[{"date_created":"2025-04-15T09:36:32Z","type":"conference_editor_article","user_id":"83781","publisher":"IEEE","date_updated":"2025-04-15T09:42:27Z","department":[{"_id":"DEP5023"},{"_id":"DEP5000"}],"_id":"12793","keyword":["secure","factory communication","elliptic curves","ECDHKE","performance","embedded"],"title":"Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System","author":[{"first_name":"Lisa Helene","id":"76524","full_name":"Gebauer, Lisa Helene","last_name":"Gebauer"},{"last_name":"Trsek","id":"1486","full_name":"Trsek, Henning","orcid":"0000-0002-0133-0656","first_name":"Henning"},{"id":"1031","full_name":"Heiss, Stefan","first_name":"Stefan","last_name":"Heiss"}],"language":[{"iso":"eng"}],"page":"207-210","abstract":[{"lang":"eng","text":"Securing factory communication to protect corporate data is an important concern in the context of the Industrial Internet of Things (IIoT). Various cryptographic protocols can be used to establish secure communication channels. One of these protocols is the Transport Layer Security 1.3 (TLS 1.3) protocol. A key component of the TLS handshake protocol is the Elliptic Curve Diffie-Hellman Key Exchange (ECDHKE), a public key cryptosystem used to exchange keys over insecure channels which can be based on a number of standardized elliptic curves. A special form of elliptic curves are Montgomery curves which are advantageous compared to more traditional Weierstrass curves due to their fast arithmetic. This is especially important when the ECDHKE is performed on embedded devices and in time-critical situations. In this work, the performance of ECDHKE implementations using standardized Montgomery curves Curve25519 and Curve448 included in the wolfSSL library are evaluated on an embedded 32-bit STM32L476RG Nucleo development board designed by STMicroelectronics. The benchmark results show that using Curve25519 with around 220ms for the key pair generation and the key agreement respectively is approximately 75% faster than using Curve448 with around 900ms for each of the algorithms, which can be attributed to their differing security levels. These results suggest that the algorithms might not be fast enough for time critical situations."}],"publication_identifier":{"isbn":["978-1-6654-1087-8"],"eisbn":["978-1-6654-1086-1"]},"publication_status":"published","citation":{"din1505-2-1":"<span style=\"font-variant:small-caps;\">Gebauer, Lisa Helene</span> ; <span style=\"font-variant:small-caps;\">Trsek, Henning</span> ; <span style=\"font-variant:small-caps;\">Heiss, Stefan</span> ; <span style=\"font-variant:small-caps;\">inIT /TH-OWL</span> ; <span style=\"font-variant:small-caps;\">Università degli studi di Pavia </span> (Hrsg.): <i>Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System</i>. [Piscataway, NJ] : IEEE, 2022","havard":"L.H. Gebauer, H. Trsek, S. Heiss, Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System, IEEE, [Piscataway, NJ], 2022.","apa":"Gebauer, L. H., Trsek, H., &#38; Heiss, S. (2022). Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System. In inIT /TH-OWL &#38; Università degli studi di Pavia  (Eds.), <i>2022 IEEE 18th International Conference on Factory Communication Systems (WFCS)</i> (pp. 207–210). IEEE. <a href=\"https://doi.org/10.1109/wfcs53837.2022.9779189\">https://doi.org/10.1109/wfcs53837.2022.9779189</a>","ieee":"L. H. Gebauer, H. Trsek, and S. Heiss, <i>Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System</i>. [Piscataway, NJ]: IEEE, 2022, pp. 207–210. doi: <a href=\"https://doi.org/10.1109/wfcs53837.2022.9779189\">10.1109/wfcs53837.2022.9779189</a>.","van":"Gebauer LH, Trsek H, Heiss S. Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System. inIT /TH-OWL, Università degli studi di Pavia , editors. 2022 IEEE 18th International Conference on Factory Communication Systems (WFCS). [Piscataway, NJ]: IEEE; 2022.","short":"L.H. Gebauer, H. Trsek, S. Heiss, Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System, IEEE, [Piscataway, NJ], 2022.","chicago":"Gebauer, Lisa Helene, Henning Trsek, and Stefan Heiss. <i>Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System</i>. Edited by inIT /TH-OWL and Università degli studi di Pavia . <i>2022 IEEE 18th International Conference on Factory Communication Systems (WFCS)</i>. [Piscataway, NJ]: IEEE, 2022. <a href=\"https://doi.org/10.1109/wfcs53837.2022.9779189\">https://doi.org/10.1109/wfcs53837.2022.9779189</a>.","bjps":"<b>Gebauer LH, Trsek H and Heiss S</b> (2022) <i>Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System</i>, inIT /TH-OWL and Università degli studi di Pavia  (eds). [Piscataway, NJ]: IEEE.","chicago-de":"Gebauer, Lisa Helene, Henning Trsek und Stefan Heiss. 2022. <i>Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System</i>. Hg. von inIT /TH-OWL und Università degli studi di Pavia . <i>2022 IEEE 18th International Conference on Factory Communication Systems (WFCS)</i>. [Piscataway, NJ]: IEEE. doi:<a href=\"https://doi.org/10.1109/wfcs53837.2022.9779189\">10.1109/wfcs53837.2022.9779189</a>, .","ama":"Gebauer LH, Trsek H, Heiss S. <i>Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System</i>. (inIT /TH-OWL, Università degli studi di Pavia , eds.). IEEE; 2022:207-210. doi:<a href=\"https://doi.org/10.1109/wfcs53837.2022.9779189\">10.1109/wfcs53837.2022.9779189</a>","ufg":"<b>Gebauer, Lisa Helene/Trsek, Henning/Heiss, Stefan</b>: Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System, hg. von inIT /TH-OWL, Università degli studi di Pavia , [Piscataway, NJ] 2022.","mla":"Gebauer, Lisa Helene, et al. “Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System.” <i>2022 IEEE 18th International Conference on Factory Communication Systems (WFCS)</i>, edited by inIT /TH-OWL and Università degli studi di Pavia , IEEE, 2022, pp. 207–10, <a href=\"https://doi.org/10.1109/wfcs53837.2022.9779189\">https://doi.org/10.1109/wfcs53837.2022.9779189</a>."},"publication":"2022 IEEE 18th International Conference on Factory Communication Systems (WFCS)","conference":{"end_date":"2022-04-29","location":"Pavia, ITALY","name":"18th IEEE International Workshop on Factory Communication Systems (WFCS) - Communication in Automation","start_date":"2022-04-27"},"place":"[Piscataway, NJ]","year":"2022","status":"public","doi":"10.1109/wfcs53837.2022.9779189","corporate_editor":["inIT /TH-OWL","Università degli studi di Pavia "]},{"_id":"554","series_title":"Publication series in direct digital manufacturing","keyword":["Additive manufacturing","Embedded optical waveguides","Optical sensors","SLA technology","FLM technology"],"title":"Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications","author":[{"first_name":"Micha","id":"71403","full_name":"Beyer, Micha","last_name":"Beyer"},{"last_name":"Stübbe","first_name":"Oliver","orcid":"https://orcid.org/0000-0001-7293-6893","full_name":"Stübbe, Oliver","id":"51864"},{"last_name":"Villmer","first_name":"Franz-Josef","full_name":"Villmer, Franz-Josef","id":"14290"}],"language":[{"iso":"eng"}],"page":"70-82","date_created":"2019-02-13T14:29:45Z","editor":[{"first_name":"Franz-Josef","full_name":"Villmer, Franz-Josef","last_name":"Villmer"},{"last_name":"Padoano","first_name":"Elio","full_name":"Padoano, Elio"}],"type":"conference","user_id":"51864","date_updated":"2024-04-19T12:56:30Z","department":[{"_id":"DEP1306"},{"_id":"DEP5000"},{"_id":"DEP5020"},{"_id":"DEP6020"}],"publication":"Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany","conference":{"start_date":"2018-10-04","end_date":"2018-10-05","name":"Proceedings 8th International Conference","location":"Lemgo"},"place":"Lemgo","year":"2018","status":"public","corporate_editor":["Department of Production Engineering and Management","Hochschule Ostwestfalen-Lippe"],"publication_identifier":{"isbn":["978-3-946856-03-0"]},"publication_status":"published","abstract":[{"text":"Light guiding structures, like optical waveguides or fibers, take an important role in several industries, e.g. communication, sensing, illumination or medical applications. For the latter, it could be very interesting to have the possibility to manufacture problem-adapted structureswith a mechanicalfunctionality andwith additional embedded optical or electrical sensor functionalities.Modern additive manufacturing (AM) technologies like Stereolithography (SLA) or Fused Layer Modeling (FLM) may provide these opportunities.This paper is aimedto figure out the light guiding opportunities of both technologies. For this different kind of structures are built by FLM and SLA. To compare both manufacturing technologies, the layout of each structure is identical for both technologies. After manufacturing, the transmission and the attenuation of the guided light of these structures areanalyzed by measurement.Then the measurement results of the different technologies are compared with each other.","lang":"eng"}],"citation":{"din1505-2-1":"<span style=\"font-variant:small-caps;\">Beyer, Micha</span> ; <span style=\"font-variant:small-caps;\">Stübbe, Oliver</span> ; <span style=\"font-variant:small-caps;\">Villmer, Franz-Josef</span>: Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In: <span style=\"font-variant:small-caps;\">Villmer, F.-J.</span> ; <span style=\"font-variant:small-caps;\">Padoano, E.</span> ; <span style=\"font-variant:small-caps;\">Department of Production Engineering and Management</span> ; <span style=\"font-variant:small-caps;\">Hochschule Ostwestfalen-Lippe</span> (Hrsg.): <i>Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany</i>, <i>Publication series in direct digital manufacturing</i>. Lemgo, 2018, S. 70–82","ieee":"M. Beyer, O. Stübbe, and F.-J. Villmer, “Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications,” in <i>Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany</i>, Lemgo, 2018, no. 1, pp. 70–82.","havard":"M. Beyer, O. Stübbe, F.-J. Villmer, Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications, in: F.-J. Villmer, E. Padoano, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany, Lemgo, 2018: pp. 70–82.","apa":"Beyer, M., Stübbe, O., &#38; Villmer, F.-J. (2018). Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In F.-J. Villmer, E. Padoano, Department of Production Engineering and Management, &#38; Hochschule Ostwestfalen-Lippe (Eds.), <i>Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany</i> (Issue 1, pp. 70–82).","ama":"Beyer M, Stübbe O, Villmer FJ. Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In: Villmer FJ, Padoano E, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, eds. <i>Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany</i>. Publication series in direct digital manufacturing. ; 2018:70-82.","mla":"Beyer, Micha, et al. “Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications.” <i>Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany</i>, edited by Franz-Josef Villmer et al., no. 1, 2018, pp. 70–82.","ufg":"<b>Beyer, Micha/Stübbe, Oliver/Villmer, Franz-Josef</b>: Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications, in: <i>Villmer, Franz-Josef u. a. (Hgg.)</i>: Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany, Lemgo 2018 (Publication series in direct digital manufacturing),  S. 70–82.","bjps":"<b>Beyer M, Stübbe O and Villmer F-J</b> (2018) Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In Villmer F-J et al. (eds), <i>Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany</i>. Lemgo, pp. 70–82.","short":"M. Beyer, O. Stübbe, F.-J. Villmer, in: F.-J. Villmer, E. Padoano, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany, Lemgo, 2018, pp. 70–82.","van":"Beyer M, Stübbe O, Villmer FJ. Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In: Villmer FJ, Padoano E, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, editors. Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany. Lemgo; 2018. p. 70–82. (Publication series in direct digital manufacturing).","chicago-de":"Beyer, Micha, Oliver Stübbe und Franz-Josef Villmer. 2018. Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications. In: <i>Production engineering and management : proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany</i>, hg. von Franz-Josef Villmer, Elio Padoano, Department of Production Engineering and Management, und Hochschule Ostwestfalen-Lippe, 70–82. Publication series in direct digital manufacturing. Lemgo.","chicago":"Beyer, Micha, Oliver Stübbe, and Franz-Josef Villmer. “Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications.” In <i>Production Engineering and Management : Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany</i>, edited by Franz-Josef Villmer, Elio Padoano, Department of Production Engineering and Management, and Hochschule Ostwestfalen-Lippe, 70–82. Publication Series in Direct Digital Manufacturing. Lemgo, 2018."},"issue":"1"},{"date_updated":"2024-04-19T12:58:56Z","user_id":"51864","extern":"1","department":[{"_id":"DEP1306"},{"_id":"DEP5020"},{"_id":"DEP5000"},{"_id":"DEP6020"}],"date_created":"2019-02-18T11:16:07Z","type":"conference","editor":[{"full_name":"Padoano, Elio","first_name":"Elio","last_name":"Padoano"},{"first_name":"Franz-Josef","id":"14290","full_name":"Villmer, Franz-Josef","last_name":"Villmer"}],"page":"127-136","language":[{"iso":"eng"}],"keyword":["Additive manufacturing","Embedded optical waveguides","Electrical conductors","Embedded systems","FLM technology","Sensors"],"_id":"573","quality_controlled":"1","series_title":"Publication series in direct digital manufacturing ","main_file_link":[{"open_access":"1","url":"https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf"}],"author":[{"first_name":"Patrick","full_name":"Ehlert, Patrick","id":"62091","last_name":"Ehlert"},{"id":"51864","full_name":"Stübbe, Oliver","orcid":"https://orcid.org/0000-0001-7293-6893","first_name":"Oliver","last_name":"Stübbe"},{"first_name":"Franz-Josef","full_name":"Villmer, Franz-Josef","id":"14290","last_name":"Villmer"}],"title":"Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology","citation":{"chicago-de":"Ehlert, Patrick, Oliver Stübbe und Franz-Josef Villmer. 2017. Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: <i>Production Engineering and Management</i>, hg. von Elio Padoano, Franz-Josef Villmer, Department of Production Engineering and Management, und Hochschule Ostwestfalen-Lippe, 127–136. Publication series in direct digital manufacturing . Lemgo.","chicago":"Ehlert, Patrick, Oliver Stübbe, and Franz-Josef Villmer. “Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology.” In <i>Production Engineering and Management</i>, edited by Elio Padoano, Franz-Josef Villmer, Department of Production Engineering and Management, and Hochschule Ostwestfalen-Lippe, 127–36. Publication Series in Direct Digital Manufacturing . Lemgo, 2017.","short":"P. Ehlert, O. Stübbe, F.-J. Villmer, in: E. Padoano, F.-J. Villmer, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management, Lemgo, 2017, pp. 127–136.","van":"Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, editors. Production Engineering and Management. Lemgo; 2017. p. 127–36. (Publication series in direct digital manufacturing ).","ama":"Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, eds. <i>Production Engineering and Management</i>. Publication series in direct digital manufacturing . ; 2017:127-136.","ufg":"<b>Ehlert, Patrick/Stübbe, Oliver/Villmer, Franz-Josef</b>: Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology, in: <i>Padoano, Elio u. a. (Hgg.)</i>: Production Engineering and Management, Lemgo 2017 (Publication series in direct digital manufacturing ),  S. 127–136.","mla":"Ehlert, Patrick, et al. “Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology.” <i>Production Engineering and Management</i>, edited by Elio Padoano et al., no. 1, 2017, pp. 127–36.","bjps":"<b>Ehlert P, Stübbe O and Villmer F-J</b> (2017) Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In Padoano E et al. (eds), <i>Production Engineering and Management</i>. Lemgo, pp. 127–136.","havard":"P. Ehlert, O. Stübbe, F.-J. Villmer, Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology, in: E. Padoano, F.-J. Villmer, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management, Lemgo, 2017: pp. 127–136.","apa":"Ehlert, P., Stübbe, O., &#38; Villmer, F.-J. (2017). Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In E. Padoano, F.-J. Villmer, Department of Production Engineering and Management, &#38; Hochschule Ostwestfalen-Lippe (Eds.), <i>Production Engineering and Management</i> (Issue 1, pp. 127–136).","ieee":"P. Ehlert, O. Stübbe, and F.-J. Villmer, “Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology,” in <i>Production Engineering and Management</i>, Pordenone, Italy, 2017, no. 1, pp. 127–136.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Ehlert, Patrick</span> ; <span style=\"font-variant:small-caps;\">Stübbe, Oliver</span> ; <span style=\"font-variant:small-caps;\">Villmer, Franz-Josef</span>: Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: <span style=\"font-variant:small-caps;\">Padoano, E.</span> ; <span style=\"font-variant:small-caps;\">Villmer, F.-J.</span> ; <span style=\"font-variant:small-caps;\">Department of Production Engineering and Management</span> ; <span style=\"font-variant:small-caps;\">Hochschule Ostwestfalen-Lippe</span> (Hrsg.): <i>Production Engineering and Management</i>, <i>Publication series in direct digital manufacturing </i>. Lemgo, 2017, S. 127–136"},"issue":"1","abstract":[{"lang":"eng","text":"Additive manufacturing (AM) technologies have not only revolutionized product development and design by enabling rapid prototyping. They also gained influence on production in general, mainly because of their direct manufacturing capabilities. In the context of Industry 4.0 and the related process automation, innovative and advanced production technologies with completely new approaches are required [1]. AM technologies contribute to this with their advantages like freedom of design, cost efficient product individualization, and functional integration. On the other hand, AM still shows shortcomings in exploiting its full potential. Most current AM technologies are only applicable for manufacturing with singular materials. In particular, opportunities for processing of optically or electrically conductive materials are still missing. This paper contributes to the advancement of additive manufacturing of two different material variants or even two completely different materials. A special focus is laid on producing a part that combines mechanical with optical or electrical functionalities in one process step. The ultimate goal is to integrate sensor functionalities into an AM object, e.g. strain gauges. Extrusion processes, predominantly Fused Layer Modeling (FLM), are preferred in this research due to their mechanically simple machine setup in which additional functional materials can be adapted easily to the build process. In a first step, the general manufacturability has been evaluated. Thereafter, the resulting optical transmission properties have been analyzed. Especially the attenuation has to remain below a threshold value to accomplish a minimum signal-to-noise ratio."}],"publication_status":"published","oa":"1","publication_identifier":{"isbn":["978-3-946856-01-6"]},"corporate_editor":["Department of Production Engineering and Management","Hochschule Ostwestfalen-Lippe"],"place":"Lemgo","related_material":{"link":[{"relation":"contains","url":"https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf"}]},"publication":"Production Engineering and Management","conference":{"end_date":"2017-09-29","name":"Proceedings7th International Conference","location":"Pordenone, Italy","start_date":"2017-09-28"},"status":"public","year":"2017"}]