[{"date_updated":"2023-03-15T13:50:04Z","doi":"10.1109/TCPMT.2020.3005075","title":"Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems","citation":{"havard":"C. Kuckkuck, P. Lödige, M. Blauth, H. Yuan, J. Song, Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems, IEEE Transactions on Components, Packaging and Manufacturing Technology. (2020).","ufg":"<b>Kuckkuck, Carsten et. al. (2020)</b>: Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems, in: <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>.","chicago-de":"Kuckkuck, Carsten, Pascal Lödige, Michael Blauth, Haomiao Yuan und Jian Song. 2020. Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>. doi:<a href=\"https://doi.org/10.1109/TCPMT.2020.3005075,\">10.1109/TCPMT.2020.3005075,</a> .","short":"C. Kuckkuck, P. Lödige, M. Blauth, H. Yuan, J. Song, IEEE Transactions on Components, Packaging and Manufacturing Technology (2020).","mla":"Kuckkuck, Carsten, et al. “Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems.” <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>, IEEE, 2020, doi:<a href=\"https://doi.org/10.1109/TCPMT.2020.3005075\">10.1109/TCPMT.2020.3005075</a>.","apa":"Kuckkuck, C., Lödige, P., Blauth, M., Yuan, H., &#38; Song, J. (2020). Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>. <a href=\"https://doi.org/10.1109/TCPMT.2020.3005075\">https://doi.org/10.1109/TCPMT.2020.3005075</a>","ama":"Kuckkuck C, Lödige P, Blauth M, Yuan H, Song J. Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>. 2020. doi:<a href=\"https://doi.org/10.1109/TCPMT.2020.3005075\">10.1109/TCPMT.2020.3005075</a>","van":"Kuckkuck C, Lödige P, Blauth M, Yuan H, Song J. Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2020;","ieee":"C. Kuckkuck, P. Lödige, M. Blauth, H. Yuan, and J. Song, “Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems,” <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>, 2020.","chicago":"Kuckkuck, Carsten, Pascal Lödige, Michael Blauth, Haomiao Yuan, and Jian Song. “Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems.” <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>, 2020. <a href=\"https://doi.org/10.1109/TCPMT.2020.3005075\">https://doi.org/10.1109/TCPMT.2020.3005075</a>.","bjps":"<b>Kuckkuck C <i>et al.</i></b> (2020) Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Kuckkuck, Carsten</span> ; <span style=\"font-variant:small-caps;\">Lödige, Pascal</span> ; <span style=\"font-variant:small-caps;\">Blauth, Michael</span> ; <span style=\"font-variant:small-caps;\">Yuan, Haomiao</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span>: Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. In: <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>, IEEE (2020)"},"language":[{"iso":"eng"}],"date_created":"2021-09-15T09:04:30Z","publisher":"IEEE","type":"scientific_journal_article","author":[{"full_name":"Kuckkuck, Carsten","last_name":"Kuckkuck","first_name":"Carsten"},{"first_name":"Pascal","last_name":"Lödige","id":"60290","full_name":"Lödige, Pascal"},{"first_name":"Michael","full_name":"Blauth, Michael","id":"49095","last_name":"Blauth"},{"id":"61860","last_name":"Yuan","full_name":"Yuan, Haomiao","first_name":"Haomiao"},{"first_name":"Jian","id":"5297","last_name":"Song","full_name":"Song, Jian"}],"_id":"6257","status":"public","publication":"IEEE Transactions on Components, Packaging and Manufacturing Technology","year":2020,"user_id":"5297","department":[{"_id":"DEP6012"}]},{"publication_status":"published","publisher":"Technische Hochschule Ostwestfalen-Lippe","date_created":"2022-04-14T08:08:13Z","language":[{"iso":"ger"}],"citation":{"apa":"Lödige, P. 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