment for Programming Tasks Using Semantic Code Analysis. In IEEE ASEE Frontiers in Education Conference, Institute of Electrical and Electronics Engineers, & American Society for Engineering Education (Eds.), FIE 2023 : College Station, TX, USA, October 18-21, 2023 : conference proceedings / 2023 IEEE Frontiers in Education Conference (FIE). IEEE. https://doi.org/10.1109/fie58773.2023.10342916","ufg":"Wehmeier, Leon u. a.: Task-fidelity Assessment for Programming Tasks Using Semantic Code Analysis, hg. von IEEE ASEE Frontiers in Education Conference/Institute of Electrical and Electronics Engineers, American Society for Engineering Education, [Piscataway, NJ] 2024.","havard":"L. Wehmeier, S. Eilermann, O. Niggemann, A. Deuter, Task-fidelity Assessment for Programming Tasks Using Semantic Code Analysis, IEEE, [Piscataway, NJ], 2024.","bjps":"Wehmeier L et al. (2024) Task-Fidelity Assessment for Programming Tasks Using Semantic Code Analysis, IEEE ASEE Frontiers in Education Conference, Institute of Electrical and Electronics Engineers, and American Society for Engineering Education (eds). [Piscataway, NJ]: IEEE.","mla":"Wehmeier, Leon, et al. “Task-Fidelity Assessment for Programming Tasks Using Semantic Code Analysis.” FIE 2023 : College Station, TX, USA, October 18-21, 2023 : Conference Proceedings / 2023 IEEE Frontiers in Education Conference (FIE), edited by IEEE ASEE Frontiers in Education Conference et al., IEEE, 2024, https://doi.org/10.1109/fie58773.2023.10342916.","van":"Wehmeier L, Eilermann S, Niggemann O, Deuter A. Task-fidelity Assessment for Programming Tasks Using Semantic Code Analysis. IEEE ASEE Frontiers in Education Conference, Institute of Electrical and Electronics Engineers, American Society for Engineering Education, editors. FIE 2023 : College Station, TX, USA, October 18-21, 2023 : conference proceedings / 2023 IEEE Frontiers in Education Conference (FIE). [Piscataway, NJ]: IEEE; 2024.","din1505-2-1":"Wehmeier, Leon ; Eilermann, Sebastian ; Niggemann, Oliver ; Deuter, Andreas ; IEEE ASEE Frontiers in Education Conference ; Institute of Electrical and Electronics Engineers ; American Society for Engineering Education (Hrsg.): Task-fidelity Assessment for Programming Tasks Using Semantic Code Analysis. [Piscataway, NJ] : IEEE, 2024","chicago-de":"Wehmeier, Leon, Sebastian Eilermann, Oliver Niggemann und Andreas Deuter. 2024. Task-fidelity Assessment for Programming Tasks Using Semantic Code Analysis. Hg. von IEEE ASEE Frontiers in Education Conference, Institute of Electrical and Electronics Engineers, und American Society for Engineering Education. FIE 2023 : College Station, TX, USA, October 18-21, 2023 : conference proceedings / 2023 IEEE Frontiers in Education Conference (FIE). [Piscataway, NJ]: IEEE. doi:10.1109/fie58773.2023.10342916, .","short":"L. Wehmeier, S. Eilermann, O. Niggemann, A. Deuter, Task-Fidelity Assessment for Programming Tasks Using Semantic Code Analysis, IEEE, [Piscataway, NJ], 2024.","ieee":"L. Wehmeier, S. Eilermann, O. Niggemann, and A. Deuter, Task-fidelity Assessment for Programming Tasks Using Semantic Code Analysis. [Piscataway, NJ]: IEEE, 2024. doi: 10.1109/fie58773.2023.10342916.","ama":"Wehmeier L, Eilermann S, Niggemann O, Deuter A. Task-Fidelity Assessment for Programming Tasks Using Semantic Code Analysis. (IEEE ASEE Frontiers in Education Conference, Institute of Electrical and Electronics Engineers, American Society for Engineering Education, eds.). IEEE; 2024. doi:10.1109/fie58773.2023.10342916"},"author":[{"first_name":"Leon","id":"81257","last_name":"Wehmeier","full_name":"Wehmeier, Leon"},{"last_name":"Eilermann","first_name":"Sebastian","full_name":"Eilermann, Sebastian"},{"last_name":"Niggemann","id":"10876","full_name":"Niggemann, Oliver","first_name":"Oliver"},{"orcid":"0000-0002-6529-6215","full_name":"Deuter, Andreas","first_name":"Andreas","id":"62088","last_name":"Deuter"}],"year":"2024","status":"public","date_created":"2025-06-18T13:05:11Z","publication_identifier":{"isbn":["979-8-3503-3643-6"],"eisbn":["979-8-3503-3642-9"]},"publication":"FIE 2023 : College Station, TX, USA, October 18-21, 2023 : conference proceedings / 2023 IEEE Frontiers in Education Conference (FIE)","date_updated":"2025-06-18T13:23:56Z","corporate_editor":["IEEE ASEE Frontiers in Education Conference","Institute of Electrical and Electronics Engineers","American Society for Engineering Education"],"language":[{"iso":"eng"}],"keyword":["Codes","Electronic learning","Soft sensors","Semantics","Education","Syntactics","Task analysis"],"publication_status":"published","department":[{"_id":"DEP7022"},{"_id":"DEP1306"},{"_id":"DEP7001"}],"conference":{"end_date":"2023-10-21","start_date":"2023-10-18","location":"Texas","name":"2023 IEEE Frontiers in Education Conference (FIE)"},"abstract":[{"lang":"eng","text":"In computer science and related technical fields, researchers, educators, and practitioners are continuously automating recurring tasks for high efficiency in a wide variety of fields. In higher education, such tasks that educators face are the recurring review and assessment process of students' programming coursework. Thus, various attempts exist to automate the assessment and feedback generation for course homework and practicals in higher education. Those approaches for automated programming task assessment often comprise running automated tests to check for limited functional correctness and potentially style checking for various violations (LINTing). Educators familiar with large-scale automated task assessment are likely used to seeing hard-coded solutions specifically or accidentally designed to just pass the required tests, ignoring or misinterpreting the actual task requirements. Detecting such issues in arbitrary code is non-trivial and an ongoing research topic in software engineering. Software engineering research has yielded various semantic analysis frameworks, such as GitHub's CodeQL, which can be adapted for programming task assessment. We present a work-in-progress programming task analysis framework which employs CodeQL's analysis technology to identify the actual use of task-description-mandated syntactic and semantic elements such as loop structures or the use of mandated data blocks in branching conditions. This allows extending existing course work analysis frameworks to include a semantic check of an uploaded program which exceeds the relatively simple set of input-output test cases provided by unit tests. We use a running example of entry level programming tasks and several solution attempts to introduce and explain our proposed control flow and data flow -based analysis method. We discuss the benefits of including semantic analysis as an additional method in the automated programming task assessment toolbox. Our main contribution is the adaptation of an semantic analysis code framework to analyse syntactic and semantic components in students' programming coursework."}],"publisher":"IEEE","type":"conference_editor_article","user_id":"83781","place":"[Piscataway, NJ]","doi":"10.1109/fie58773.2023.10342916","_id":"12993"},{"oa":"1","keyword":["Ethanol","Pipelines","Metals","Nose","Electronic noses","Sensor systems","Sensors","Quartz crystals","Linear discriminant analysis","Sulfur"],"language":[{"iso":"eng"}],"_id":"10326","doi":"https://doi.org/10.1109/INDIN51400.2023.10217912","publication":"2023 IEEE 21st International Conference on Industrial Informatics (INDIN)","date_created":"2023-09-14T05:50:47Z","type":"conference_speech","user_id":"64952","date_updated":"2025-03-13T13:48:05Z","main_file_link":[{"open_access":"1","url":"https://ieeexplore.ieee.org/document/10217912"}],"year":"2023","author":[{"first_name":"Julius","id":"79011","last_name":"Wörner","full_name":"Wörner, Julius"},{"id":"46416","last_name":"Dörksen","full_name":"Dörksen, Helene","first_name":"Helene"},{"orcid":"0000-0002-7920-0595","full_name":"Pein-Hackelbusch, Miriam","id":"64952","last_name":"Pein-Hackelbusch","first_name":"Miriam"}],"department":[{"_id":"DEP4000"},{"_id":"DEP4028"}],"conference":{"name":"21st International Conference on Industrial Informatics (INDIN)","location":"Lemgo","start_date":"2023-07-18","end_date":"2023-07-20"},"abstract":[{"text":"In the food industry, and especially in wines as products thereof, ethanol and sulfur dioxide play an equally important role. Both substances are important wine quality characteristics as they influence the taste and odor. As both substances comprise volatile matter, electronic noses should be applicable to discriminate the different qualities of wines. Our study investigates the influence of alcohol and sulfur dioxide on the discrimination ability of wines (especially those of the same grape variety) using two different electronic nose systems. One system is equipped with metal oxide sensors and the other with quartz crystal microbalance sensors. Contrary to indications in literature, where the alcohol content is discussed to have a large influence on e-nose results, it was shown that a difference of 1 % ethanol was not sufficient to allow accurate discrimination using Linear Discriminant Analysis by any system. On the positive side, the analyzed concentrations of ethanol (about 12 %) did not superimpose other volatile information. So difference in sulfur dioxide content gave an accuracy for sample discrimination of up to 90.6 % with MOS nose. Thus, we are so far partially able to discriminate wines with electronic noses based on their volatile imprint.","lang":"eng"}],"status":"public","title":"Key Indicators for the Discrimination of Wines by Electronic Noses","citation":{"van":"Wörner J, Dörksen H, Pein-Hackelbusch M. Key Indicators for the Discrimination of Wines by Electronic Noses. 2023 IEEE 21st International Conference on Industrial Informatics (INDIN). 2023.","bjps":"Wörner J, Dörksen H and Pein-Hackelbusch M (2023) Key Indicators for the Discrimination of Wines by Electronic Noses. .","havard":"J. Wörner, H. Dörksen, M. Pein-Hackelbusch, Key Indicators for the Discrimination of Wines by Electronic Noses, 2023.","mla":"Wörner, Julius, et al. “Key Indicators for the Discrimination of Wines by Electronic Noses.” 2023 IEEE 21st International Conference on Industrial Informatics (INDIN), 2023, https://doi.org/10.1109/INDIN51400.2023.10217912.","ufg":"Wörner, Julius/Dörksen, Helene/Pein-Hackelbusch, Miriam: Key Indicators for the Discrimination of Wines by Electronic Noses, o. O. 2023.","apa":"Wörner, J., Dörksen, H., & Pein-Hackelbusch, M. (2023). Key Indicators for the Discrimination of Wines by Electronic Noses. In 2023 IEEE 21st International Conference on Industrial Informatics (INDIN). 21st International Conference on Industrial Informatics (INDIN), Lemgo. https://doi.org/10.1109/INDIN51400.2023.10217912","chicago":"Wörner, Julius, Helene Dörksen, and Miriam Pein-Hackelbusch. Key Indicators for the Discrimination of Wines by Electronic Noses. 2023 IEEE 21st International Conference on Industrial Informatics (INDIN), 2023. https://doi.org/10.1109/INDIN51400.2023.10217912.","short":"J. Wörner, H. Dörksen, M. Pein-Hackelbusch, Key Indicators for the Discrimination of Wines by Electronic Noses, 2023.","chicago-de":"Wörner, Julius, Helene Dörksen und Miriam Pein-Hackelbusch. 2023. Key Indicators for the Discrimination of Wines by Electronic Noses. 2023 IEEE 21st International Conference on Industrial Informatics (INDIN). doi:https://doi.org/10.1109/INDIN51400.2023.10217912, .","din1505-2-1":"Wörner, Julius ; Dörksen, Helene ; Pein-Hackelbusch, Miriam: Key Indicators for the Discrimination of Wines by Electronic Noses, 2023","ama":"Wörner J, Dörksen H, Pein-Hackelbusch M. Key Indicators for the Discrimination of Wines by Electronic Noses.; 2023. doi:https://doi.org/10.1109/INDIN51400.2023.10217912","ieee":"J. Wörner, H. Dörksen, and M. Pein-Hackelbusch, Key Indicators for the Discrimination of Wines by Electronic Noses. 2023. doi: https://doi.org/10.1109/INDIN51400.2023.10217912."},"publication_status":"published"},{"user_id":"51864","type":"conference","_id":"554","place":"Lemgo","publication_status":"published","series_title":"Publication series in direct digital manufacturing","issue":"1","abstract":[{"text":"Light guiding structures, like optical waveguides or fibers, take an important role in several industries, e.g. communication, sensing, illumination or medical applications. For the latter, it could be very interesting to have the possibility to manufacture problem-adapted structureswith a mechanicalfunctionality andwith additional embedded optical or electrical sensor functionalities.Modern additive manufacturing (AM) technologies like Stereolithography (SLA) or Fused Layer Modeling (FLM) may provide these opportunities.This paper is aimedto figure out the light guiding opportunities of both technologies. For this different kind of structures are built by FLM and SLA. To compare both manufacturing technologies, the layout of each structure is identical for both technologies. After manufacturing, the transmission and the attenuation of the guided light of these structures areanalyzed by measurement.Then the measurement results of the different technologies are compared with each other.","lang":"eng"}],"conference":{"name":"Proceedings 8th International Conference","location":"Lemgo","end_date":"2018-10-05","start_date":"2018-10-04"},"department":[{"_id":"DEP1306"},{"_id":"DEP5000"},{"_id":"DEP5020"},{"_id":"DEP6020"}],"corporate_editor":["Department of Production Engineering and Management","Hochschule Ostwestfalen-Lippe"],"editor":[{"last_name":"Villmer","first_name":"Franz-Josef","full_name":"Villmer, Franz-Josef"},{"first_name":"Elio","last_name":"Padoano","full_name":"Padoano, Elio"}],"date_updated":"2024-04-19T12:56:30Z","publication":"Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany","publication_identifier":{"isbn":["978-3-946856-03-0"]},"date_created":"2019-02-13T14:29:45Z","keyword":["Additive manufacturing","Embedded optical waveguides","Optical sensors","SLA technology","FLM technology"],"language":[{"iso":"eng"}],"citation":{"ama":"Beyer M, Stübbe O, Villmer FJ. Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In: Villmer FJ, Padoano E, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, eds. Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany. Publication series in direct digital manufacturing. ; 2018:70-82.","ieee":"M. Beyer, O. Stübbe, and F.-J. Villmer, “Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications,” in Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany, Lemgo, 2018, no. 1, pp. 70–82.","chicago-de":"Beyer, Micha, Oliver Stübbe und Franz-Josef Villmer. 2018. Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In: Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany, hg. von Franz-Josef Villmer, Elio Padoano, Department of Production Engineering and Management, und Hochschule Ostwestfalen-Lippe, 70–82. Publication series in direct digital manufacturing. Lemgo.","din1505-2-1":"Beyer, Micha ; Stübbe, Oliver ; Villmer, Franz-Josef: Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In: Villmer, F.-J. ; Padoano, E. ; Department of Production Engineering and Management ; Hochschule Ostwestfalen-Lippe (Hrsg.): Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany, Publication series in direct digital manufacturing. Lemgo, 2018, S. 70–82","short":"M. Beyer, O. Stübbe, F.-J. Villmer, in: F.-J. Villmer, E. Padoano, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany, Lemgo, 2018, pp. 70–82.","ufg":"Beyer, Micha/Stübbe, Oliver/Villmer, Franz-Josef: Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications, in: Villmer, Franz-Josef u. a. (Hgg.): Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany, Lemgo 2018 (Publication series in direct digital manufacturing), S. 70–82.","mla":"Beyer, Micha, et al. “Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications.” Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany, edited by Franz-Josef Villmer et al., no. 1, 2018, pp. 70–82.","bjps":"Beyer M, Stübbe O and Villmer F-J (2018) Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In Villmer F-J et al. (eds), Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany. Lemgo, pp. 70–82.","havard":"M. Beyer, O. Stübbe, F.-J. Villmer, Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications, in: F.-J. Villmer, E. Padoano, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany, Lemgo, 2018: pp. 70–82.","van":"Beyer M, Stübbe O, Villmer FJ. Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In: Villmer FJ, Padoano E, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, editors. Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany. Lemgo; 2018. p. 70–82. (Publication series in direct digital manufacturing).","chicago":"Beyer, Micha, Oliver Stübbe, and Franz-Josef Villmer. “Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications.” In Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany, edited by Franz-Josef Villmer, Elio Padoano, Department of Production Engineering and Management, and Hochschule Ostwestfalen-Lippe, 70–82. Publication Series in Direct Digital Manufacturing. Lemgo, 2018.","apa":"Beyer, M., Stübbe, O., & Villmer, F.-J. (2018). Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In F.-J. Villmer, E. Padoano, Department of Production Engineering and Management, & Hochschule Ostwestfalen-Lippe (Eds.), Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany (Issue 1, pp. 70–82)."},"title":"Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications","status":"public","page":"70-82","year":"2018","author":[{"id":"71403","full_name":"Beyer, Micha","last_name":"Beyer","first_name":"Micha"},{"full_name":"Stübbe, Oliver","last_name":"Stübbe","first_name":"Oliver","id":"51864","orcid":"https://orcid.org/0000-0001-7293-6893"},{"full_name":"Villmer, Franz-Josef","id":"14290","last_name":"Villmer","first_name":"Franz-Josef"}]},{"page":"127-136","status":"public","main_file_link":[{"url":"https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf","open_access":"1"}],"year":"2017","author":[{"last_name":"Ehlert","full_name":"Ehlert, Patrick","id":"62091","first_name":"Patrick"},{"full_name":"Stübbe, Oliver","id":"51864","last_name":"Stübbe","first_name":"Oliver","orcid":"https://orcid.org/0000-0001-7293-6893"},{"full_name":"Villmer, Franz-Josef","first_name":"Franz-Josef","id":"14290","last_name":"Villmer"}],"citation":{"ieee":"P. Ehlert, O. Stübbe, and F.-J. Villmer, “Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology,” in Production Engineering and Management, Pordenone, Italy, 2017, no. 1, pp. 127–136.","apa":"Ehlert, P., Stübbe, O., & Villmer, F.-J. (2017). Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In E. Padoano, F.-J. Villmer, Department of Production Engineering and Management, & Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management (Issue 1, pp. 127–136).","chicago":"Ehlert, Patrick, Oliver Stübbe, and Franz-Josef Villmer. “Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology.” In Production Engineering and Management, edited by Elio Padoano, Franz-Josef Villmer, Department of Production Engineering and Management, and Hochschule Ostwestfalen-Lippe, 127–36. Publication Series in Direct Digital Manufacturing . Lemgo, 2017.","ama":"Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, eds. Production Engineering and Management. Publication series in direct digital manufacturing . ; 2017:127-136.","van":"Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, editors. Production Engineering and Management. Lemgo; 2017. p. 127–36. (Publication series in direct digital manufacturing ).","bjps":"Ehlert P, Stübbe O and Villmer F-J (2017) Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In Padoano E et al. (eds), Production Engineering and Management. Lemgo, pp. 127–136.","mla":"Ehlert, Patrick, et al. “Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology.” Production Engineering and Management, edited by Elio Padoano et al., no. 1, 2017, pp. 127–36.","havard":"P. Ehlert, O. Stübbe, F.-J. Villmer, Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology, in: E. Padoano, F.-J. Villmer, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management, Lemgo, 2017: pp. 127–136.","ufg":"Ehlert, Patrick/Stübbe, Oliver/Villmer, Franz-Josef: Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology, in: Padoano, Elio u. a. (Hgg.): Production Engineering and Management, Lemgo 2017 (Publication series in direct digital manufacturing ), S. 127–136.","short":"P. Ehlert, O. Stübbe, F.-J. Villmer, in: E. Padoano, F.-J. Villmer, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management, Lemgo, 2017, pp. 127–136.","din1505-2-1":"Ehlert, Patrick ; Stübbe, Oliver ; Villmer, Franz-Josef: Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: Padoano, E. ; Villmer, F.-J. ; Department of Production Engineering and Management ; Hochschule Ostwestfalen-Lippe (Hrsg.): Production Engineering and Management, Publication series in direct digital manufacturing . Lemgo, 2017, S. 127–136","chicago-de":"Ehlert, Patrick, Oliver Stübbe und Franz-Josef Villmer. 2017. Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: Production Engineering and Management, hg. von Elio Padoano, Franz-Josef Villmer, Department of Production Engineering and Management, und Hochschule Ostwestfalen-Lippe, 127–136. Publication series in direct digital manufacturing . Lemgo."},"extern":"1","title":"Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology","language":[{"iso":"eng"}],"keyword":["Additive manufacturing","Embedded optical waveguides","Electrical conductors","Embedded systems","FLM technology","Sensors"],"oa":"1","date_updated":"2024-04-19T12:58:56Z","related_material":{"link":[{"url":"https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf","relation":"contains"}]},"editor":[{"full_name":"Padoano, Elio","first_name":"Elio","last_name":"Padoano"},{"id":"14290","first_name":"Franz-Josef","full_name":"Villmer, Franz-Josef","last_name":"Villmer"}],"corporate_editor":["Department of Production Engineering and Management","Hochschule Ostwestfalen-Lippe"],"date_created":"2019-02-18T11:16:07Z","publication_identifier":{"isbn":["978-3-946856-01-6"]},"publication":"Production Engineering and Management","quality_controlled":"1","department":[{"_id":"DEP1306"},{"_id":"DEP5020"},{"_id":"DEP5000"},{"_id":"DEP6020"}],"conference":{"location":"Pordenone, Italy","name":"Proceedings7th International Conference","end_date":"2017-09-29","start_date":"2017-09-28"},"issue":"1","abstract":[{"lang":"eng","text":"Additive manufacturing (AM) technologies have not only revolutionized product development and design by enabling rapid prototyping. They also gained influence on production in general, mainly because of their direct manufacturing capabilities. In the context of Industry 4.0 and the related process automation, innovative and advanced production technologies with completely new approaches are required [1]. AM technologies contribute to this with their advantages like freedom of design, cost efficient product individualization, and functional integration. On the other hand, AM still shows shortcomings in exploiting its full potential. Most current AM technologies are only applicable for manufacturing with singular materials. In particular, opportunities for processing of optically or electrically conductive materials are still missing. This paper contributes to the advancement of additive manufacturing of two different material variants or even two completely different materials. A special focus is laid on producing a part that combines mechanical with optical or electrical functionalities in one process step. The ultimate goal is to integrate sensor functionalities into an AM object, e.g. strain gauges. Extrusion processes, predominantly Fused Layer Modeling (FLM), are preferred in this research due to their mechanically simple machine setup in which additional functional materials can be adapted easily to the build process. In a first step, the general manufacturability has been evaluated. Thereafter, the resulting optical transmission properties have been analyzed. Especially the attenuation has to remain below a threshold value to accomplish a minimum signal-to-noise ratio."}],"publication_status":"published","series_title":"Publication series in direct digital manufacturing ","place":"Lemgo","_id":"573","user_id":"51864","type":"conference"},{"doi":"10.1007/978-3-319-16226-3","_id":"4336","place":"Heidelberg","type":"book_editor","intvolume":" 8700","user_id":"15514","abstract":[{"lang":"eng","text":"Prolonged life expectancy along with the increasing complexity of medicine and health services raises health costs worldwide dramatically. Whilst the smart health concept has much potential to support the concept of the emerging P4-medicine (preventive, participatory, predictive, and personalized), such high-tech medicine produces large amounts of high-dimensional, weakly-structured data sets and massive amounts of unstructured information. All these technological approaches along with “big data” are turning the medical sciences into a data-intensive science. To keep pace with the growing amounts of complex data, smart hospital approaches are a commandment of the future, necessitating context aware computing along with advanced interaction paradigms in new physical-digital ecosystems.\r\n\r\nThe very successful synergistic combination of methodologies and approaches from Human-Computer Interaction (HCI) and Knowledge Discovery and Data Mining (KDD) offers ideal conditions for the vision to support human intelligence with machine learning.\r\n\r\nThe papers selected for this volume focus on hot topics in smart health; they discuss open problems and future challenges in order to provide a research agenda to stimulate further research and progress."}],"department":[{"_id":"DEP5023"}],"publisher":"Springer","series_title":"Lecture Notes in Computer Science / Information Systems and Applications, incl. Internet/Web, and HCI","publication_status":"published","oa":"1","language":[{"iso":"eng"}],"keyword":["HCI","ambient assisted living","big data","computational intelligence","context awareness","data centric medicine","decision support","interactive data mining","keyword detection","knoweldge bases","knoweldge discovery","machine learning","medical decision support","medical informatics","natural language processing","pervasive health","smart home","ubiquitous computing","visualization","wearable sensors"],"date_created":"2021-01-08T12:03:52Z","publication_identifier":{"isbn":["978-3-319-16225-6"],"eissn":["1611-3349"],"eisbn":["978-3-319-16226-3"],"issn":["0302-9743"]},"editor":[{"first_name":"Andreas","last_name":"Holzinger","full_name":"Holzinger, Andreas"},{"id":"61525","full_name":"Röcker, Carsten","last_name":"Röcker","first_name":"Carsten"},{"first_name":"Martina","last_name":"Ziefle","full_name":"Ziefle, Martina"}],"date_updated":"2023-03-15T13:49:52Z","main_file_link":[{"url":"http://www.springerlink.com/content/978-3-319-16226-3 ","open_access":"1"}],"year":2015,"page":"275","status":"public","title":"Smart Health: Open Problems and Future Challenges","citation":{"short":"A. Holzinger, C. Röcker, M. Ziefle, eds., Smart Health: Open Problems and Future Challenges, Springer, Heidelberg, 2015.","chicago-de":"Holzinger, Andreas, Carsten Röcker und Martina Ziefle, Hrsg. 2015. Smart Health: Open Problems and Future Challenges. Bd. 8700. Lecture Notes in Computer Science / Information Systems and Applications, incl. Internet/Web, and HCI. Heidelberg: Springer. doi:10.1007/978-3-319-16226-3, .","din1505-2-1":"Holzinger, A. ; Röcker, C. ; Ziefle, M. (Hrsg.): Smart Health: Open Problems and Future Challenges, Lecture Notes in Computer Science / Information Systems and Applications, incl. Internet/Web, and HCI. Bd. 8700. Heidelberg : Springer, 2015","apa":"Holzinger, A., Röcker, C., & Ziefle, M. (Eds.). (2015). Smart Health: Open Problems and Future Challenges (Vol. 8700). Heidelberg: Springer. https://doi.org/10.1007/978-3-319-16226-3","chicago":"Holzinger, Andreas, Carsten Röcker, and Martina Ziefle, eds. Smart Health: Open Problems and Future Challenges. Vol. 8700. Lecture Notes in Computer Science / Information Systems and Applications, Incl. Internet/Web, and HCI. Heidelberg: Springer, 2015. https://doi.org/10.1007/978-3-319-16226-3.","van":"Holzinger A, Röcker C, Ziefle M, editors. Smart Health: Open Problems and Future Challenges. Heidelberg: Springer; 2015. 275 p. (Lecture Notes in Computer Science / Information Systems and Applications, incl. Internet/Web, and HCI; vol. 8700).","bjps":"Holzinger A, Röcker C and Ziefle M (eds) (2015) Smart Health: Open Problems and Future Challenges. Heidelberg: Springer.","mla":"Holzinger, Andreas, et al., editors. Smart Health: Open Problems and Future Challenges. Vol. 8700, Springer, 2015, doi:10.1007/978-3-319-16226-3.","havard":"A. Holzinger, C. Röcker, M. Ziefle, eds., Smart Health: Open Problems and Future Challenges, Springer, Heidelberg, 2015.","ufg":"Holzinger, Andreas et. al. (Hgg.) (2015): Smart Health: Open Problems and Future Challenges (=Lecture Notes in Computer Science / Information Systems and Applications, incl. Internet/Web, and HCI 8700), Heidelberg.","ieee":"A. Holzinger, C. Röcker, and M. Ziefle, Eds., Smart Health: Open Problems and Future Challenges, vol. 8700. Heidelberg: Springer, 2015.","ama":"Holzinger A, Röcker C, Ziefle M, eds. Smart Health: Open Problems and Future Challenges. Vol 8700. Heidelberg: Springer; 2015. doi:10.1007/978-3-319-16226-3"},"volume":8700},{"citation":{"short":"A. Dicks, V. Lohweg, H. Wittke, S. Linke, in: 20th IEEE International Conference on Emerging Technologies and Factory Automation, Luxembourg, 2015.","chicago-de":"Dicks, Alexander, Volker Lohweg, Henrik Wittke und Stefan Linke. 2015. Structural Health Monitoring of Plastic Components with Piezoelectric Sensors. In: 20th IEEE International Conference on Emerging Technologies and Factory Automation. Luxembourg. doi: 10.1109/ETFA.2015.7301595, .","din1505-2-1":"Dicks, Alexander ; Lohweg, Volker ; Wittke, Henrik ; Linke, Stefan: Structural Health Monitoring of Plastic Components with Piezoelectric Sensors. In: 20th IEEE International Conference on Emerging Technologies and Factory Automation. Luxembourg, 2015","van":"Dicks A, Lohweg V, Wittke H, Linke S. Structural Health Monitoring of Plastic Components with Piezoelectric Sensors. In: 20th IEEE International Conference on Emerging Technologies and Factory Automation. Luxembourg; 2015.","ufg":"Dicks, Alexander et. al. (2015): Structural Health Monitoring of Plastic Components with Piezoelectric Sensors, in: 20th IEEE International Conference on Emerging Technologies and Factory Automation, Luxembourg.","bjps":"Dicks A et al. (2015) Structural Health Monitoring of Plastic Components with Piezoelectric Sensors. 20th IEEE International Conference on Emerging Technologies and Factory Automation. Luxembourg.","mla":"Dicks, Alexander, et al. “Structural Health Monitoring of Plastic Components with Piezoelectric Sensors.” 20th IEEE International Conference on Emerging Technologies and Factory Automation, 2015, doi: 10.1109/ETFA.2015.7301595.","havard":"A. Dicks, V. Lohweg, H. Wittke, S. Linke, Structural Health Monitoring of Plastic Components with Piezoelectric Sensors, in: 20th IEEE International Conference on Emerging Technologies and Factory Automation, Luxembourg, 2015.","apa":"Dicks, A., Lohweg, V., Wittke, H., & Linke, S. (2015). Structural Health Monitoring of Plastic Components with Piezoelectric Sensors. In 20th IEEE International Conference on Emerging Technologies and Factory Automation. Luxembourg. https://doi.org/ 10.1109/ETFA.2015.7301595","chicago":"Dicks, Alexander, Volker Lohweg, Henrik Wittke, and Stefan Linke. “Structural Health Monitoring of Plastic Components with Piezoelectric Sensors.” In 20th IEEE International Conference on Emerging Technologies and Factory Automation. Luxembourg, 2015. https://doi.org/ 10.1109/ETFA.2015.7301595.","ama":"Dicks A, Lohweg V, Wittke H, Linke S. Structural Health Monitoring of Plastic Components with Piezoelectric Sensors. In: 20th IEEE International Conference on Emerging Technologies and Factory Automation. Luxembourg; 2015. doi: 10.1109/ETFA.2015.7301595","ieee":"A. Dicks, V. Lohweg, H. Wittke, and S. Linke, “Structural Health Monitoring of Plastic Components with Piezoelectric Sensors,” in 20th IEEE International Conference on Emerging Technologies and Factory Automation, 2015."},"title":"Structural Health Monitoring of Plastic Components with Piezoelectric Sensors","status":"public","author":[{"first_name":"Alexander","id":"1853","full_name":"Dicks, Alexander","last_name":"Dicks"},{"orcid":"0000-0002-3325-7887","first_name":"Volker","id":"1804","last_name":"Lohweg","full_name":"Lohweg, Volker"},{"first_name":"Henrik","full_name":"Wittke, Henrik","last_name":"Wittke"},{"first_name":"Stefan","last_name":"Linke","full_name":"Linke, Stefan"}],"year":2015,"department":[{"_id":"DEP5023"}],"abstract":[{"lang":"eng","text":"Due to the material changes of components from metal to plastic or composite materials, the structural health monitoring finds more and more interest in the industrial fields. The reason is that these materials are more vulnerable to damage or impacts which cannot be optically detected. In this contribution we present a method to analyze the structure of plastic components with piezo-electrical sensors and actuators. The components are stimulated by actuators, and sensors capture the injected vibrations. These signals are decomposed into Intrinsic Mode Functions to compute statistical features. A Fuzzy-Pattern-Classifier is applied to detect structural modifications at the components under test."}],"user_id":"68554","date_updated":"2023-03-15T13:49:39Z","publication":"20th IEEE International Conference on Emerging Technologies and Factory Automation","type":"conference","date_created":"2019-12-04T09:11:17Z","keyword":["Sensors","Actuators","Finite element analysis","Plastics","Modal analysis","Monitoring","Empirical mode decomposition"],"place":"Luxembourg","language":[{"iso":"eng"}],"_id":"2133","doi":" 10.1109/ETFA.2015.7301595"},{"publisher":"IEEE","status":"public","abstract":[{"text":"In modern industrial applications driven by Cyber-physical systems (CPS) it is a challenging task to model and optimize processes such as machine analysis and diagnosis. Since the CPS have to act autonomously, a procedure for automated decision making has to be designed. In our work we concentrate on the design of a decision procedure by a fuzzy classifier approach. For our application on decision making in an industrial environment, a fuzzy approach was picked as convenient classification technique regarding balance between accuracy and computational time. We present a supervised learning method called FUZZY-ComRef which combines fuzzy classification and our combinatorial refinement method, called ComRef [1]. Due to the fact that fuzzy classification might behave inaccurately for some datasets, the aim of our approach is to improve the results provided by the (stand-alone) fuzzy classification. We show the performance of FUZZY-ComRef evaluated on the samples from the UCI Repository and on our real-world dataset Motor Drive Diagnosis. In addition, we discuss the quadratic computational time problem arising from the combinatorial nature of ComRef. Furthermore, we show based on real-time evaluations that within parallelisation the proposed FUZZY-ComRef is suitable to many applications in CPS.","lang":"eng"}],"department":[{"_id":"DEP5023"}],"year":2015,"author":[{"id":"46416","first_name":"Helene","full_name":"Dörksen, Helene","last_name":"Dörksen"},{"last_name":"Lohweg","id":"1804","full_name":"Lohweg, Volker","first_name":"Volker","orcid":"0000-0002-3325-7887"}],"citation":{"ieee":"H. Dörksen and V. Lohweg, “Automated Fuzzy Classification with Combinatorial Refinement,” in 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. , 2015.","ama":"Dörksen H, Lohweg V. Automated Fuzzy Classification with Combinatorial Refinement. In: 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. . Luxembourg: IEEE; 2015. doi: 10.1109/ETFA.2015.7301514","chicago":"Dörksen, Helene, and Volker Lohweg. “Automated Fuzzy Classification with Combinatorial Refinement.” In 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. . Luxembourg: IEEE, 2015. https://doi.org/ 10.1109/ETFA.2015.7301514.","apa":"Dörksen, H., & Lohweg, V. (2015). Automated Fuzzy Classification with Combinatorial Refinement. In 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. . Luxembourg: IEEE. https://doi.org/ 10.1109/ETFA.2015.7301514","havard":"H. Dörksen, V. Lohweg, Automated Fuzzy Classification with Combinatorial Refinement, in: 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. , IEEE, Luxembourg, 2015.","mla":"Dörksen, Helene, and Volker Lohweg. “Automated Fuzzy Classification with Combinatorial Refinement.” 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. , IEEE, 2015, doi: 10.1109/ETFA.2015.7301514.","bjps":"Dörksen H and Lohweg V (2015) Automated Fuzzy Classification with Combinatorial Refinement. 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. . Luxembourg: IEEE.","ufg":"Dörksen, Helene/Lohweg, Volker (2015): Automated Fuzzy Classification with Combinatorial Refinement, in: 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. , Luxembourg.","van":"Dörksen H, Lohweg V. Automated Fuzzy Classification with Combinatorial Refinement. In: 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015 . Luxembourg: IEEE; 2015.","din1505-2-1":"Dörksen, Helene ; Lohweg, Volker: Automated Fuzzy Classification with Combinatorial Refinement. In: 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. . Luxembourg : IEEE, 2015","chicago-de":"Dörksen, Helene und Volker Lohweg. 2015. Automated Fuzzy Classification with Combinatorial Refinement. In: 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. . Luxembourg: IEEE. doi: 10.1109/ETFA.2015.7301514, .","short":"H. Dörksen, V. Lohweg, in: 20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. , IEEE, Luxembourg, 2015."},"title":"Automated Fuzzy Classification with Combinatorial Refinement","doi":" 10.1109/ETFA.2015.7301514","_id":"2136","language":[{"iso":"eng"}],"place":"Luxembourg","keyword":["Support vector machines","Accuracy","Time complexity","Decision making","Motor drives","Shape","Sensors"],"date_updated":"2023-03-15T13:49:39Z","user_id":"68554","date_created":"2019-12-04T09:23:21Z","type":"conference","publication":"20th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA) Luxembourg, Sep 2015. ","publication_identifier":{"eisbn":[" 978-1-4673-7929-8"]}},{"publisher":"Elsevier","status":"public","page":"63-71","abstract":[{"text":"Recent industrial applications are implemented in a modular way, resulting in flexibility during the whole life cycle, i.e., setup, operation, and maintenance. This applies especially to larger applications like logistic, production, and printing processes. Their modular character is resulting from the constantly increasing complexity of such installations, which makes their supervision for securing reliable operation a difficult task: the data of hundreds (if not thousands) of signal sources must be acquired, communicated, and evaluated for system diagnosis. In this contribution we summarize the challenges arising in such applications and show that distributed sensor and information fusion for modular self-diagnosis tackles these challenges. Here, we propose an innovative distributed architecture encompassing intelligent sensor nodes, self-configuring real-time communication networks, and a suitable sensor and information fusion system for condition monitoring. New challenges arise in the context of distributed information fusion systems, which are identified and to which an outlook on future solutions is provided. A number of these solutions have already been discovered, implemented, and are evaluated in the context of a demonstrator, which resembles a real-world printing application.","lang":"eng"}],"issue":"34","main_file_link":[{"url":"https://www.sciencedirect.com/science/article/pii/S0957415815000707","open_access":"1"}],"author":[{"first_name":"Uwe","id":"1825","last_name":"Mönks","full_name":"Mönks, Uwe"},{"id":"1486","first_name":"Henning","last_name":"Trsek","full_name":"Trsek, Henning"},{"full_name":"Dürkop, Lars","first_name":"Lars","last_name":"Dürkop"},{"first_name":"Volker","last_name":"Geneiß","full_name":"Geneiß, Volker"},{"orcid":"0000-0002-3325-7887","full_name":"Lohweg, Volker","first_name":"Volker","last_name":"Lohweg","id":"1804"}],"year":2015,"department":[{"_id":"DEP5023"}],"citation":{"ieee":"U. Mönks, H. Trsek, L. Dürkop, V. Geneiß, and V. Lohweg, “Towards distributed intelligent sensor and information fusion,” Mechatronics, no. 34, pp. 63–71, 2015.","ama":"Mönks U, Trsek H, Dürkop L, Geneiß V, Lohweg V. Towards distributed intelligent sensor and information fusion. Mechatronics. 2015;(34):63-71. doi:10.1016/j.mechatronics.2015.05.005","apa":"Mönks, U., Trsek, H., Dürkop, L., Geneiß, V., & Lohweg, V. (2015). Towards distributed intelligent sensor and information fusion. Mechatronics, (34), 63–71. https://doi.org/10.1016/j.mechatronics.2015.05.005","chicago":"Mönks, Uwe, Henning Trsek, Lars Dürkop, Volker Geneiß, and Volker Lohweg. “Towards Distributed Intelligent Sensor and Information Fusion.” Mechatronics, no. 34 (2015): 63–71. https://doi.org/10.1016/j.mechatronics.2015.05.005.","van":"Mönks U, Trsek H, Dürkop L, Geneiß V, Lohweg V. Towards distributed intelligent sensor and information fusion. Mechatronics. 2015;(34):63–71.","ufg":"Mönks, Uwe et. al. (2015): Towards distributed intelligent sensor and information fusion, in: Mechatronics (34), S. 63–71.","havard":"U. Mönks, H. Trsek, L. Dürkop, V. Geneiß, V. Lohweg, Towards distributed intelligent sensor and information fusion, Mechatronics. (2015) 63–71.","bjps":"Mönks U et al. (2015) Towards Distributed Intelligent Sensor and Information Fusion. Mechatronics 63–71.","mla":"Mönks, Uwe, et al. “Towards Distributed Intelligent Sensor and Information Fusion.” Mechatronics, no. 34, Elsevier, 2015, pp. 63–71, doi:10.1016/j.mechatronics.2015.05.005.","short":"U. Mönks, H. Trsek, L. Dürkop, V. Geneiß, V. Lohweg, Mechatronics (2015) 63–71.","din1505-2-1":"Mönks, Uwe ; Trsek, Henning ; Dürkop, Lars ; Geneiß, Volker ; Lohweg, Volker: Towards distributed intelligent sensor and information fusion. In: Mechatronics, Elsevier (2015), Nr. 34, S. 63–71","chicago-de":"Mönks, Uwe, Henning Trsek, Lars Dürkop, Volker Geneiß und Volker Lohweg. 2015. Towards distributed intelligent sensor and information fusion. Mechatronics, Nr. 34: 63–71. doi:10.1016/j.mechatronics.2015.05.005, ."},"title":"Towards distributed intelligent sensor and information fusion","_id":"2140","doi":"10.1016/j.mechatronics.2015.05.005","keyword":["Cyber-physical systems","Information fusion","Fusion system design","Intelligent sensors","Self-configuration","Intelligent networking"],"language":[{"iso":"eng"}],"oa":"1","user_id":"68554","date_updated":"2023-03-15T13:49:39Z","publication":"Mechatronics","publication_identifier":{"issn":["0957-4158"]},"type":"journal_article","date_created":"2019-12-04T09:29:07Z"},{"publisher":"SPIE","status":"public","page":"1-12","abstract":[{"lang":"eng","text":"Today, mobile devices (smartphones, tablets, etc.) are widespread and of high importance for their users. Their performance as well as versatility increases over time. This leads to the opportunity to use such devices for more specific tasks like image processing in an industrial context. For the analysis of images requirements like image quality (blur, illumination, etc.) as well as a defined relative position of the object to be inspected are crucial. Since mobile devices are handheld and used in constantly changing environments the challenge is to fulfill these requirements. We present an approach to overcome the obstacles and stabilize the image capturing process such that image analysis becomes significantly improved on mobile devices. Therefore, image processing methods are combined with sensor fusion concepts. The approach consists of three main parts. First, pose estimation methods are used to guide a user moving the device to a defined position. Second, the sensors data and the pose information are combined for relative motion estimation. Finally, the image capturing process is automated. It is triggered depending on the alignment of the device and the object as well as the image quality that can be achieved under consideration of motion and environmental effects."}],"year":2015,"author":[{"first_name":"Kai-Fabian","id":"44017","last_name":"Henning","full_name":"Henning, Kai-Fabian"},{"last_name":"Fritze","first_name":"Alexander","full_name":"Fritze, Alexander"},{"first_name":"Eugen","id":"1706","full_name":"Gillich, Eugen","last_name":"Gillich"},{"last_name":"Mönks","first_name":"Uwe","id":"1825","full_name":"Mönks, Uwe"},{"full_name":"Lohweg, Volker","first_name":"Volker","last_name":"Lohweg","id":"1804","orcid":"0000-0002-3325-7887"}],"main_file_link":[{"url":"https://www.spiedigitallibrary.org/conference-proceedings-of-spie/9404/94040N/Stable-image-acquisition-for-mobile-image-processing-applications/10.1117/12.2076146.full?SSO=1","open_access":"1"}],"department":[{"_id":"DEP5023"}],"citation":{"short":"K.-F. Henning, A. Fritze, E. Gillich, U. Mönks, V. Lohweg, in: IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI, SPIE, San Francisco, CA, USA, 2015, pp. 1–12.","chicago-de":"Henning, Kai-Fabian, Alexander Fritze, Eugen Gillich, Uwe Mönks und Volker Lohweg. 2015. Stable Image Acquisition for Mobile Image Processing Applications. In: IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI, 1–12. San Francisco, CA, USA: SPIE. doi:10.1117/12.2076146, .","din1505-2-1":"Henning, Kai-Fabian ; Fritze, Alexander ; Gillich, Eugen ; Mönks, Uwe ; Lohweg, Volker: Stable Image Acquisition for Mobile Image Processing Applications. In: IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI. San Francisco, CA, USA : SPIE, 2015, S. 1–12","apa":"Henning, K.-F., Fritze, A., Gillich, E., Mönks, U., & Lohweg, V. (2015). Stable Image Acquisition for Mobile Image Processing Applications. In IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI (pp. 1–12). San Francisco, CA, USA: SPIE. https://doi.org/10.1117/12.2076146","chicago":"Henning, Kai-Fabian, Alexander Fritze, Eugen Gillich, Uwe Mönks, and Volker Lohweg. “Stable Image Acquisition for Mobile Image Processing Applications.” In IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI, 1–12. San Francisco, CA, USA: SPIE, 2015. https://doi.org/10.1117/12.2076146.","van":"Henning K-F, Fritze A, Gillich E, Mönks U, Lohweg V. Stable Image Acquisition for Mobile Image Processing Applications. In: IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI. San Francisco, CA, USA: SPIE; 2015. p. 1–12.","ufg":"Henning, Kai-Fabian et. al. (2015): Stable Image Acquisition for Mobile Image Processing Applications, in: IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI, San Francisco, CA, USA, S. 1–12.","bjps":"Henning K-F et al. (2015) Stable Image Acquisition for Mobile Image Processing Applications. IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI. San Francisco, CA, USA: SPIE, pp. 1–12.","havard":"K.-F. Henning, A. Fritze, E. Gillich, U. Mönks, V. Lohweg, Stable Image Acquisition for Mobile Image Processing Applications, in: IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI, SPIE, San Francisco, CA, USA, 2015: pp. 1–12.","mla":"Henning, Kai-Fabian, et al. “Stable Image Acquisition for Mobile Image Processing Applications.” IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI, SPIE, 2015, pp. 1–12, doi:10.1117/12.2076146.","ieee":"K.-F. Henning, A. Fritze, E. Gillich, U. Mönks, and V. Lohweg, “Stable Image Acquisition for Mobile Image Processing Applications,” in IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI, 2015, pp. 1–12.","ama":"Henning K-F, Fritze A, Gillich E, Mönks U, Lohweg V. Stable Image Acquisition for Mobile Image Processing Applications. In: IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI. San Francisco, CA, USA: SPIE; 2015:1-12. doi:10.1117/12.2076146"},"title":"Stable Image Acquisition for Mobile Image Processing Applications","_id":"2155","doi":"10.1117/12.2076146","place":"San Francisco, CA, USA","keyword":["Image processing","Image acquisition","Mobile devices Sensors","Image fusion","Motion estimation","Cameras"],"language":[{"iso":"eng"}],"oa":"1","user_id":"68554","date_updated":"2023-03-15T13:49:39Z","publication":"IST/SPIE Electronic Imaging 2015, Digital Photography and Mobile Imaging XI","type":"conference","date_created":"2019-12-04T10:07:01Z"},{"doi":"10.1109/MLSP.2007.4414320","_id":"2068","language":[{"iso":"eng"}],"keyword":["Sensor fusion","Inspection","Optical sensors","Printing machinery","Data security","Data analysis","Production","Degradation","Principal component analysis","Karhunen-Loeve transforms"],"place":"Thessaloniki, Greece","date_created":"2019-11-29T13:50:28Z","type":"conference","publication_identifier":{"isbn":["978-1-4244-1565-6"],"eisbn":["978-1-4244-1566-3"],"issn":["1551-2541 "],"unknown":["2378-928X "]},"date_updated":"2023-03-15T13:49:38Z","user_id":"45673","abstract":[{"text":"The production of printing goods is laborious. Furthermore, the print quality, especially in banknotes, must be assured. It is accepted, that print defects are generated because printing parameters, also machine parameters can change unnoticed. Therefore, a combined concept for a multi-sensory learning and classification model based on new adaptive fuzzy-pattern-classifiers for data inspection is proposed. This inspection concept, which combines optical, acoustical and other machine information, comes up with a large amount of data, which leads to multivariate methods for data analysis. Multivariate methods are useful for analysis of large and complex data sets that consist of many variables measured on large numbers of physical data.","lang":"eng"}],"department":[{"_id":"DEP5023"}],"year":2007,"author":[{"full_name":"Dyck, Walter","last_name":"Dyck","first_name":"Walter"},{"full_name":"Türke, Thomas","first_name":"Thomas","last_name":"Türke"},{"first_name":"Johannes","id":"2128","last_name":"Schaede","full_name":"Schaede, Johannes"},{"orcid":"0000-0002-3325-7887","first_name":"Volker","last_name":"Lohweg","id":"1804","full_name":"Lohweg, Volker"}],"main_file_link":[{"url":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4414320&tag=1"}],"publisher":"MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING","page":"accepted for publication","status":"public","title":"A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion","publication_status":"published","citation":{"van":"Dyck W, Türke T, Schaede J, Lohweg V. A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion. In Thessaloniki, Greece: MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING; 2007. p. accepted for publication.","havard":"W. Dyck, T. Türke, J. Schaede, V. Lohweg, A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion, in: MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING, Thessaloniki, Greece, 2007: p. accepted for publication.","mla":"Dyck, Walter, et al. A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion. MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING, 2007, p. accepted for publication, doi:10.1109/MLSP.2007.4414320.","bjps":"Dyck W et al. (2007) A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion. Thessaloniki, Greece: MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING, p. accepted for publication.","ufg":"Dyck, Walter et. al. (2007): A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion, in: , Thessaloniki, Greece, S. accepted for publication.","apa":"Dyck, W., Türke, T., Schaede, J., & Lohweg, V. (2007). A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion (p. accepted for publication). Thessaloniki, Greece: MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING. https://doi.org/10.1109/MLSP.2007.4414320","chicago":"Dyck, Walter, Thomas Türke, Johannes Schaede, and Volker Lohweg. “A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion,” accepted for publication. Thessaloniki, Greece: MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING, 2007. https://doi.org/10.1109/MLSP.2007.4414320.","short":"W. Dyck, T. Türke, J. Schaede, V. Lohweg, in: MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING, Thessaloniki, Greece, 2007, p. accepted for publication.","chicago-de":"Dyck, Walter, Thomas Türke, Johannes Schaede und Volker Lohweg. 2007. A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion. In: , accepted for publication. Thessaloniki, Greece: MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING. doi:10.1109/MLSP.2007.4414320, .","din1505-2-1":"Dyck, Walter ; Türke, Thomas ; Schaede, Johannes ; Lohweg, Volker: A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion. In: . Thessaloniki, Greece : MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING, 2007, S. accepted for publication","ama":"Dyck W, Türke T, Schaede J, Lohweg V. A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion. In: Thessaloniki, Greece: MLSP 2007 - International Workshop on MACHINE LEARNING FOR SIGNAL PROCESSING; 2007:accepted for publication. doi:10.1109/MLSP.2007.4414320","ieee":"W. Dyck, T. Türke, J. Schaede, and V. Lohweg, “A Fuzzy-Pattern-Classifier-Based Adaptive Learning Model for Sensor Fusion,” 2007, p. accepted for publication."}},{"main_file_link":[{"url":"https://ieeexplore.ieee.org/document/4086065/keywords#full-text-header"}],"year":2006,"author":[{"full_name":"Dyck, Walter","first_name":"Walter","last_name":"Dyck"},{"id":"2128","full_name":"Schaede, Johannes","last_name":"Schaede","first_name":"Johannes"},{"first_name":"Thomas","full_name":"Türke, Thomas","last_name":"Türke"},{"orcid":"0000-0002-3325-7887","last_name":"Lohweg","id":"1804","full_name":"Lohweg, Volker","first_name":"Volker"}],"department":[{"_id":"DEP5023"}],"abstract":[{"lang":"eng","text":"Bank note inspection is a complex task. As more and more print techniques and new security features are established, total quality security and bank note printing must be assured. Therefore, this factor necessitates change of a sensorial concept in general. We propose an optical-acoustical inspection method based upon the concepts of information fusion and fuzzy interpretation of data measures. Furthermore, we present a simplified scheme for information fusion for pattern recognition and data classification based on parametrical unimodal potential functions and a Sugeno-type score value analysis. Digital Object Identifier: 10.1109/ICIF.2006.301779
"}],"status":"public","page":"1-8","publisher":"9th International Conference on Information Fusion, 2006. ICIF '06","title":"Information Fusion Application On Security Printing With Parametrical Fuzzy Classification","citation":{"ama":"Dyck W, Schaede J, Türke T, Lohweg V. Information Fusion Application On Security Printing With Parametrical Fuzzy Classification. In: 2006 9th International Conference on Information Fusion. 9th International Conference on Information Fusion, 2006. ICIF ’06; 2006:1-8. doi:10.1109/ICIF.2006.301779","ieee":"W. Dyck, J. Schaede, T. Türke, and V. Lohweg, “Information Fusion Application On Security Printing With Parametrical Fuzzy Classification,” in 2006 9th International Conference on Information Fusion, 2006, pp. 1–8.","din1505-2-1":"Dyck, Walter ; Schaede, Johannes ; Türke, Thomas ; Lohweg, Volker: Information Fusion Application On Security Printing With Parametrical Fuzzy Classification. In: 2006 9th International Conference on Information Fusion : 9th International Conference on Information Fusion, 2006. ICIF ’06, 2006, S. 1–8","chicago-de":"Dyck, Walter, Johannes Schaede, Thomas Türke und Volker Lohweg. 2006. Information Fusion Application On Security Printing With Parametrical Fuzzy Classification. In: 2006 9th International Conference on Information Fusion, 1–8. 9th International Conference on Information Fusion, 2006. ICIF ’06. doi:10.1109/ICIF.2006.301779, .","short":"W. Dyck, J. Schaede, T. Türke, V. Lohweg, in: 2006 9th International Conference on Information Fusion, 9th International Conference on Information Fusion, 2006. ICIF ’06, 2006, pp. 1–8.","mla":"Dyck, Walter, et al. “Information Fusion Application On Security Printing With Parametrical Fuzzy Classification.” 2006 9th International Conference on Information Fusion, 9th International Conference on Information Fusion, 2006. ICIF ’06, 2006, pp. 1–8, doi:10.1109/ICIF.2006.301779.","havard":"W. Dyck, J. Schaede, T. Türke, V. Lohweg, Information Fusion Application On Security Printing With Parametrical Fuzzy Classification, in: 2006 9th International Conference on Information Fusion, 9th International Conference on Information Fusion, 2006. ICIF ’06, 2006: pp. 1–8.","bjps":"Dyck W et al. (2006) Information Fusion Application On Security Printing With Parametrical Fuzzy Classification. 2006 9th International Conference on Information Fusion. 9th International Conference on Information Fusion, 2006. ICIF ’06, pp. 1–8.","ufg":"Dyck, Walter et. al. (2006): Information Fusion Application On Security Printing With Parametrical Fuzzy Classification, in: 2006 9th International Conference on Information Fusion, S. 1–8.","van":"Dyck W, Schaede J, Türke T, Lohweg V. Information Fusion Application On Security Printing With Parametrical Fuzzy Classification. In: 2006 9th International Conference on Information Fusion. 9th International Conference on Information Fusion, 2006. ICIF ’06; 2006. p. 1–8.","chicago":"Dyck, Walter, Johannes Schaede, Thomas Türke, and Volker Lohweg. “Information Fusion Application On Security Printing With Parametrical Fuzzy Classification.” In 2006 9th International Conference on Information Fusion, 1–8. 9th International Conference on Information Fusion, 2006. ICIF ’06, 2006. https://doi.org/10.1109/ICIF.2006.301779.","apa":"Dyck, W., Schaede, J., Türke, T., & Lohweg, V. (2006). Information Fusion Application On Security Printing With Parametrical Fuzzy Classification. In 2006 9th International Conference on Information Fusion (pp. 1–8). 9th International Conference on Information Fusion, 2006. ICIF ’06. https://doi.org/10.1109/ICIF.2006.301779"},"publication_status":"published","keyword":["Information security","Inspection","Printing machinery","Optical sensors","Data security","Personnel","Fuzzy systems","Sensor systems","Expert systems","Ink"],"language":[{"iso":"eng"}],"_id":"2062","doi":"10.1109/ICIF.2006.301779","publication":" 2006 9th International Conference on Information Fusion","publication_identifier":{"isbn":[" 1-4244-0953-5"]},"type":"conference","date_created":"2019-11-29T13:35:03Z","user_id":"45673","date_updated":"2023-03-15T13:49:38Z"}]