[{"quality_controlled":"1","isi":"1","date_created":"2024-02-25T07:30:24Z","publication_identifier":{"eissn":["1748-0280"],"issn":["1748-0272"]},"date_updated":"2025-06-25T12:41:40Z","publication_status":"published","volume":19,"year":"2024","abstract":[{"text":"When oil palm lumber is considered for load-bearing products such as glued laminated timber (GLT), defined strength and stiffness values are required. In this investigation, combined GLT from oil palm wood is tested in compression parallel and perpendicular and glulam lamellas in tension parallel to the vascular bundles. Strength and Young´s modulus in compression and tension parallel increase with the density by power law relationship. In contrast to dicotyle­dons, the strength in construction size exceeds that of small, defect-free test specimens (compression strength perpendicular), are in the same range (tensile and bending strength parallel) or only a little below (compression strength parallel). The specimen size does not influence the strength. The ratio of fc,0 : fm : ft,0 is 1.2 : 0.8 … 1.7 … 2.6 : 1 and fc,0 : fc,90 = 2.7 … 13.0 … 32.6 : 1 for ρ = 200 … 400 … 600 kg/m³; the ratio of Ec,0 : Em : Et,0 is 1.2 : 1.3 : 1 for ρ = 400 kg/m³. Ashby´s performance indices for minimum weight design rise with the density; the strength-density performance indices are comparable or only slightly lower than that for structural size softwood, whereas the modulus-density performance indices are much lower. The challenge in use of oil palm wood for load-bearing construction products is the low stiffness.","lang":"eng"}],"department":[{"_id":"DEP7018"},{"_id":"DEP1309"}],"type":"scientific_journal_article","place":"London","author":[{"last_name":"Frühwald-König","id":"26232","full_name":"Frühwald-König, Katja","first_name":"Katja"},{"first_name":"Lena","full_name":"Heister, Lena","id":"71887","last_name":"Heister"}],"issue":"5","title":"Compression properties of glued laminated timber and tensile properties of gluelam lamellas from oil palm wood","publication":"Wood material science and engineering","doi":"10.1080/17480272.2024.2303627","intvolume":"        19","publisher":"Taylor & Francis","external_id":{"isi":["001147069800001"]},"citation":{"ieee":"K. Frühwald-König and L. Heister, “Compression properties of glued laminated timber and tensile properties of gluelam lamellas from oil palm wood,” <i>Wood material science and engineering</i>, vol. 19, no. 5, pp. 1101–1116, 2024, doi: <a href=\"https://doi.org/10.1080/17480272.2024.2303627\">10.1080/17480272.2024.2303627</a>.","chicago-de":"Frühwald-König, Katja und Lena Heister. 2024. Compression properties of glued laminated timber and tensile properties of gluelam lamellas from oil palm wood. <i>Wood material science and engineering</i> 19, Nr. 5: 1101–1116. doi:<a href=\"https://doi.org/10.1080/17480272.2024.2303627\">10.1080/17480272.2024.2303627</a>, .","havard":"K. Frühwald-König, L. Heister, Compression properties of glued laminated timber and tensile properties of gluelam lamellas from oil palm wood, Wood Material Science and Engineering. 19 (2024) 1101–1116.","apa":"Frühwald-König, K., &#38; Heister, L. (2024). Compression properties of glued laminated timber and tensile properties of gluelam lamellas from oil palm wood. <i>Wood Material Science and Engineering</i>, <i>19</i>(5), 1101–1116. <a href=\"https://doi.org/10.1080/17480272.2024.2303627\">https://doi.org/10.1080/17480272.2024.2303627</a>","chicago":"Frühwald-König, Katja, and Lena Heister. “Compression Properties of Glued Laminated Timber and Tensile Properties of Gluelam Lamellas from Oil Palm Wood.” <i>Wood Material Science and Engineering</i> 19, no. 5 (2024): 1101–16. <a href=\"https://doi.org/10.1080/17480272.2024.2303627\">https://doi.org/10.1080/17480272.2024.2303627</a>.","mla":"Frühwald-König, Katja, and Lena Heister. “Compression Properties of Glued Laminated Timber and Tensile Properties of Gluelam Lamellas from Oil Palm Wood.” <i>Wood Material Science and Engineering</i>, vol. 19, no. 5, 2024, pp. 1101–16, <a href=\"https://doi.org/10.1080/17480272.2024.2303627\">https://doi.org/10.1080/17480272.2024.2303627</a>.","ufg":"<b>Frühwald-König, Katja/Heister, Lena</b>: Compression properties of glued laminated timber and tensile properties of gluelam lamellas from oil palm wood, in: <i>Wood material science and engineering</i> 19 (2024), H. 5,  S. 1101–1116.","short":"K. Frühwald-König, L. Heister, Wood Material Science and Engineering 19 (2024) 1101–1116.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Frühwald-König, Katja</span> ; <span style=\"font-variant:small-caps;\">Heister, Lena</span>: Compression properties of glued laminated timber and tensile properties of gluelam lamellas from oil palm wood. In: <i>Wood material science and engineering</i> Bd. 19. London, Taylor &#38; Francis (2024), Nr. 5, S. 1101–1116","bjps":"<b>Frühwald-König K and Heister L</b> (2024) Compression Properties of Glued Laminated Timber and Tensile Properties of Gluelam Lamellas from Oil Palm Wood. <i>Wood material science and engineering</i> <b>19</b>, 1101–1116.","van":"Frühwald-König K, Heister L. Compression properties of glued laminated timber and tensile properties of gluelam lamellas from oil palm wood. Wood material science and engineering. 2024;19(5):1101–16.","ama":"Frühwald-König K, Heister L. Compression properties of glued laminated timber and tensile properties of gluelam lamellas from oil palm wood. <i>Wood material science and engineering</i>. 2024;19(5):1101-1116. doi:<a href=\"https://doi.org/10.1080/17480272.2024.2303627\">10.1080/17480272.2024.2303627</a>"},"language":[{"iso":"eng"}],"page":"1101-1116","_id":"11113","keyword":["Oil palm wood","compression","tension","strength","young’s modulus","digital image correlation","glued laminated timber"],"user_id":"83781","status":"public"},{"conference":{"name":"69th Holm Conference on Electrical Contacts (HOLM)","location":"Annapolis, MD, USA ","start_date":"2024-10-06","end_date":"2024-10-10"},"status":"public","publication":"\t Electrical contacts - 2024 : proceedings of the Sixty‐Ninth IEEE Holm Conference on Electrical Contacts : 6-10 October 2024, Annapolis, MD, USA ","doi":"10.1109/holm56222.2024.10768449","language":[{"iso":"eng"}],"citation":{"bjps":"<b>Bünting K, Shukla AR and Song J</b> (2024) <i>The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors</i>, Institute of Electrical and Electronics Engineers and IEEE Electronics Packaging Society  (eds). [Piscataway, NJ]: IEEE.","van":"Bünting K, Shukla AR, Song J. The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors. Institute of Electrical and Electronics Engineers, IEEE Electronics Packaging Society , editors.   Electrical contacts - 2024 : proceedings of the Sixty‐Ninth IEEE Holm Conference on Electrical Contacts : 6-10 October 2024, Annapolis, MD, USA . [Piscataway, NJ]: IEEE; 2024.","ama":"Bünting K, Shukla AR, Song J. <i>The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors</i>. (Institute of Electrical and Electronics Engineers, IEEE Electronics Packaging Society , eds.). IEEE; 2024. doi:<a href=\"https://doi.org/10.1109/holm56222.2024.10768449\">10.1109/holm56222.2024.10768449</a>","ufg":"<b>Bünting, Karolin/Shukla, Abhay Rammurti/Song, Jian</b>: The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors, hg. von Institute of Electrical and Electronics Engineers, IEEE Electronics Packaging Society , [Piscataway, NJ] 2024.","short":"K. Bünting, A.R. Shukla, J. Song, The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors, IEEE, [Piscataway, NJ], 2024.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Bünting, Karolin</span> ; <span style=\"font-variant:small-caps;\">Shukla, Abhay Rammurti</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span> ; <span style=\"font-variant:small-caps;\">Institute of Electrical and Electronics Engineers</span> ; <span style=\"font-variant:small-caps;\">IEEE Electronics Packaging Society </span> (Hrsg.): <i>The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors</i>. [Piscataway, NJ] : IEEE, 2024","chicago":"Bünting, Karolin, Abhay Rammurti Shukla, and Jian Song. <i>The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors</i>. Edited by Institute of Electrical and Electronics Engineers and IEEE Electronics Packaging Society . <i>  Electrical Contacts - 2024 : Proceedings of the Sixty‐Ninth IEEE Holm Conference on Electrical Contacts : 6-10 October 2024, Annapolis, MD, USA </i>. [Piscataway, NJ]: IEEE, 2024. <a href=\"https://doi.org/10.1109/holm56222.2024.10768449\">https://doi.org/10.1109/holm56222.2024.10768449</a>.","mla":"Bünting, Karolin, et al. “The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors.” <i>  Electrical Contacts - 2024 : Proceedings of the Sixty‐Ninth IEEE Holm Conference on Electrical Contacts : 6-10 October 2024, Annapolis, MD, USA </i>, edited by Institute of Electrical and Electronics Engineers and IEEE Electronics Packaging Society , IEEE, 2024, <a href=\"https://doi.org/10.1109/holm56222.2024.10768449\">https://doi.org/10.1109/holm56222.2024.10768449</a>.","ieee":"K. Bünting, A. R. Shukla, and J. Song, <i>The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors</i>. [Piscataway, NJ]: IEEE, 2024. doi: <a href=\"https://doi.org/10.1109/holm56222.2024.10768449\">10.1109/holm56222.2024.10768449</a>.","chicago-de":"Bünting, Karolin, Abhay Rammurti Shukla und Jian Song. 2024. <i>The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors</i>. Hg. von Institute of Electrical and Electronics Engineers und IEEE Electronics Packaging Society . <i>  Electrical contacts - 2024 : proceedings of the Sixty‐Ninth IEEE Holm Conference on Electrical Contacts : 6-10 October 2024, Annapolis, MD, USA </i>. [Piscataway, NJ]: IEEE. doi:<a href=\"https://doi.org/10.1109/holm56222.2024.10768449\">10.1109/holm56222.2024.10768449</a>, .","havard":"K. Bünting, A.R. Shukla, J. Song, The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors, IEEE, [Piscataway, NJ], 2024.","apa":"Bünting, K., Shukla, A. R., &#38; Song, J. (2024). The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors. In Institute of Electrical and Electronics Engineers &#38; IEEE Electronics Packaging Society  (Eds.), <i>  Electrical contacts - 2024 : proceedings of the Sixty‐Ninth IEEE Holm Conference on Electrical Contacts : 6-10 October 2024, Annapolis, MD, USA </i>. IEEE. <a href=\"https://doi.org/10.1109/holm56222.2024.10768449\">https://doi.org/10.1109/holm56222.2024.10768449</a>"},"publisher":"IEEE","_id":"12891","keyword":["Young's modulus","thermal and mechanical loads","spring deflection","relaxation"],"user_id":"83781","corporate_editor":["Institute of Electrical and Electronics Engineers","IEEE Electronics Packaging Society "],"abstract":[{"lang":"eng","text":"Copper alloy metal strips are widely used to manufacture electrical connectors. These connectors experience stress relaxation during operation. The reduced contact force may lead to contact failure. For the given design of connectors, the contact force is proportional to the Young's modulus which depends on interatomic bonds, alloying elements and the microstructure of metal grains. According to the literature, it is assumed that Young's modulus does not change significantly during long-term mechanical stress and aging at temperatures below the recrystallization temperature of copper alloys. Based on this assumption, the relaxation of connectors from lifetime tests and from long-term used field vehicles can be determined by the comparison of spring deflection of connectors before and after long-term tests or long-term use. The focus of this paper is to answer the question, whether this assumption is accurate. For this purpose, the influence of long-term thermal and mechanical loads on the Young's modulus of various copper alloys is investigated. The temperature in test approximately matches the maximum design temperature of automotive connectors and the mechanical stress is comparable to that in a typical connector."}],"year":"2024","department":[{"_id":"DEP6000"},{"_id":"DEP6012"}],"place":"[Piscataway, NJ]","type":"conference_editor_article","title":"The Influence of Long Term Thermal and Mechanical Loads on the Young's Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors","author":[{"last_name":"Bünting","id":"62067","full_name":"Bünting, Karolin","first_name":"Karolin"},{"last_name":"Shukla","id":"74188","full_name":"Shukla, Abhay Rammurti","first_name":"Abhay Rammurti"},{"first_name":"Jian","id":"5297","full_name":"Song, Jian","last_name":"Song"}],"publication_identifier":{"isbn":["979-8-3315-2907-9"],"eisbn":["979-8-3315-2906-2 "]},"date_created":"2025-05-07T09:31:00Z","publication_status":"published","date_updated":"2025-05-07T14:03:11Z"}]