[{"title":"Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems","citation":{"ama":"Kuckkuck C, Lödige P, Blauth M, Yuan H, Song J. Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>. 2020. doi:<a href=\"https://doi.org/10.1109/TCPMT.2020.3005075\">10.1109/TCPMT.2020.3005075</a>","ieee":"C. Kuckkuck, P. Lödige, M. Blauth, H. Yuan, and J. Song, “Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems,” <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>, 2020.","ufg":"<b>Kuckkuck, Carsten et. al. (2020)</b>: Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems, in: <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>.","bjps":"<b>Kuckkuck C <i>et al.</i></b> (2020) Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>.","mla":"Kuckkuck, Carsten, et al. “Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems.” <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>, IEEE, 2020, doi:<a href=\"https://doi.org/10.1109/TCPMT.2020.3005075\">10.1109/TCPMT.2020.3005075</a>.","havard":"C. Kuckkuck, P. Lödige, M. Blauth, H. Yuan, J. Song, Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems, IEEE Transactions on Components, Packaging and Manufacturing Technology. (2020).","van":"Kuckkuck C, Lödige P, Blauth M, Yuan H, Song J. Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2020;","chicago":"Kuckkuck, Carsten, Pascal Lödige, Michael Blauth, Haomiao Yuan, and Jian Song. “Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems.” <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>, 2020. <a href=\"https://doi.org/10.1109/TCPMT.2020.3005075\">https://doi.org/10.1109/TCPMT.2020.3005075</a>.","apa":"Kuckkuck, C., Lödige, P., Blauth, M., Yuan, H., &#38; Song, J. (2020). Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>. <a href=\"https://doi.org/10.1109/TCPMT.2020.3005075\">https://doi.org/10.1109/TCPMT.2020.3005075</a>","chicago-de":"Kuckkuck, Carsten, Pascal Lödige, Michael Blauth, Haomiao Yuan und Jian Song. 2020. Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>. doi:<a href=\"https://doi.org/10.1109/TCPMT.2020.3005075,\">10.1109/TCPMT.2020.3005075,</a> .","din1505-2-1":"<span style=\"font-variant:small-caps;\">Kuckkuck, Carsten</span> ; <span style=\"font-variant:small-caps;\">Lödige, Pascal</span> ; <span style=\"font-variant:small-caps;\">Blauth, Michael</span> ; <span style=\"font-variant:small-caps;\">Yuan, Haomiao</span> ; <span style=\"font-variant:small-caps;\">Song, Jian</span>: Analysis of the Inter Strand and Strand/Connector Resistance Relations in Wire Connection Systems. In: <i>IEEE Transactions on Components, Packaging and Manufacturing Technology</i>, IEEE (2020)","short":"C. Kuckkuck, P. Lödige, M. Blauth, H. Yuan, J. Song, IEEE Transactions on Components, Packaging and Manufacturing Technology (2020)."},"department":[{"_id":"DEP6012"}],"author":[{"full_name":"Kuckkuck, Carsten","last_name":"Kuckkuck","first_name":"Carsten"},{"last_name":"Lödige","first_name":"Pascal","full_name":"Lödige, Pascal","id":"60290"},{"last_name":"Blauth","first_name":"Michael","full_name":"Blauth, Michael","id":"49095"},{"id":"61860","full_name":"Yuan, Haomiao","last_name":"Yuan","first_name":"Haomiao"},{"id":"5297","first_name":"Jian","last_name":"Song","full_name":"Song, Jian"}],"year":2020,"publisher":"IEEE","status":"public","date_created":"2021-09-15T09:04:30Z","type":"scientific_journal_article","publication":"IEEE Transactions on Components, Packaging and Manufacturing Technology","date_updated":"2023-03-15T13:50:04Z","user_id":"5297","doi":"10.1109/TCPMT.2020.3005075","_id":"6257","language":[{"iso":"eng"}]},{"date_updated":"2023-03-15T13:50:10Z","user_id":"79260","supervisor":[{"id":"1031","first_name":"Stefan","full_name":"Heiss, Stefan","last_name":"Heiss"},{"id":"10982","first_name":"Andreas","full_name":"Schmelter, Andreas","last_name":"Schmelter"}],"date_created":"2022-04-14T08:08:13Z","type":"bachelor_thesis","_id":"7526","language":[{"iso":"ger"}],"place":"Lemgo","publication_status":"published","citation":{"ama":"Lödige P. <i>Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe; 2019.","ieee":"P. Lödige, <i>Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe, 2019.","short":"P. Lödige, Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung, Technische Hochschule Ostwestfalen-Lippe, Lemgo, 2019.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Lödige, Pascal</span>: <i>Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung</i>. Lemgo : Technische Hochschule Ostwestfalen-Lippe, 2019","chicago-de":"Lödige, Pascal. 2019. <i>Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe.","van":"Lödige P. Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung. Lemgo: Technische Hochschule Ostwestfalen-Lippe; 2019.","havard":"P. Lödige, Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung, Technische Hochschule Ostwestfalen-Lippe, Lemgo, 2019.","bjps":"<b>Lödige P</b> (2019) <i>Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe.","mla":"Lödige, Pascal. <i>Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung</i>. Technische Hochschule Ostwestfalen-Lippe, 2019.","ufg":"<b>Lödige, Pascal (2019)</b>: Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung, Lemgo.","apa":"Lödige, P. (2019). <i>Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe.","chicago":"Lödige, Pascal. <i>Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe, 2019."},"defense_date":"2019-04-25","title":"Risikoanalyse für die Softwareaktualisierung einer modularen Elektrofahrzeugladesteuerung","publisher":"Technische Hochschule Ostwestfalen-Lippe","status":"public","department":[{"_id":"DEP5025"}],"year":2019,"author":[{"last_name":"Lödige","id":"60290","full_name":"Lödige, Pascal","first_name":"Pascal"}]}]