---
_id: '12793'
abstract:
- lang: eng
  text: Securing factory communication to protect corporate data is an important concern
    in the context of the Industrial Internet of Things (IIoT). Various cryptographic
    protocols can be used to establish secure communication channels. One of these
    protocols is the Transport Layer Security 1.3 (TLS 1.3) protocol. A key component
    of the TLS handshake protocol is the Elliptic Curve Diffie-Hellman Key Exchange
    (ECDHKE), a public key cryptosystem used to exchange keys over insecure channels
    which can be based on a number of standardized elliptic curves. A special form
    of elliptic curves are Montgomery curves which are advantageous compared to more
    traditional Weierstrass curves due to their fast arithmetic. This is especially
    important when the ECDHKE is performed on embedded devices and in time-critical
    situations. In this work, the performance of ECDHKE implementations using standardized
    Montgomery curves Curve25519 and Curve448 included in the wolfSSL library are
    evaluated on an embedded 32-bit STM32L476RG Nucleo development board designed
    by STMicroelectronics. The benchmark results show that using Curve25519 with around
    220ms for the key pair generation and the key agreement respectively is approximately
    75% faster than using Curve448 with around 900ms for each of the algorithms, which
    can be attributed to their differing security levels. These results suggest that
    the algorithms might not be fast enough for time critical situations.
author:
- first_name: Lisa Helene
  full_name: Gebauer, Lisa Helene
  id: '76524'
  last_name: Gebauer
- first_name: Henning
  full_name: Trsek, Henning
  id: '1486'
  last_name: Trsek
  orcid: 0000-0002-0133-0656
- first_name: Stefan
  full_name: Heiss, Stefan
  id: '1031'
  last_name: Heiss
citation:
  ama: Gebauer LH, Trsek H, Heiss S. <i>Secure Communication in Factories - Benchmarking
    Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System</i>.
    (inIT /TH-OWL, Università degli studi di Pavia , eds.). IEEE; 2022:207-210. doi:<a
    href="https://doi.org/10.1109/wfcs53837.2022.9779189">10.1109/wfcs53837.2022.9779189</a>
  apa: Gebauer, L. H., Trsek, H., &#38; Heiss, S. (2022). Secure Communication in
    Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations
    on an Embedded System. In inIT /TH-OWL &#38; Università degli studi di Pavia  (Eds.),
    <i>2022 IEEE 18th International Conference on Factory Communication Systems (WFCS)</i>
    (pp. 207–210). IEEE. <a href="https://doi.org/10.1109/wfcs53837.2022.9779189">https://doi.org/10.1109/wfcs53837.2022.9779189</a>
  bjps: '<b>Gebauer LH, Trsek H and Heiss S</b> (2022) <i>Secure Communication in
    Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations
    on an Embedded System</i>, inIT /TH-OWL and Università degli studi di Pavia  (eds).
    [Piscataway, NJ]: IEEE.'
  chicago: 'Gebauer, Lisa Helene, Henning Trsek, and Stefan Heiss. <i>Secure Communication
    in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations
    on an Embedded System</i>. Edited by inIT /TH-OWL and Università degli studi di
    Pavia . <i>2022 IEEE 18th International Conference on Factory Communication Systems
    (WFCS)</i>. [Piscataway, NJ]: IEEE, 2022. <a href="https://doi.org/10.1109/wfcs53837.2022.9779189">https://doi.org/10.1109/wfcs53837.2022.9779189</a>.'
  chicago-de: 'Gebauer, Lisa Helene, Henning Trsek und Stefan Heiss. 2022. <i>Secure
    Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange
    Implementations on an Embedded System</i>. Hg. von inIT /TH-OWL und Università
    degli studi di Pavia . <i>2022 IEEE 18th International Conference on Factory Communication
    Systems (WFCS)</i>. [Piscataway, NJ]: IEEE. doi:<a href="https://doi.org/10.1109/wfcs53837.2022.9779189">10.1109/wfcs53837.2022.9779189</a>,
    .'
  din1505-2-1: '<span style="font-variant:small-caps;">Gebauer, Lisa Helene</span>
    ; <span style="font-variant:small-caps;">Trsek, Henning</span> ; <span style="font-variant:small-caps;">Heiss,
    Stefan</span> ; <span style="font-variant:small-caps;">inIT /TH-OWL</span> ; <span
    style="font-variant:small-caps;">Università degli studi di Pavia </span> (Hrsg.):
    <i>Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman
    Key Exchange Implementations on an Embedded System</i>. [Piscataway, NJ] : IEEE,
    2022'
  havard: L.H. Gebauer, H. Trsek, S. Heiss, Secure Communication in Factories - Benchmarking
    Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System,
    IEEE, [Piscataway, NJ], 2022.
  ieee: 'L. H. Gebauer, H. Trsek, and S. Heiss, <i>Secure Communication in Factories
    - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations on an
    Embedded System</i>. [Piscataway, NJ]: IEEE, 2022, pp. 207–210. doi: <a href="https://doi.org/10.1109/wfcs53837.2022.9779189">10.1109/wfcs53837.2022.9779189</a>.'
  mla: Gebauer, Lisa Helene, et al. “Secure Communication in Factories - Benchmarking
    Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System.”
    <i>2022 IEEE 18th International Conference on Factory Communication Systems (WFCS)</i>,
    edited by inIT /TH-OWL and Università degli studi di Pavia , IEEE, 2022, pp. 207–10,
    <a href="https://doi.org/10.1109/wfcs53837.2022.9779189">https://doi.org/10.1109/wfcs53837.2022.9779189</a>.
  short: L.H. Gebauer, H. Trsek, S. Heiss, Secure Communication in Factories - Benchmarking
    Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System,
    IEEE, [Piscataway, NJ], 2022.
  ufg: '<b>Gebauer, Lisa Helene/Trsek, Henning/Heiss, Stefan</b>: Secure Communication
    in Factories - Benchmarking Elliptic Curve Diffie-Hellman Key Exchange Implementations
    on an Embedded System, hg. von inIT /TH-OWL, Università degli studi di Pavia ,
    [Piscataway, NJ] 2022.'
  van: 'Gebauer LH, Trsek H, Heiss S. Secure Communication in Factories - Benchmarking
    Elliptic Curve Diffie-Hellman Key Exchange Implementations on an Embedded System.
    inIT /TH-OWL, Università degli studi di Pavia , editors. 2022 IEEE 18th International
    Conference on Factory Communication Systems (WFCS). [Piscataway, NJ]: IEEE; 2022.'
conference:
  end_date: 2022-04-29
  location: Pavia, ITALY
  name: 18th IEEE International Workshop on Factory Communication Systems (WFCS) -
    Communication in Automation
  start_date: 2022-04-27
corporate_editor:
- inIT /TH-OWL
- 'Università degli studi di Pavia '
date_created: 2025-04-15T09:36:32Z
date_updated: 2025-04-15T09:42:27Z
department:
- _id: DEP5023
- _id: DEP5000
doi: 10.1109/wfcs53837.2022.9779189
keyword:
- secure
- factory communication
- elliptic curves
- ECDHKE
- performance
- embedded
language:
- iso: eng
page: 207-210
place: '[Piscataway, NJ]'
publication: 2022 IEEE 18th International Conference on Factory Communication Systems
  (WFCS)
publication_identifier:
  eisbn:
  - 978-1-6654-1086-1
  isbn:
  - 978-1-6654-1087-8
publication_status: published
publisher: IEEE
status: public
title: Secure Communication in Factories - Benchmarking Elliptic Curve Diffie-Hellman
  Key Exchange Implementations on an Embedded System
type: conference_editor_article
user_id: '83781'
year: '2022'
...
---
_id: '554'
abstract:
- lang: eng
  text: Light guiding structures, like optical waveguides or fibers, take an important
    role in several industries, e.g. communication, sensing, illumination or medical
    applications. For the latter, it could be very interesting to have the possibility
    to manufacture problem-adapted structureswith a mechanicalfunctionality andwith
    additional embedded optical or electrical sensor functionalities.Modern additive
    manufacturing (AM) technologies like Stereolithography (SLA) or Fused Layer Modeling
    (FLM) may provide these opportunities.This paper is aimedto figure out the light
    guiding opportunities of both technologies. For this different kind of structures
    are built by FLM and SLA. To compare both manufacturing technologies, the layout
    of each structure is identical for both technologies. After manufacturing, the
    transmission and the attenuation of the guided light of these structures areanalyzed
    by measurement.Then the measurement results of the different technologies are
    compared with each other.
author:
- first_name: Micha
  full_name: Beyer, Micha
  id: '71403'
  last_name: Beyer
- first_name: Oliver
  full_name: Stübbe, Oliver
  id: '51864'
  last_name: Stübbe
  orcid: https://orcid.org/0000-0001-7293-6893
- first_name: Franz-Josef
  full_name: Villmer, Franz-Josef
  id: '14290'
  last_name: Villmer
citation:
  ama: 'Beyer M, Stübbe O, Villmer FJ. Comparsion of FLM and SLA Processing Technologies
    Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications.
    In: Villmer FJ, Padoano E, Department of Production Engineering and Management,
    Hochschule Ostwestfalen-Lippe, eds. <i>Production Engineering and Management :
    Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany</i>.
    Publication series in direct digital manufacturing. ; 2018:70-82.'
  apa: 'Beyer, M., Stübbe, O., &#38; Villmer, F.-J. (2018). Comparsion of FLM and
    SLA Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi
    and Sensing Applications. In F.-J. Villmer, E. Padoano, Department of Production
    Engineering and Management, &#38; Hochschule Ostwestfalen-Lippe (Eds.), <i>Production
    engineering and management : proceedings 8th international conference, October
    04 and 05, 2018, Lemgo, Germany</i> (Issue 1, pp. 70–82).'
  bjps: '<b>Beyer M, Stübbe O and Villmer F-J</b> (2018) Comparsion of FLM and SLA
    Processing Technologies Towards Manufacturing of Optical Waveguides for Communicationi
    and Sensing Applications. In Villmer F-J et al. (eds), <i>Production Engineering
    and Management : Proceedings 8th International Conference, October 04 and 05,
    2018, Lemgo, Germany</i>. Lemgo, pp. 70–82.'
  chicago: 'Beyer, Micha, Oliver Stübbe, and Franz-Josef Villmer. “Comparsion of FLM
    and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for
    Communicationi and Sensing Applications.” In <i>Production Engineering and Management :
    Proceedings 8th International Conference, October 04 and 05, 2018, Lemgo, Germany</i>,
    edited by Franz-Josef Villmer, Elio Padoano, Department of Production Engineering
    and Management, and Hochschule Ostwestfalen-Lippe, 70–82. Publication Series in
    Direct Digital Manufacturing. Lemgo, 2018.'
  chicago-de: 'Beyer, Micha, Oliver Stübbe und Franz-Josef Villmer. 2018. Comparsion
    of FLM and SLA Processing Technologies Towards Manufacturing of Optical Waveguides
    for Communicationi and Sensing Applications. In: <i>Production engineering and
    management : proceedings 8th international conference, October 04 and 05, 2018,
    Lemgo, Germany</i>, hg. von Franz-Josef Villmer, Elio Padoano, Department of Production
    Engineering and Management, und Hochschule Ostwestfalen-Lippe, 70–82. Publication
    series in direct digital manufacturing. Lemgo.'
  din1505-2-1: '<span style="font-variant:small-caps;">Beyer, Micha</span> ; <span
    style="font-variant:small-caps;">Stübbe, Oliver</span> ; <span style="font-variant:small-caps;">Villmer,
    Franz-Josef</span>: Comparsion of FLM and SLA Processing Technologies Towards
    Manufacturing of Optical Waveguides for Communicationi and Sensing Applications.
    In: <span style="font-variant:small-caps;">Villmer, F.-J.</span> ; <span style="font-variant:small-caps;">Padoano,
    E.</span> ; <span style="font-variant:small-caps;">Department of Production Engineering
    and Management</span> ; <span style="font-variant:small-caps;">Hochschule Ostwestfalen-Lippe</span>
    (Hrsg.): <i>Production engineering and management : proceedings 8th international
    conference, October 04 and 05, 2018, Lemgo, Germany</i>, <i>Publication series
    in direct digital manufacturing</i>. Lemgo, 2018, S. 70–82'
  havard: 'M. Beyer, O. Stübbe, F.-J. Villmer, Comparsion of FLM and SLA Processing
    Technologies Towards Manufacturing of Optical Waveguides for Communicationi and
    Sensing Applications, in: F.-J. Villmer, E. Padoano, Department of Production
    Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering
    and Management : Proceedings 8th International Conference, October 04 and 05,
    2018, Lemgo, Germany, Lemgo, 2018: pp. 70–82.'
  ieee: 'M. Beyer, O. Stübbe, and F.-J. Villmer, “Comparsion of FLM and SLA Processing
    Technologies Towards Manufacturing of Optical Waveguides for Communicationi and
    Sensing Applications,” in <i>Production engineering and management : proceedings
    8th international conference, October 04 and 05, 2018, Lemgo, Germany</i>, Lemgo,
    2018, no. 1, pp. 70–82.'
  mla: 'Beyer, Micha, et al. “Comparsion of FLM and SLA Processing Technologies Towards
    Manufacturing of Optical Waveguides for Communicationi and Sensing Applications.”
    <i>Production Engineering and Management : Proceedings 8th International Conference,
    October 04 and 05, 2018, Lemgo, Germany</i>, edited by Franz-Josef Villmer et
    al., no. 1, 2018, pp. 70–82.'
  short: 'M. Beyer, O. Stübbe, F.-J. Villmer, in: F.-J. Villmer, E. Padoano, Department
    of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.),
    Production Engineering and Management : Proceedings 8th International Conference,
    October 04 and 05, 2018, Lemgo, Germany, Lemgo, 2018, pp. 70–82.'
  ufg: '<b>Beyer, Micha/Stübbe, Oliver/Villmer, Franz-Josef</b>: Comparsion of FLM
    and SLA Processing Technologies Towards Manufacturing of Optical Waveguides for
    Communicationi and Sensing Applications, in: <i>Villmer, Franz-Josef u. a. (Hgg.)</i>:
    Production engineering and management : proceedings 8th international conference,
    October 04 and 05, 2018, Lemgo, Germany, Lemgo 2018 (Publication series in direct
    digital manufacturing),  S. 70–82.'
  van: 'Beyer M, Stübbe O, Villmer FJ. Comparsion of FLM and SLA Processing Technologies
    Towards Manufacturing of Optical Waveguides for Communicationi and Sensing Applications.
    In: Villmer FJ, Padoano E, Department of Production Engineering and Management,
    Hochschule Ostwestfalen-Lippe, editors. Production engineering and management :
    proceedings 8th international conference, October 04 and 05, 2018, Lemgo, Germany.
    Lemgo; 2018. p. 70–82. (Publication series in direct digital manufacturing).'
conference:
  end_date: 2018-10-05
  location: Lemgo
  name: Proceedings 8th International Conference
  start_date: 2018-10-04
corporate_editor:
- Department of Production Engineering and Management
- Hochschule Ostwestfalen-Lippe
date_created: 2019-02-13T14:29:45Z
date_updated: 2024-04-19T12:56:30Z
department:
- _id: DEP1306
- _id: DEP5000
- _id: DEP5020
- _id: DEP6020
editor:
- first_name: Franz-Josef
  full_name: Villmer, Franz-Josef
  last_name: Villmer
- first_name: Elio
  full_name: Padoano, Elio
  last_name: Padoano
issue: '1'
keyword:
- Additive manufacturing
- Embedded optical waveguides
- Optical sensors
- SLA technology
- FLM technology
language:
- iso: eng
page: 70-82
place: Lemgo
publication: 'Production engineering and management : proceedings 8th international
  conference, October 04 and 05, 2018, Lemgo, Germany'
publication_identifier:
  isbn:
  - 978-3-946856-03-0
publication_status: published
series_title: Publication series in direct digital manufacturing
status: public
title: Comparsion of FLM and SLA Processing Technologies Towards Manufacturing of
  Optical Waveguides for Communicationi and Sensing Applications
type: conference
user_id: '51864'
year: '2018'
...
---
_id: '573'
abstract:
- lang: eng
  text: Additive manufacturing (AM) technologies have not only revolutionized product
    development and design by enabling rapid prototyping. They also gained influence
    on production in general, mainly because of their direct manufacturing capabilities.
    In the context of Industry 4.0 and the related process automation, innovative
    and advanced production technologies with completely new approaches are required
    [1]. AM technologies contribute to this with their advantages like freedom of
    design, cost efficient product individualization, and functional integration.
    On the other hand, AM still shows shortcomings in exploiting its full potential.
    Most current AM technologies are only applicable for manufacturing with singular
    materials. In particular, opportunities for processing of optically or electrically
    conductive materials are still missing. This paper contributes to the advancement
    of additive manufacturing of two different material variants or even two completely
    different materials. A special focus is laid on producing a part that combines
    mechanical with optical or electrical functionalities in one process step. The
    ultimate goal is to integrate sensor functionalities into an AM object, e.g. strain
    gauges. Extrusion processes, predominantly Fused Layer Modeling (FLM), are preferred
    in this research due to their mechanically simple machine setup in which additional
    functional materials can be adapted easily to the build process. In a first step,
    the general manufacturability has been evaluated. Thereafter, the resulting optical
    transmission properties have been analyzed. Especially the attenuation has to
    remain below a threshold value to accomplish a minimum signal-to-noise ratio.
author:
- first_name: Patrick
  full_name: Ehlert, Patrick
  id: '62091'
  last_name: Ehlert
- first_name: Oliver
  full_name: Stübbe, Oliver
  id: '51864'
  last_name: Stübbe
  orcid: https://orcid.org/0000-0001-7293-6893
- first_name: Franz-Josef
  full_name: Villmer, Franz-Josef
  id: '14290'
  last_name: Villmer
citation:
  ama: 'Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing
    of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department
    of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, eds.
    <i>Production Engineering and Management</i>. Publication series in direct digital
    manufacturing . ; 2017:127-136.'
  apa: Ehlert, P., Stübbe, O., &#38; Villmer, F.-J. (2017). Investigation on the Direct
    Manufacturing of Waveguides and Sensors Using FLM Technology. In E. Padoano, F.-J.
    Villmer, Department of Production Engineering and Management, &#38; Hochschule
    Ostwestfalen-Lippe (Eds.), <i>Production Engineering and Management</i> (Issue
    1, pp. 127–136).
  bjps: <b>Ehlert P, Stübbe O and Villmer F-J</b> (2017) Investigation on the Direct
    Manufacturing of Waveguides and Sensors Using FLM Technology. In Padoano E et
    al. (eds), <i>Production Engineering and Management</i>. Lemgo, pp. 127–136.
  chicago: Ehlert, Patrick, Oliver Stübbe, and Franz-Josef Villmer. “Investigation
    on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology.” In
    <i>Production Engineering and Management</i>, edited by Elio Padoano, Franz-Josef
    Villmer, Department of Production Engineering and Management, and Hochschule Ostwestfalen-Lippe,
    127–36. Publication Series in Direct Digital Manufacturing . Lemgo, 2017.
  chicago-de: 'Ehlert, Patrick, Oliver Stübbe und Franz-Josef Villmer. 2017. Investigation
    on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In:
    <i>Production Engineering and Management</i>, hg. von Elio Padoano, Franz-Josef
    Villmer, Department of Production Engineering and Management, und Hochschule Ostwestfalen-Lippe,
    127–136. Publication series in direct digital manufacturing . Lemgo.'
  din1505-2-1: '<span style="font-variant:small-caps;">Ehlert, Patrick</span> ; <span
    style="font-variant:small-caps;">Stübbe, Oliver</span> ; <span style="font-variant:small-caps;">Villmer,
    Franz-Josef</span>: Investigation on the Direct Manufacturing of Waveguides and
    Sensors Using FLM Technology. In: <span style="font-variant:small-caps;">Padoano,
    E.</span> ; <span style="font-variant:small-caps;">Villmer, F.-J.</span> ; <span
    style="font-variant:small-caps;">Department of Production Engineering and Management</span>
    ; <span style="font-variant:small-caps;">Hochschule Ostwestfalen-Lippe</span>
    (Hrsg.): <i>Production Engineering and Management</i>, <i>Publication series in
    direct digital manufacturing </i>. Lemgo, 2017, S. 127–136'
  havard: 'P. Ehlert, O. Stübbe, F.-J. Villmer, Investigation on the Direct Manufacturing
    of Waveguides and Sensors Using FLM Technology, in: E. Padoano, F.-J. Villmer,
    Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe
    (Eds.), Production Engineering and Management, Lemgo, 2017: pp. 127–136.'
  ieee: P. Ehlert, O. Stübbe, and F.-J. Villmer, “Investigation on the Direct Manufacturing
    of Waveguides and Sensors Using FLM Technology,” in <i>Production Engineering
    and Management</i>, Pordenone, Italy, 2017, no. 1, pp. 127–136.
  mla: Ehlert, Patrick, et al. “Investigation on the Direct Manufacturing of Waveguides
    and Sensors Using FLM Technology.” <i>Production Engineering and Management</i>,
    edited by Elio Padoano et al., no. 1, 2017, pp. 127–36.
  short: 'P. Ehlert, O. Stübbe, F.-J. Villmer, in: E. Padoano, F.-J. Villmer, Department
    of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.),
    Production Engineering and Management, Lemgo, 2017, pp. 127–136.'
  ufg: '<b>Ehlert, Patrick/Stübbe, Oliver/Villmer, Franz-Josef</b>: Investigation
    on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology, in:
    <i>Padoano, Elio u. a. (Hgg.)</i>: Production Engineering and Management, Lemgo
    2017 (Publication series in direct digital manufacturing ),  S. 127–136.'
  van: 'Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing
    of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department
    of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, editors.
    Production Engineering and Management. Lemgo; 2017. p. 127–36. (Publication series
    in direct digital manufacturing ).'
conference:
  end_date: 2017-09-29
  location: Pordenone, Italy
  name: Proceedings7th International Conference
  start_date: 2017-09-28
corporate_editor:
- Department of Production Engineering and Management
- Hochschule Ostwestfalen-Lippe
date_created: 2019-02-18T11:16:07Z
date_updated: 2024-04-19T12:58:56Z
department:
- _id: DEP1306
- _id: DEP5020
- _id: DEP5000
- _id: DEP6020
editor:
- first_name: Elio
  full_name: Padoano, Elio
  last_name: Padoano
- first_name: Franz-Josef
  full_name: Villmer, Franz-Josef
  id: '14290'
  last_name: Villmer
extern: '1'
issue: '1'
keyword:
- Additive manufacturing
- Embedded optical waveguides
- Electrical conductors
- Embedded systems
- FLM technology
- Sensors
language:
- iso: eng
main_file_link:
- open_access: '1'
  url: https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf
oa: '1'
page: 127-136
place: Lemgo
publication: Production Engineering and Management
publication_identifier:
  isbn:
  - 978-3-946856-01-6
publication_status: published
quality_controlled: '1'
related_material:
  link:
  - relation: contains
    url: https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf
series_title: 'Publication series in direct digital manufacturing '
status: public
title: Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM
  Technology
type: conference
user_id: '51864'
year: '2017'
...