@misc{12049,
  author       = {{Borcherding, Holger and Springer, André and Müller, Tobias and Ehlert, Patrick}},
  pages        = {{26}},
  publisher    = {{Technische Hochschule Ostwestfalen-Lippe}},
  title        = {{{3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC²B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22}}},
  doi          = {{10.2314/KXP:1881717380}},
  year         = {{2023}},
}

@misc{7844,
  abstract     = {{The CMID (Coated Metal Interconnected Device) technology described here has its origins in MID (Moulded Intercon-
nected Device) technology, which in itself is based on laser direct structuring (LDS). CMIDs are metallic base bodies 
coated with LDS-compatiblepowder, allowing conductor paths to be structured and metallised on the coating. The metallic base bodies enable the heat management to be optimised and allow power electronic topologies to be implemented in addition to control electronics. Furthermore, in the context of 3D electronics, miniaturisation can be advanced through the use of unused spaces and housing parts. This is shown by manufacturing techniques and demonstrators of motor integrated inverters.}},
  author       = {{Borcherding, Holger and Springer, André and Müller, Tobias and Ehlert, Patrick and Tolksdorf, Andreas}},
  booktitle    = {{	 ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany}},
  isbn         = {{978-3-8007-5757-2}},
  location     = {{Berlin}},
  pages        = {{500--507}},
  publisher    = {{VDE-Verlag}},
  title        = {{{Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)}}},
  volume       = {{165}},
  year         = {{2022}},
}

@misc{7841,
  author       = {{Hemmelgarn, Florian and Ehlert, Patrick and Mager, Thomas and Jurgenhake, Christoph and Dumitrescu, Roman and Springer, André}},
  booktitle    = {{14th International Congress Molded Interconnect Devices (MID)}},
  location     = {{Amberg}},
  publisher    = {{IEEE}},
  title        = {{{Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications}}},
  doi          = {{10.1109/mid50463.2021.9361628}},
  year         = {{2021}},
}

@misc{7843,
  author       = {{Ehlert, Patrick and Hemmelgarn, Florian and Mager, Thomas and Jürgenhake, Christoph and Wißbrock, Horst and Springer, André}},
  location     = {{Nürnberg}},
  publisher    = {{Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.}},
  title        = {{{Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen}}},
  year         = {{2021}},
}

@misc{7911,
  author       = {{Stosch, Martin and Springer, André and Villmer, Franz-Josef and Meier, Matthias and Kiwitt, Constanze and Plate, Sebastian and Ehlert, Patrick}},
  pages        = {{19}},
  title        = {{{3D-Druck auf Holz. (DE102019113340A1)}}},
  year         = {{2020}},
}

@inproceedings{573,
  abstract     = {{Additive manufacturing (AM) technologies have not only revolutionized product development and design by enabling rapid prototyping. They also gained influence on production in general, mainly because of their direct manufacturing capabilities. In the context of Industry 4.0 and the related process automation, innovative and advanced production technologies with completely new approaches are required [1]. AM technologies contribute to this with their advantages like freedom of design, cost efficient product individualization, and functional integration. On the other hand, AM still shows shortcomings in exploiting its full potential. Most current AM technologies are only applicable for manufacturing with singular materials. In particular, opportunities for processing of optically or electrically conductive materials are still missing. This paper contributes to the advancement of additive manufacturing of two different material variants or even two completely different materials. A special focus is laid on producing a part that combines mechanical with optical or electrical functionalities in one process step. The ultimate goal is to integrate sensor functionalities into an AM object, e.g. strain gauges. Extrusion processes, predominantly Fused Layer Modeling (FLM), are preferred in this research due to their mechanically simple machine setup in which additional functional materials can be adapted easily to the build process. In a first step, the general manufacturability has been evaluated. Thereafter, the resulting optical transmission properties have been analyzed. Especially the attenuation has to remain below a threshold value to accomplish a minimum signal-to-noise ratio.}},
  author       = {{Ehlert, Patrick and Stübbe, Oliver and Villmer, Franz-Josef}},
  booktitle    = {{Production Engineering and Management}},
  editor       = {{Padoano, Elio and Villmer, Franz-Josef}},
  isbn         = {{978-3-946856-01-6}},
  keywords     = {{Additive manufacturing, Embedded optical waveguides, Electrical conductors, Embedded systems, FLM technology, Sensors}},
  location     = {{Pordenone, Italy}},
  number       = {{1}},
  pages        = {{127--136}},
  title        = {{{Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology}}},
  year         = {{2017}},
}