---
_id: '11113'
abstract:
- lang: eng
  text: 'When oil palm lumber is considered for load-bearing products such as glued
    laminated timber (GLT), defined strength and stiffness values are required. In
    this investigation, combined GLT from oil palm wood is tested in compression parallel
    and perpendicular and glulam lamellas in tension parallel to the vascular bundles.
    Strength and Young´s modulus in compression and tension parallel increase with
    the density by power law relationship. In contrast to dicotyle­dons, the strength
    in construction size exceeds that of small, defect-free test specimens (compression
    strength perpendicular), are in the same range (tensile and bending strength parallel)
    or only a little below (compression strength parallel). The specimen size does
    not influence the strength. The ratio of fc,0 : fm : ft,0 is 1.2 : 0.8 … 1.7 … 2.6
    : 1 and fc,0 : fc,90 = 2.7 … 13.0 … 32.6 : 1 for ρ = 200 … 400 … 600 kg/m³; the
    ratio of Ec,0 : Em : Et,0 is 1.2 : 1.3 : 1 for ρ = 400 kg/m³. Ashby´s performance
    indices for minimum weight design rise with the density; the strength-density
    performance indices are comparable or only slightly lower than that for structural
    size softwood, whereas the modulus-density performance indices are much lower.
    The challenge in use of oil palm wood for load-bearing construction products is
    the low stiffness.'
author:
- first_name: Katja
  full_name: Frühwald-König, Katja
  id: '26232'
  last_name: Frühwald-König
- first_name: Lena
  full_name: Heister, Lena
  id: '71887'
  last_name: Heister
citation:
  ama: Frühwald-König K, Heister L. Compression properties of glued laminated timber
    and tensile properties of gluelam lamellas from oil palm wood. <i>Wood material
    science and engineering</i>. 2024;19(5):1101-1116. doi:<a href="https://doi.org/10.1080/17480272.2024.2303627">10.1080/17480272.2024.2303627</a>
  apa: Frühwald-König, K., &#38; Heister, L. (2024). Compression properties of glued
    laminated timber and tensile properties of gluelam lamellas from oil palm wood.
    <i>Wood Material Science and Engineering</i>, <i>19</i>(5), 1101–1116. <a href="https://doi.org/10.1080/17480272.2024.2303627">https://doi.org/10.1080/17480272.2024.2303627</a>
  bjps: <b>Frühwald-König K and Heister L</b> (2024) Compression Properties of Glued
    Laminated Timber and Tensile Properties of Gluelam Lamellas from Oil Palm Wood.
    <i>Wood material science and engineering</i> <b>19</b>, 1101–1116.
  chicago: 'Frühwald-König, Katja, and Lena Heister. “Compression Properties of Glued
    Laminated Timber and Tensile Properties of Gluelam Lamellas from Oil Palm Wood.”
    <i>Wood Material Science and Engineering</i> 19, no. 5 (2024): 1101–16. <a href="https://doi.org/10.1080/17480272.2024.2303627">https://doi.org/10.1080/17480272.2024.2303627</a>.'
  chicago-de: 'Frühwald-König, Katja und Lena Heister. 2024. Compression properties
    of glued laminated timber and tensile properties of gluelam lamellas from oil
    palm wood. <i>Wood material science and engineering</i> 19, Nr. 5: 1101–1116.
    doi:<a href="https://doi.org/10.1080/17480272.2024.2303627">10.1080/17480272.2024.2303627</a>,
    .'
  din1505-2-1: '<span style="font-variant:small-caps;">Frühwald-König, Katja</span>
    ; <span style="font-variant:small-caps;">Heister, Lena</span>: Compression properties
    of glued laminated timber and tensile properties of gluelam lamellas from oil
    palm wood. In: <i>Wood material science and engineering</i> Bd. 19. London, Taylor
    &#38; Francis (2024), Nr. 5, S. 1101–1116'
  havard: K. Frühwald-König, L. Heister, Compression properties of glued laminated
    timber and tensile properties of gluelam lamellas from oil palm wood, Wood Material
    Science and Engineering. 19 (2024) 1101–1116.
  ieee: 'K. Frühwald-König and L. Heister, “Compression properties of glued laminated
    timber and tensile properties of gluelam lamellas from oil palm wood,” <i>Wood
    material science and engineering</i>, vol. 19, no. 5, pp. 1101–1116, 2024, doi:
    <a href="https://doi.org/10.1080/17480272.2024.2303627">10.1080/17480272.2024.2303627</a>.'
  mla: Frühwald-König, Katja, and Lena Heister. “Compression Properties of Glued Laminated
    Timber and Tensile Properties of Gluelam Lamellas from Oil Palm Wood.” <i>Wood
    Material Science and Engineering</i>, vol. 19, no. 5, 2024, pp. 1101–16, <a href="https://doi.org/10.1080/17480272.2024.2303627">https://doi.org/10.1080/17480272.2024.2303627</a>.
  short: K. Frühwald-König, L. Heister, Wood Material Science and Engineering 19 (2024)
    1101–1116.
  ufg: '<b>Frühwald-König, Katja/Heister, Lena</b>: Compression properties of glued
    laminated timber and tensile properties of gluelam lamellas from oil palm wood,
    in: <i>Wood material science and engineering</i> 19 (2024), H. 5,  S. 1101–1116.'
  van: Frühwald-König K, Heister L. Compression properties of glued laminated timber
    and tensile properties of gluelam lamellas from oil palm wood. Wood material science
    and engineering. 2024;19(5):1101–16.
date_created: 2024-02-25T07:30:24Z
date_updated: 2025-06-25T12:41:40Z
department:
- _id: DEP7018
- _id: DEP1309
doi: 10.1080/17480272.2024.2303627
external_id:
  isi:
  - '001147069800001'
intvolume: '        19'
isi: '1'
issue: '5'
keyword:
- Oil palm wood
- compression
- tension
- strength
- young’s modulus
- digital image correlation
- glued laminated timber
language:
- iso: eng
page: 1101-1116
place: London
publication: Wood material science and engineering
publication_identifier:
  eissn:
  - 1748-0280
  issn:
  - 1748-0272
publication_status: published
publisher: Taylor & Francis
quality_controlled: '1'
status: public
title: Compression properties of glued laminated timber and tensile properties of
  gluelam lamellas from oil palm wood
type: scientific_journal_article
user_id: '83781'
volume: 19
year: '2024'
...
---
_id: '12891'
abstract:
- lang: eng
  text: Copper alloy metal strips are widely used to manufacture electrical connectors.
    These connectors experience stress relaxation during operation. The reduced contact
    force may lead to contact failure. For the given design of connectors, the contact
    force is proportional to the Young's modulus which depends on interatomic bonds,
    alloying elements and the microstructure of metal grains. According to the literature,
    it is assumed that Young's modulus does not change significantly during long-term
    mechanical stress and aging at temperatures below the recrystallization temperature
    of copper alloys. Based on this assumption, the relaxation of connectors from
    lifetime tests and from long-term used field vehicles can be determined by the
    comparison of spring deflection of connectors before and after long-term tests
    or long-term use. The focus of this paper is to answer the question, whether this
    assumption is accurate. For this purpose, the influence of long-term thermal and
    mechanical loads on the Young's modulus of various copper alloys is investigated.
    The temperature in test approximately matches the maximum design temperature of
    automotive connectors and the mechanical stress is comparable to that in a typical
    connector.
author:
- first_name: Karolin
  full_name: Bünting, Karolin
  id: '62067'
  last_name: Bünting
- first_name: Abhay Rammurti
  full_name: Shukla, Abhay Rammurti
  id: '74188'
  last_name: Shukla
- first_name: Jian
  full_name: Song, Jian
  id: '5297'
  last_name: Song
citation:
  ama: Bünting K, Shukla AR, Song J. <i>The Influence of Long Term Thermal and Mechanical
    Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation
    in Electrical Connectors</i>. (Institute of Electrical and Electronics Engineers,
    IEEE Electronics Packaging Society , eds.). IEEE; 2024. doi:<a href="https://doi.org/10.1109/holm56222.2024.10768449">10.1109/holm56222.2024.10768449</a>
  apa: 'Bünting, K., Shukla, A. R., &#38; Song, J. (2024). The Influence of Long Term
    Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination
    of Stress Relaxation in Electrical Connectors. In Institute of Electrical and
    Electronics Engineers &#38; IEEE Electronics Packaging Society  (Eds.), <i>  Electrical
    contacts - 2024 : proceedings of the Sixty‐Ninth IEEE Holm Conference on Electrical
    Contacts : 6-10 October 2024, Annapolis, MD, USA </i>. IEEE. <a href="https://doi.org/10.1109/holm56222.2024.10768449">https://doi.org/10.1109/holm56222.2024.10768449</a>'
  bjps: '<b>Bünting K, Shukla AR and Song J</b> (2024) <i>The Influence of Long Term
    Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination
    of Stress Relaxation in Electrical Connectors</i>, Institute of Electrical and
    Electronics Engineers and IEEE Electronics Packaging Society  (eds). [Piscataway,
    NJ]: IEEE.'
  chicago: 'Bünting, Karolin, Abhay Rammurti Shukla, and Jian Song. <i>The Influence
    of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys
    - Determination of Stress Relaxation in Electrical Connectors</i>. Edited by Institute
    of Electrical and Electronics Engineers and IEEE Electronics Packaging Society
    . <i>  Electrical Contacts - 2024 : Proceedings of the Sixty‐Ninth IEEE Holm Conference
    on Electrical Contacts : 6-10 October 2024, Annapolis, MD, USA </i>. [Piscataway,
    NJ]: IEEE, 2024. <a href="https://doi.org/10.1109/holm56222.2024.10768449">https://doi.org/10.1109/holm56222.2024.10768449</a>.'
  chicago-de: 'Bünting, Karolin, Abhay Rammurti Shukla und Jian Song. 2024. <i>The
    Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of
    Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors</i>. Hg.
    von Institute of Electrical and Electronics Engineers und IEEE Electronics Packaging
    Society . <i>  Electrical contacts - 2024 : proceedings of the Sixty‐Ninth IEEE
    Holm Conference on Electrical Contacts : 6-10 October 2024, Annapolis, MD, USA
    </i>. [Piscataway, NJ]: IEEE. doi:<a href="https://doi.org/10.1109/holm56222.2024.10768449">10.1109/holm56222.2024.10768449</a>,
    .'
  din1505-2-1: '<span style="font-variant:small-caps;">Bünting, Karolin</span> ; <span
    style="font-variant:small-caps;">Shukla, Abhay Rammurti</span> ; <span style="font-variant:small-caps;">Song,
    Jian</span> ; <span style="font-variant:small-caps;">Institute of Electrical and
    Electronics Engineers</span> ; <span style="font-variant:small-caps;">IEEE Electronics
    Packaging Society </span> (Hrsg.): <i>The Influence of Long Term Thermal and Mechanical
    Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation
    in Electrical Connectors</i>. [Piscataway, NJ] : IEEE, 2024'
  havard: K. Bünting, A.R. Shukla, J. Song, The Influence of Long Term Thermal and
    Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress
    Relaxation in Electrical Connectors, IEEE, [Piscataway, NJ], 2024.
  ieee: 'K. Bünting, A. R. Shukla, and J. Song, <i>The Influence of Long Term Thermal
    and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress
    Relaxation in Electrical Connectors</i>. [Piscataway, NJ]: IEEE, 2024. doi: <a
    href="https://doi.org/10.1109/holm56222.2024.10768449">10.1109/holm56222.2024.10768449</a>.'
  mla: 'Bünting, Karolin, et al. “The Influence of Long Term Thermal and Mechanical
    Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation
    in Electrical Connectors.” <i>  Electrical Contacts - 2024 : Proceedings of the
    Sixty‐Ninth IEEE Holm Conference on Electrical Contacts : 6-10 October 2024, Annapolis,
    MD, USA </i>, edited by Institute of Electrical and Electronics Engineers and
    IEEE Electronics Packaging Society , IEEE, 2024, <a href="https://doi.org/10.1109/holm56222.2024.10768449">https://doi.org/10.1109/holm56222.2024.10768449</a>.'
  short: K. Bünting, A.R. Shukla, J. Song, The Influence of Long Term Thermal and
    Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress
    Relaxation in Electrical Connectors, IEEE, [Piscataway, NJ], 2024.
  ufg: '<b>Bünting, Karolin/Shukla, Abhay Rammurti/Song, Jian</b>: The Influence of
    Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination
    of Stress Relaxation in Electrical Connectors, hg. von Institute of Electrical
    and Electronics Engineers, IEEE Electronics Packaging Society , [Piscataway, NJ]
    2024.'
  van: 'Bünting K, Shukla AR, Song J. The Influence of Long Term Thermal and Mechanical
    Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation
    in Electrical Connectors. Institute of Electrical and Electronics Engineers, IEEE
    Electronics Packaging Society , editors.   Electrical contacts - 2024 : proceedings
    of the Sixty‐Ninth IEEE Holm Conference on Electrical Contacts : 6-10 October
    2024, Annapolis, MD, USA . [Piscataway, NJ]: IEEE; 2024.'
conference:
  end_date: 2024-10-10
  location: 'Annapolis, MD, USA '
  name: 69th Holm Conference on Electrical Contacts (HOLM)
  start_date: 2024-10-06
corporate_editor:
- Institute of Electrical and Electronics Engineers
- 'IEEE Electronics Packaging Society '
date_created: 2025-05-07T09:31:00Z
date_updated: 2025-05-07T14:03:11Z
department:
- _id: DEP6000
- _id: DEP6012
doi: 10.1109/holm56222.2024.10768449
keyword:
- Young's modulus
- thermal and mechanical loads
- spring deflection
- relaxation
language:
- iso: eng
place: '[Piscataway, NJ]'
publication: "\t Electrical contacts - 2024 : proceedings of the Sixty‐Ninth IEEE
  Holm Conference on Electrical Contacts : 6-10 October 2024, Annapolis, MD, USA "
publication_identifier:
  eisbn:
  - '979-8-3315-2906-2 '
  isbn:
  - 979-8-3315-2907-9
publication_status: published
publisher: IEEE
status: public
title: The Influence of Long Term Thermal and Mechanical Loads on the Young's Modulus
  of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors
type: conference_editor_article
user_id: '83781'
year: '2024'
...