[{"doi":"10.2314/KXP:1881717380","date_created":"2024-11-22T13:52:34Z","_id":"12049","user_id":"83781","publication_status":"published","date_updated":"2024-11-27T14:18:19Z","page":"26","citation":{"ieee":"H. Borcherding, A. Springer, T. Müller, and P. Ehlert, <i>3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe, 2023. doi: <a href=\"https://doi.org/10.2314/KXP:1881717380\">10.2314/KXP:1881717380</a>.","apa":"Borcherding, H., Springer, A., Müller, T., &#38; Ehlert, P. (2023). <i>3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22</i>. Technische Hochschule Ostwestfalen-Lippe. <a href=\"https://doi.org/10.2314/KXP:1881717380\">https://doi.org/10.2314/KXP:1881717380</a>","chicago-de":"Borcherding, Holger, André Springer, Tobias Müller und Patrick Ehlert. 2023. <i>3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe. doi:<a href=\"https://doi.org/10.2314/KXP:1881717380\">10.2314/KXP:1881717380</a>, .","havard":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22, Technische Hochschule Ostwestfalen-Lippe, Lemgo, 2023.","mla":"Borcherding, Holger, et al. <i>3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22</i>. Technische Hochschule Ostwestfalen-Lippe, 2023, <a href=\"https://doi.org/10.2314/KXP:1881717380\">https://doi.org/10.2314/KXP:1881717380</a>.","chicago":"Borcherding, Holger, André Springer, Tobias Müller, and Patrick Ehlert. <i>3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe, 2023. <a href=\"https://doi.org/10.2314/KXP:1881717380\">https://doi.org/10.2314/KXP:1881717380</a>.","short":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22, Technische Hochschule Ostwestfalen-Lippe, Lemgo, 2023.","ufg":"<b>Borcherding, Holger u. a.</b>: 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22, Lemgo 2023.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Borcherding, Holger</span> ; <span style=\"font-variant:small-caps;\">Springer, André</span> ; <span style=\"font-variant:small-caps;\">Müller, Tobias</span> ; <span style=\"font-variant:small-caps;\">Ehlert, Patrick</span>: <i>3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22</i>. Lemgo : Technische Hochschule Ostwestfalen-Lippe, 2023","bjps":"<b>Borcherding H <i>et al.</i></b> (2023) <i>3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22</i>. Lemgo: Technische Hochschule Ostwestfalen-Lippe.","ama":"Borcherding H, Springer A, Müller T, Ehlert P. <i>3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22</i>. Technische Hochschule Ostwestfalen-Lippe; 2023. doi:<a href=\"https://doi.org/10.2314/KXP:1881717380\">10.2314/KXP:1881717380</a>","van":"Borcherding H, Springer A, Müller T, Ehlert P. 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC<sup>2</sup>B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische Hochschule Ostwestfalen-Lippe; 2023. 26 p."},"language":[{"iso":"ger"}],"publisher":"Technische Hochschule Ostwestfalen-Lippe","department":[{"_id":"DEP7037"},{"_id":"DEP5018"}],"report_number":"13FH160PX8","year":"2023","author":[{"full_name":"Borcherding, Holger","id":"1693","last_name":"Borcherding","first_name":"Holger"},{"last_name":"Springer","full_name":"Springer, André","id":"71733","first_name":"André"},{"full_name":"Müller, Tobias","id":"59014","last_name":"Müller","first_name":"Tobias"},{"full_name":"Ehlert, Patrick","id":"62091","last_name":"Ehlert","first_name":"Patrick"}],"status":"public","title":"3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC²B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22","type":"research_paper","place":"Lemgo"},{"publisher":"VDE-Verlag","language":[{"iso":"eng"}],"citation":{"bjps":"<b>Borcherding H <i>et al.</i></b> (2022) <i>Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID)</i>, VDE ETG (ed.). Berlin: VDE-Verlag.","van":"Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID). VDE ETG, editor.   ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany. Berlin: VDE-Verlag; 2022. ( ETG-Fachberichte; vol. 165).","ama":"Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. <i>Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID)</i>. Vol 165. (VDE ETG, ed.). VDE-Verlag; 2022:500-507.","short":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID), VDE-Verlag, Berlin, 2022.","ufg":"<b>Borcherding, Holger u. a.</b>: Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID), Bd. 165, hg. von VDE ETG, Berlin 2022 ( ETG-Fachberichte).","din1505-2-1":"<span style=\"font-variant:small-caps;\">Borcherding, Holger</span> ; <span style=\"font-variant:small-caps;\">Springer, André</span> ; <span style=\"font-variant:small-caps;\">Müller, Tobias</span> ; <span style=\"font-variant:small-caps;\">Ehlert, Patrick</span> ; <span style=\"font-variant:small-caps;\">Tolksdorf, Andreas</span> ; <span style=\"font-variant:small-caps;\">VDE ETG</span> (Hrsg.): <i>Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)</i>, <i> ETG-Fachberichte</i>. Bd. 165. Berlin : VDE-Verlag, 2022","mla":"Borcherding, Holger, et al. “Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID).” <i>  ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany</i>, edited by VDE ETG, vol. 165, VDE-Verlag, 2022, pp. 500–07.","chicago":"Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert, and Andreas Tolksdorf. <i>Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID)</i>. Edited by VDE ETG. <i>  ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany</i>. Vol. 165.  ETG-Fachberichte. Berlin: VDE-Verlag, 2022.","ieee":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, and A. Tolksdorf, <i>Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)</i>, vol. 165. Berlin: VDE-Verlag, 2022, pp. 500–507.","apa":"Borcherding, H., Springer, A., Müller, T., Ehlert, P., &#38; Tolksdorf, A. (2022). Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID). In VDE ETG (Ed.), <i>  ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany</i> (Vol. 165, pp. 500–507). VDE-Verlag.","havard":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID), VDE-Verlag, Berlin, 2022.","chicago-de":"Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert und Andreas Tolksdorf. 2022. <i>Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)</i>. Hg. von VDE ETG. <i>  ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany</i>. Bd. 165.  ETG-Fachberichte. Berlin: VDE-Verlag."},"page":"500-507","corporate_editor":["VDE ETG"],"user_id":"83781","_id":"7844","intvolume":"       165","publication":"\t ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany","main_file_link":[{"url":"https://content-select.com/goto/62610b94-22cc-42ee-a46f-3c198677ec64/514/language:de"}],"status":"public","conference":{"start_date":"2022-03-15","end_date":"2022-03-17","location":"Berlin","name":"12th Int. Conference on Integrated Power Electronics Systems"},"series_title":" ETG-Fachberichte","date_updated":"2024-08-08T13:37:57Z","publication_status":"published","volume":165,"quality_controlled":"1","date_created":"2022-04-29T15:50:44Z","publication_identifier":{"isbn":["978-3-8007-5757-2"],"eisbn":["978-3-8007-5758-9"]},"place":"Berlin","type":"conference_editor_article","title":"Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)","author":[{"last_name":"Borcherding","full_name":"Borcherding, Holger","id":"1693","first_name":"Holger"},{"first_name":"André","full_name":"Springer, André","id":"71733","last_name":"Springer"},{"last_name":"Müller","id":"59014","full_name":"Müller, Tobias","first_name":"Tobias"},{"first_name":"Patrick","full_name":"Ehlert, Patrick","id":"62091","last_name":"Ehlert"},{"first_name":"Andreas","full_name":"Tolksdorf, Andreas","last_name":"Tolksdorf"}],"year":"2022","abstract":[{"lang":"eng","text":"The CMID (Coated Metal Interconnected Device) technology described here has its origins in MID (Moulded Intercon-\r\nnected Device) technology, which in itself is based on laser direct structuring (LDS). CMIDs are metallic base bodies \r\ncoated with LDS-compatiblepowder, allowing conductor paths to be structured and metallised on the coating. The metallic base bodies enable the heat management to be optimised and allow power electronic topologies to be implemented in addition to control electronics. Furthermore, in the context of 3D electronics, miniaturisation can be advanced through the use of unused spaces and housing parts. This is shown by manufacturing techniques and demonstrators of motor integrated inverters."}],"department":[{"_id":"DEP6020"},{"_id":"DEP7037"},{"_id":"DEP5018"}]},{"language":[{"iso":"eng"}],"citation":{"mla":"Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” <i>14th International Congress Molded Interconnect Devices (MID)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/mid50463.2021.9361628\">10.1109/mid50463.2021.9361628</a>.","chicago":"Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu, and André Springer. <i>Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications</i>. <i>14th International Congress Molded Interconnect Devices (MID)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/mid50463.2021.9361628\">https://doi.org/10.1109/mid50463.2021.9361628</a>.","apa":"Hemmelgarn, F., Ehlert, P., Mager, T., Jurgenhake, C., Dumitrescu, R., &#38; Springer, A. (2021). <i>Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications</i>. <i>14th International Congress Molded Interconnect Devices (MID)</i>. Amberg: IEEE. <a href=\"https://doi.org/10.1109/mid50463.2021.9361628\">https://doi.org/10.1109/mid50463.2021.9361628</a>","havard":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications, IEEE, 2021.","chicago-de":"Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu und André Springer. 2021. <i>Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications</i>. <i>14th International Congress Molded Interconnect Devices (MID)</i>. IEEE. doi:<a href=\"https://doi.org/10.1109/mid50463.2021.9361628,\">10.1109/mid50463.2021.9361628,</a> .","ieee":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, and A. Springer, <i>Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications</i>. IEEE, 2021.","ama":"Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. <i>Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/mid50463.2021.9361628\">10.1109/mid50463.2021.9361628</a>","van":"Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). IEEE; 2021.","bjps":"<b>Hemmelgarn F <i>et al.</i></b> (2021) <i>Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications</i>. IEEE.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Hemmelgarn, Florian</span> ; <span style=\"font-variant:small-caps;\">Ehlert, Patrick</span> ; <span style=\"font-variant:small-caps;\">Mager, Thomas</span> ; <span style=\"font-variant:small-caps;\">Jurgenhake, Christoph</span> ; <span style=\"font-variant:small-caps;\">Dumitrescu, Roman</span> ; <span style=\"font-variant:small-caps;\">Springer, André</span>: <i>Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications</i> : IEEE, 2021","short":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications, IEEE, 2021.","ufg":"<b>Hemmelgarn, Florian et. al. (2021)</b>: Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications."},"publisher":"IEEE","user_id":"79260","_id":"7841","publication_status":"published","date_updated":"2023-03-15T13:50:12Z","doi":"10.1109/mid50463.2021.9361628","publication":"14th International Congress Molded Interconnect Devices (MID)","date_created":"2022-04-29T15:22:37Z","type":"conference_editor_article","conference":{"name":"14th International Congress Molded Interconnect Devices (MID)","location":"Amberg","start_date":"2021-02-09","end_date":"2021-02-10"},"title":"Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications","author":[{"last_name":"Hemmelgarn","full_name":"Hemmelgarn, Florian","first_name":"Florian"},{"last_name":"Ehlert","full_name":"Ehlert, Patrick","id":"62091","first_name":"Patrick"},{"first_name":"Thomas","full_name":"Mager, Thomas","last_name":"Mager"},{"last_name":"Jurgenhake","full_name":"Jurgenhake, Christoph","first_name":"Christoph"},{"first_name":"Roman","full_name":"Dumitrescu, Roman","last_name":"Dumitrescu"},{"last_name":"Springer","id":"71733","full_name":"Springer, André","first_name":"André"}],"status":"public","year":2021,"department":[{"_id":"DEP7037"}]},{"date_created":"2022-04-29T15:45:43Z","user_id":"79260","_id":"7843","date_updated":"2023-03-15T13:50:12Z","language":[{"iso":"ger"}],"citation":{"din1505-2-1":"<span style=\"font-variant:small-caps;\">Ehlert, Patrick</span> ; <span style=\"font-variant:small-caps;\">Hemmelgarn, Florian</span> ; <span style=\"font-variant:small-caps;\">Mager, Thomas</span> ; <span style=\"font-variant:small-caps;\">Jürgenhake, Christoph</span> ; <span style=\"font-variant:small-caps;\">Wißbrock, Horst</span> ; <span style=\"font-variant:small-caps;\">Springer, André</span>: <i>Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen</i> : Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V., 2021","havard":"P. Ehlert, F. Hemmelgarn, T. Mager, C. Jürgenhake, H. Wißbrock, A. Springer, Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen, Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V., 2021.","chicago-de":"Ehlert, Patrick, Florian Hemmelgarn, Thomas Mager, Christoph Jürgenhake, Horst Wißbrock und André Springer. 2021. <i>Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen</i>. Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.","apa":"Ehlert, P., Hemmelgarn, F., Mager, T., Jürgenhake, C., Wißbrock, H., &#38; Springer, A. (2021). <i>Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen</i>. Presented at the 2. MID Summit, Nürnberg: Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.","ieee":"P. Ehlert, F. Hemmelgarn, T. Mager, C. Jürgenhake, H. Wißbrock, and A. Springer, <i>Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen</i>. Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V., 2021.","ufg":"<b>Ehlert, Patrick et. al. (2021)</b>: Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen.","short":"P. Ehlert, F. Hemmelgarn, T. Mager, C. Jürgenhake, H. Wißbrock, A. Springer, Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen, Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V., 2021.","chicago":"Ehlert, Patrick, Florian Hemmelgarn, Thomas Mager, Christoph Jürgenhake, Horst Wißbrock, and André Springer. <i>Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen</i>. Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V., 2021.","mla":"Ehlert, Patrick, et al. <i>Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen</i>. Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V., 2021.","ama":"Ehlert P, Hemmelgarn F, Mager T, Jürgenhake C, Wißbrock H, Springer A. <i>Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen</i>. Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.; 2021.","van":"Ehlert P, Hemmelgarn F, Mager T, Jürgenhake C, Wißbrock H, Springer A. Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen. Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.; 2021.","bjps":"<b>Ehlert P <i>et al.</i></b> (2021) <i>Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen</i>. Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V."},"publisher":"Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.","department":[{"_id":"DEP7037"}],"year":2021,"conference":{"location":"Nürnberg","name":"2. MID Summit","start_date":"2021-09-30"},"title":"Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen","author":[{"full_name":"Ehlert, Patrick","id":"62091","last_name":"Ehlert","first_name":"Patrick"},{"last_name":"Hemmelgarn","full_name":"Hemmelgarn, Florian","first_name":"Florian"},{"first_name":"Thomas","last_name":"Mager","full_name":"Mager, Thomas"},{"last_name":"Jürgenhake","full_name":"Jürgenhake, Christoph","first_name":"Christoph"},{"full_name":"Wißbrock, Horst","last_name":"Wißbrock","first_name":"Horst"},{"id":"71733","full_name":"Springer, André","last_name":"Springer","first_name":"André"}],"status":"public","type":"conference_poster"},{"application_number":"10 2019 113 340","date_created":"2022-05-03T11:51:40Z","_id":"7911","publication_date":"2020-11-26","user_id":"14633","date_updated":"2024-01-18T13:19:32Z","page":"19","ipn":"DE 10 2019 113 340 A1","citation":{"mla":"Stosch, Martin, et al. <i>3D-Druck Auf Holz. (DE102019113340A1)</i>. 2020.","chicago":"Stosch, Martin, André Springer, Franz-Josef Villmer, Matthias Meier, Constanze Kiwitt, Sebastian Plate, and Patrick Ehlert. “3D-Druck Auf Holz. (DE102019113340A1),” 2020.","ieee":"M. Stosch <i>et al.</i>, “3D-Druck auf Holz. (DE102019113340A1).” 2020.","apa":"Stosch, M., Springer, A., Villmer, F.-J., Meier, M., Kiwitt, C., Plate, S., &#38; Ehlert, P. (2020). <i>3D-Druck auf Holz. (DE102019113340A1)</i>.","chicago-de":"Stosch, Martin, André Springer, Franz-Josef Villmer, Matthias Meier, Constanze Kiwitt, Sebastian Plate und Patrick Ehlert. 2020. 3D-Druck auf Holz. (DE102019113340A1).","havard":"M. Stosch, A. Springer, F.-J. Villmer, M. Meier, C. Kiwitt, S. Plate, P. Ehlert, 3D-Druck auf Holz. (DE102019113340A1), (2020).","bjps":"<b>Stosch M <i>et al.</i></b> (2020) 3D-Druck Auf Holz. (DE102019113340A1).","van":"Stosch M, Springer A, Villmer FJ, Meier M, Kiwitt C, Plate S, et al. 3D-Druck auf Holz. (DE102019113340A1). 2020.","ama":"Stosch M, Springer A, Villmer FJ, et al. 3D-Druck auf Holz. (DE102019113340A1). Published online 2020.","short":"M. Stosch, A. Springer, F.-J. Villmer, M. Meier, C. Kiwitt, S. Plate, P. Ehlert, (2020).","ufg":"<b>Stosch, Martin u. a.</b>: 3D-Druck auf Holz. (DE102019113340A1), o. O. 2020.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Stosch, Martin</span> ; <span style=\"font-variant:small-caps;\">Springer, André</span> ; <span style=\"font-variant:small-caps;\">Villmer, Franz-Josef</span> ; <span style=\"font-variant:small-caps;\">Meier, Matthias</span> ; <span style=\"font-variant:small-caps;\">Kiwitt, Constanze</span> ; <span style=\"font-variant:small-caps;\">Plate, Sebastian</span> ; <span style=\"font-variant:small-caps;\">Ehlert, Patrick</span>: 3D-Druck auf Holz. (DE102019113340A1) (2020)"},"application_date":"2019-05-20","oa":"1","department":[{"_id":"DEP7037"}],"ipc":"B29C 64/118","year":"2020","author":[{"id":"14633","full_name":"Stosch, Martin","last_name":"Stosch","first_name":"Martin"},{"last_name":"Springer","id":"71733","full_name":"Springer, André","first_name":"André"},{"first_name":"Franz-Josef","last_name":"Villmer","full_name":"Villmer, Franz-Josef","id":"14290"},{"first_name":"Matthias","id":"14025","full_name":"Meier, Matthias","last_name":"Meier"},{"first_name":"Constanze","last_name":"Kiwitt","id":"48987","full_name":"Kiwitt, Constanze"},{"id":"69110","full_name":"Plate, Sebastian","last_name":"Plate","first_name":"Sebastian"},{"full_name":"Ehlert, Patrick","id":"62091","last_name":"Ehlert","first_name":"Patrick"}],"status":"public","title":"3D-Druck auf Holz. (DE102019113340A1)","type":"patent","main_file_link":[{"open_access":"1","url":"https://depatisnet.dpma.de/DepatisNet/depatisnet?action=pdf&docid=DE102019113340A1&xxxfull=1"}]},{"main_file_link":[{"url":"https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf","open_access":"1"}],"conference":{"start_date":"2017-09-28","end_date":"2017-09-29","name":"Proceedings7th International Conference","location":"Pordenone, Italy"},"status":"public","related_material":{"link":[{"relation":"contains","url":"https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf"}]},"extern":"1","language":[{"iso":"eng"}],"citation":{"mla":"Ehlert, Patrick, et al. “Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology.” <i>Production Engineering and Management</i>, edited by Elio Padoano et al., no. 1, 2017, pp. 127–36.","chicago":"Ehlert, Patrick, Oliver Stübbe, and Franz-Josef Villmer. “Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology.” In <i>Production Engineering and Management</i>, edited by Elio Padoano, Franz-Josef Villmer, Department of Production Engineering and Management, and Hochschule Ostwestfalen-Lippe, 127–36. Publication Series in Direct Digital Manufacturing . Lemgo, 2017.","ieee":"P. Ehlert, O. Stübbe, and F.-J. Villmer, “Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology,” in <i>Production Engineering and Management</i>, Pordenone, Italy, 2017, no. 1, pp. 127–136.","apa":"Ehlert, P., Stübbe, O., &#38; Villmer, F.-J. (2017). Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In E. Padoano, F.-J. Villmer, Department of Production Engineering and Management, &#38; Hochschule Ostwestfalen-Lippe (Eds.), <i>Production Engineering and Management</i> (Issue 1, pp. 127–136).","havard":"P. Ehlert, O. Stübbe, F.-J. Villmer, Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology, in: E. Padoano, F.-J. Villmer, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management, Lemgo, 2017: pp. 127–136.","chicago-de":"Ehlert, Patrick, Oliver Stübbe und Franz-Josef Villmer. 2017. Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: <i>Production Engineering and Management</i>, hg. von Elio Padoano, Franz-Josef Villmer, Department of Production Engineering and Management, und Hochschule Ostwestfalen-Lippe, 127–136. Publication series in direct digital manufacturing . Lemgo.","bjps":"<b>Ehlert P, Stübbe O and Villmer F-J</b> (2017) Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In Padoano E et al. (eds), <i>Production Engineering and Management</i>. Lemgo, pp. 127–136.","ama":"Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, eds. <i>Production Engineering and Management</i>. Publication series in direct digital manufacturing . ; 2017:127-136.","van":"Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, editors. Production Engineering and Management. Lemgo; 2017. p. 127–36. (Publication series in direct digital manufacturing ).","short":"P. Ehlert, O. Stübbe, F.-J. Villmer, in: E. Padoano, F.-J. Villmer, Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.), Production Engineering and Management, Lemgo, 2017, pp. 127–136.","ufg":"<b>Ehlert, Patrick/Stübbe, Oliver/Villmer, Franz-Josef</b>: Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology, in: <i>Padoano, Elio u. a. (Hgg.)</i>: Production Engineering and Management, Lemgo 2017 (Publication series in direct digital manufacturing ),  S. 127–136.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Ehlert, Patrick</span> ; <span style=\"font-variant:small-caps;\">Stübbe, Oliver</span> ; <span style=\"font-variant:small-caps;\">Villmer, Franz-Josef</span>: Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In: <span style=\"font-variant:small-caps;\">Padoano, E.</span> ; <span style=\"font-variant:small-caps;\">Villmer, F.-J.</span> ; <span style=\"font-variant:small-caps;\">Department of Production Engineering and Management</span> ; <span style=\"font-variant:small-caps;\">Hochschule Ostwestfalen-Lippe</span> (Hrsg.): <i>Production Engineering and Management</i>, <i>Publication series in direct digital manufacturing </i>. Lemgo, 2017, S. 127–136"},"oa":"1","_id":"573","keyword":["Additive manufacturing","Embedded optical waveguides","Electrical conductors","Embedded systems","FLM technology","Sensors"],"user_id":"51864","page":"127-136","corporate_editor":["Department of Production Engineering and Management","Hochschule Ostwestfalen-Lippe"],"editor":[{"last_name":"Padoano","full_name":"Padoano, Elio","first_name":"Elio"},{"first_name":"Franz-Josef","last_name":"Villmer","full_name":"Villmer, Franz-Josef","id":"14290"}],"publication":"Production Engineering and Management","place":"Lemgo","type":"conference","title":"Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology","issue":"1","author":[{"id":"62091","full_name":"Ehlert, Patrick","last_name":"Ehlert","first_name":"Patrick"},{"first_name":"Oliver","full_name":"Stübbe, Oliver","id":"51864","orcid":"https://orcid.org/0000-0001-7293-6893","last_name":"Stübbe"},{"last_name":"Villmer","id":"14290","full_name":"Villmer, Franz-Josef","first_name":"Franz-Josef"}],"abstract":[{"lang":"eng","text":"Additive manufacturing (AM) technologies have not only revolutionized product development and design by enabling rapid prototyping. They also gained influence on production in general, mainly because of their direct manufacturing capabilities. In the context of Industry 4.0 and the related process automation, innovative and advanced production technologies with completely new approaches are required [1]. AM technologies contribute to this with their advantages like freedom of design, cost efficient product individualization, and functional integration. On the other hand, AM still shows shortcomings in exploiting its full potential. Most current AM technologies are only applicable for manufacturing with singular materials. In particular, opportunities for processing of optically or electrically conductive materials are still missing. This paper contributes to the advancement of additive manufacturing of two different material variants or even two completely different materials. A special focus is laid on producing a part that combines mechanical with optical or electrical functionalities in one process step. The ultimate goal is to integrate sensor functionalities into an AM object, e.g. strain gauges. Extrusion processes, predominantly Fused Layer Modeling (FLM), are preferred in this research due to their mechanically simple machine setup in which additional functional materials can be adapted easily to the build process. In a first step, the general manufacturability has been evaluated. Thereafter, the resulting optical transmission properties have been analyzed. Especially the attenuation has to remain below a threshold value to accomplish a minimum signal-to-noise ratio."}],"year":"2017","department":[{"_id":"DEP1306"},{"_id":"DEP5020"},{"_id":"DEP5000"},{"_id":"DEP6020"}],"series_title":"Publication series in direct digital manufacturing ","publication_status":"published","date_updated":"2024-04-19T12:58:56Z","quality_controlled":"1","publication_identifier":{"isbn":["978-3-946856-01-6"]},"date_created":"2019-02-18T11:16:07Z"}]