@misc{12049,
  author       = {{Borcherding, Holger and Springer, André and Müller, Tobias and Ehlert, Patrick}},
  pages        = {{26}},
  publisher    = {{Technische Hochschule Ostwestfalen-Lippe}},
  title        = {{{3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC²B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22}}},
  doi          = {{10.2314/KXP:1881717380}},
  year         = {{2023}},
}

@misc{7844,
  abstract     = {{The CMID (Coated Metal Interconnected Device) technology described here has its origins in MID (Moulded Intercon-
nected Device) technology, which in itself is based on laser direct structuring (LDS). CMIDs are metallic base bodies 
coated with LDS-compatiblepowder, allowing conductor paths to be structured and metallised on the coating. The metallic base bodies enable the heat management to be optimised and allow power electronic topologies to be implemented in addition to control electronics. Furthermore, in the context of 3D electronics, miniaturisation can be advanced through the use of unused spaces and housing parts. This is shown by manufacturing techniques and demonstrators of motor integrated inverters.}},
  author       = {{Borcherding, Holger and Springer, André and Müller, Tobias and Ehlert, Patrick and Tolksdorf, Andreas}},
  booktitle    = {{	 ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany}},
  isbn         = {{978-3-8007-5757-2}},
  location     = {{Berlin}},
  pages        = {{500--507}},
  publisher    = {{VDE-Verlag}},
  title        = {{{Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)}}},
  volume       = {{165}},
  year         = {{2022}},
}