---
_id: '12049'
author:
- first_name: Holger
full_name: Borcherding, Holger
id: '1693'
last_name: Borcherding
- first_name: André
full_name: Springer, André
id: '71733'
last_name: Springer
- first_name: Tobias
full_name: Müller, Tobias
id: '59014'
last_name: Müller
- first_name: Patrick
full_name: Ehlert, Patrick
id: '62091'
last_name: Ehlert
citation:
ama: 'Borcherding H, Springer A, Müller T, Ehlert P. 3D-Metalcore-LDS-Circuit-Board;
3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung
für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B :
Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Technische
Hochschule Ostwestfalen-Lippe; 2023. doi:10.2314/KXP:1881717380'
apa: 'Borcherding, H., Springer, A., Müller, T., & Ehlert, P. (2023). 3D-Metalcore-LDS-Circuit-Board;
3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung
für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B :
Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Technische
Hochschule Ostwestfalen-Lippe. https://doi.org/10.2314/KXP:1881717380'
bjps: 'Borcherding H et al. (2023) 3D-Metalcore-LDS-Circuit-Board;
3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung
für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B :
Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische
Hochschule Ostwestfalen-Lippe.'
chicago: 'Borcherding, Holger, André Springer, Tobias Müller, and Patrick Ehlert.
3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen
von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische
Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit
des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische Hochschule Ostwestfalen-Lippe,
2023. https://doi.org/10.2314/KXP:1881717380.'
chicago-de: 'Borcherding, Holger, André Springer, Tobias Müller und Patrick Ehlert.
2023. 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen
von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische
Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit
des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische Hochschule Ostwestfalen-Lippe.
doi:10.2314/KXP:1881717380,
.'
din1505-2-1: 'Borcherding, Holger
; Springer, André ; Müller,
Tobias ; Ehlert, Patrick:
3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen
von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische
Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit
des Vorhabens: 01.08.19 bis 31.10.22. Lemgo : Technische Hochschule Ostwestfalen-Lippe,
2023'
havard: 'H. Borcherding, A. Springer, T. Müller, P. Ehlert, 3D-Metalcore-LDS-Circuit-Board;
3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung
für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B :
Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22, Technische Hochschule
Ostwestfalen-Lippe, Lemgo, 2023.'
ieee: 'H. Borcherding, A. Springer, T. Müller, and P. Ehlert, 3D-Metalcore-LDS-Circuit-Board;
3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung
für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B :
Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische
Hochschule Ostwestfalen-Lippe, 2023. doi: 10.2314/KXP:1881717380.'
mla: 'Borcherding, Holger, et al. 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau
mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung
für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B :
Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Technische
Hochschule Ostwestfalen-Lippe, 2023, https://doi.org/10.2314/KXP:1881717380.'
short: 'H. Borcherding, A. Springer, T. Müller, P. Ehlert, 3D-Metalcore-LDS-Circuit-Board;
3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung
für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B :
Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22, Technische Hochschule
Ostwestfalen-Lippe, Lemgo, 2023.'
ufg: 'Borcherding, Holger u. a.: 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau
mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung
für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B :
Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22, Lemgo 2023.'
van: 'Borcherding H, Springer A, Müller T, Ehlert P. 3D-Metalcore-LDS-Circuit-Board;
3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung
für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B :
Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische
Hochschule Ostwestfalen-Lippe; 2023. 26 p.'
date_created: 2024-11-22T13:52:34Z
date_updated: 2024-11-27T14:18:19Z
department:
- _id: DEP7037
- _id: DEP5018
doi: 10.2314/KXP:1881717380
language:
- iso: ger
page: '26'
place: Lemgo
publication_status: published
publisher: Technische Hochschule Ostwestfalen-Lippe
report_number: 13FH160PX8
status: public
title: '3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen
von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische
Applikationen : FHprofUnt 2018 : 3D-MC²B : Schlussbericht : Laufzeit des Vorhabens:
01.08.19 bis 31.10.22'
type: research_paper
user_id: '83781'
year: '2023'
...
---
_id: '7844'
abstract:
- lang: eng
text: "The CMID (Coated Metal Interconnected Device) technology described here has
its origins in MID (Moulded Intercon-\r\nnected Device) technology, which in itself
is based on laser direct structuring (LDS). CMIDs are metallic base bodies \r\ncoated
with LDS-compatiblepowder, allowing conductor paths to be structured and metallised
on the coating. The metallic base bodies enable the heat management to be optimised
and allow power electronic topologies to be implemented in addition to control
electronics. Furthermore, in the context of 3D electronics, miniaturisation can
be advanced through the use of unused spaces and housing parts. This is shown
by manufacturing techniques and demonstrators of motor integrated inverters."
author:
- first_name: Holger
full_name: Borcherding, Holger
id: '1693'
last_name: Borcherding
- first_name: André
full_name: Springer, André
id: '71733'
last_name: Springer
- first_name: Tobias
full_name: Müller, Tobias
id: '59014'
last_name: Müller
- first_name: Patrick
full_name: Ehlert, Patrick
id: '62091'
last_name: Ehlert
- first_name: Andreas
full_name: Tolksdorf, Andreas
last_name: Tolksdorf
citation:
ama: Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. Integration
of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID).
Vol 165. (VDE ETG, ed.). VDE-Verlag; 2022:500-507.
apa: 'Borcherding, H., Springer, A., Müller, T., Ehlert, P., & Tolksdorf, A.
(2022). Integration of power electronic circuits using Coated Metal Interconnect
Devices (CMID). In VDE ETG (Ed.), ETG-Fb. 165: CIPS 2022 : 12th International
Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17,
2022, Berlin, Germany (Vol. 165, pp. 500–507). VDE-Verlag.'
bjps: 'Borcherding H et al. (2022) Integration of Power Electronic
Circuits Using Coated Metal Interconnect Devices (CMID), VDE ETG (ed.). Berlin:
VDE-Verlag.'
chicago: 'Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert, and
Andreas Tolksdorf. Integration of Power Electronic Circuits Using Coated Metal
Interconnect Devices (CMID). Edited by VDE ETG. ETG-Fb. 165: CIPS 2022 :
12th International Conference on Integrated Power Electronics Systems, Proceedings,
March, 15 – 17, 2022, Berlin, Germany. Vol. 165. ETG-Fachberichte. Berlin:
VDE-Verlag, 2022.'
chicago-de: 'Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert
und Andreas Tolksdorf. 2022. Integration of power electronic circuits using
Coated Metal Interconnect Devices (CMID). Hg. von VDE ETG. ETG-Fb. 165:
CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems,
Proceedings, March, 15 – 17, 2022, Berlin, Germany. Bd. 165. ETG-Fachberichte.
Berlin: VDE-Verlag.'
din1505-2-1: 'Borcherding, Holger
; Springer, André ; Müller,
Tobias ; Ehlert, Patrick
; Tolksdorf, Andreas ; VDE
ETG (Hrsg.): Integration of power electronic circuits using Coated Metal
Interconnect Devices (CMID), ETG-Fachberichte. Bd. 165. Berlin : VDE-Verlag,
2022'
havard: H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration
of power electronic circuits using Coated Metal Interconnect Devices (CMID), VDE-Verlag,
Berlin, 2022.
ieee: 'H. Borcherding, A. Springer, T. Müller, P. Ehlert, and A. Tolksdorf, Integration
of power electronic circuits using Coated Metal Interconnect Devices (CMID),
vol. 165. Berlin: VDE-Verlag, 2022, pp. 500–507.'
mla: 'Borcherding, Holger, et al. “Integration of Power Electronic Circuits Using
Coated Metal Interconnect Devices (CMID).” ETG-Fb. 165: CIPS 2022 : 12th
International Conference on Integrated Power Electronics Systems, Proceedings,
March, 15 – 17, 2022, Berlin, Germany, edited by VDE ETG, vol. 165, VDE-Verlag,
2022, pp. 500–07.'
short: H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration
of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID), VDE-Verlag,
Berlin, 2022.
ufg: 'Borcherding, Holger u. a.: Integration of power electronic circuits
using Coated Metal Interconnect Devices (CMID), Bd. 165, hg. von VDE ETG, Berlin
2022 ( ETG-Fachberichte).'
van: 'Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. Integration of
power electronic circuits using Coated Metal Interconnect Devices (CMID). VDE
ETG, editor. ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated
Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany.
Berlin: VDE-Verlag; 2022. ( ETG-Fachberichte; vol. 165).'
conference:
end_date: 2022-03-17
location: Berlin
name: 12th Int. Conference on Integrated Power Electronics Systems
start_date: 2022-03-15
corporate_editor:
- VDE ETG
date_created: 2022-04-29T15:50:44Z
date_updated: 2024-08-08T13:37:57Z
department:
- _id: DEP6020
- _id: DEP7037
- _id: DEP5018
intvolume: ' 165'
language:
- iso: eng
main_file_link:
- url: https://content-select.com/goto/62610b94-22cc-42ee-a46f-3c198677ec64/514/language:de
page: 500-507
place: Berlin
publication: "\t ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated
Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany"
publication_identifier:
eisbn:
- 978-3-8007-5758-9
isbn:
- 978-3-8007-5757-2
publication_status: published
publisher: VDE-Verlag
quality_controlled: '1'
series_title: ' ETG-Fachberichte'
status: public
title: Integration of power electronic circuits using Coated Metal Interconnect Devices
(CMID)
type: conference_editor_article
user_id: '83781'
volume: 165
year: '2022'
...
---
_id: '7841'
author:
- first_name: Florian
full_name: Hemmelgarn, Florian
last_name: Hemmelgarn
- first_name: Patrick
full_name: Ehlert, Patrick
id: '62091'
last_name: Ehlert
- first_name: Thomas
full_name: Mager, Thomas
last_name: Mager
- first_name: Christoph
full_name: Jurgenhake, Christoph
last_name: Jurgenhake
- first_name: Roman
full_name: Dumitrescu, Roman
last_name: Dumitrescu
- first_name: André
full_name: Springer, André
id: '71733'
last_name: Springer
citation:
ama: Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation
of Different Additive Manufacturing Technologies for MIDs in the Context of Smart
Sensor Systems for Retrofit Applications. IEEE; 2021. doi:10.1109/mid50463.2021.9361628
apa: 'Hemmelgarn, F., Ehlert, P., Mager, T., Jurgenhake, C., Dumitrescu, R., &
Springer, A. (2021). Evaluation of different additive manufacturing technologies
for MIDs in the context of smart sensor systems for retrofit applications.
14th International Congress Molded Interconnect Devices (MID). Amberg:
IEEE. https://doi.org/10.1109/mid50463.2021.9361628'
bjps: Hemmelgarn F et al. (2021) Evaluation of Different Additive
Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for
Retrofit Applications. IEEE.
chicago: Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake,
Roman Dumitrescu, and André Springer. Evaluation of Different Additive Manufacturing
Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.
14th International Congress Molded Interconnect Devices (MID). IEEE, 2021.
https://doi.org/10.1109/mid50463.2021.9361628.
chicago-de: Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake,
Roman Dumitrescu und André Springer. 2021. Evaluation of different additive
manufacturing technologies for MIDs in the context of smart sensor systems for
retrofit applications. 14th International Congress Molded Interconnect
Devices (MID). IEEE. doi:10.1109/mid50463.2021.9361628,
.
din1505-2-1: 'Hemmelgarn, Florian
; Ehlert, Patrick ; Mager,
Thomas ; Jurgenhake, Christoph
; Dumitrescu, Roman ; Springer,
André: Evaluation of different additive manufacturing technologies for
MIDs in the context of smart sensor systems for retrofit applications : IEEE,
2021'
havard: F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer,
Evaluation of different additive manufacturing technologies for MIDs in the context
of smart sensor systems for retrofit applications, IEEE, 2021.
ieee: F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, and A. Springer,
Evaluation of different additive manufacturing technologies for MIDs in the
context of smart sensor systems for retrofit applications. IEEE, 2021.
mla: Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing
Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.”
14th International Congress Molded Interconnect Devices (MID), IEEE, 2021,
doi:10.1109/mid50463.2021.9361628.
short: F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer,
Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context
of Smart Sensor Systems for Retrofit Applications, IEEE, 2021.
ufg: 'Hemmelgarn, Florian et. al. (2021): Evaluation of different additive
manufacturing technologies for MIDs in the context of smart sensor systems for
retrofit applications.'
van: Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation
of different additive manufacturing technologies for MIDs in the context of smart
sensor systems for retrofit applications. 14th International Congress Molded Interconnect
Devices (MID). IEEE; 2021.
conference:
end_date: 2021-02-10
location: Amberg
name: 14th International Congress Molded Interconnect Devices (MID)
start_date: 2021-02-09
date_created: 2022-04-29T15:22:37Z
date_updated: 2023-03-15T13:50:12Z
department:
- _id: DEP7037
doi: 10.1109/mid50463.2021.9361628
language:
- iso: eng
publication: 14th International Congress Molded Interconnect Devices (MID)
publication_status: published
publisher: IEEE
status: public
title: Evaluation of different additive manufacturing technologies for MIDs in the
context of smart sensor systems for retrofit applications
type: conference_editor_article
user_id: '79260'
year: 2021
...
---
_id: '7843'
author:
- first_name: Patrick
full_name: Ehlert, Patrick
id: '62091'
last_name: Ehlert
- first_name: Florian
full_name: Hemmelgarn, Florian
last_name: Hemmelgarn
- first_name: Thomas
full_name: Mager, Thomas
last_name: Mager
- first_name: Christoph
full_name: Jürgenhake, Christoph
last_name: Jürgenhake
- first_name: Horst
full_name: Wißbrock, Horst
last_name: Wißbrock
- first_name: André
full_name: Springer, André
id: '71733'
last_name: Springer
citation:
ama: Ehlert P, Hemmelgarn F, Mager T, Jürgenhake C, Wißbrock H, Springer A. Entwicklung
maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen. Forschungsvereinigung
Räumliche Elektronische Baugruppen 3-D MID e.V.; 2021.
apa: 'Ehlert, P., Hemmelgarn, F., Mager, T., Jürgenhake, C., Wißbrock, H., &
Springer, A. (2021). Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen.
Presented at the 2. MID Summit, Nürnberg: Forschungsvereinigung Räumliche Elektronische
Baugruppen 3-D MID e.V.'
bjps: Ehlert P et al. (2021) Entwicklung maßgeschneiderter Sensorsysteme
für Retrofit-Anwendungen. Forschungsvereinigung Räumliche Elektronische Baugruppen
3-D MID e.V.
chicago: Ehlert, Patrick, Florian Hemmelgarn, Thomas Mager, Christoph Jürgenhake,
Horst Wißbrock, and André Springer. Entwicklung maßgeschneiderter Sensorsysteme
für Retrofit-Anwendungen. Forschungsvereinigung Räumliche Elektronische Baugruppen
3-D MID e.V., 2021.
chicago-de: Ehlert, Patrick, Florian Hemmelgarn, Thomas Mager, Christoph Jürgenhake,
Horst Wißbrock und André Springer. 2021. Entwicklung maßgeschneiderter Sensorsysteme
für Retrofit-Anwendungen. Forschungsvereinigung Räumliche Elektronische Baugruppen
3-D MID e.V.
din1505-2-1: 'Ehlert, Patrick ; Hemmelgarn, Florian ; Mager,
Thomas ; Jürgenhake, Christoph
; Wißbrock, Horst ; Springer,
André: Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen :
Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V., 2021'
havard: P. Ehlert, F. Hemmelgarn, T. Mager, C. Jürgenhake, H. Wißbrock, A. Springer,
Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen, Forschungsvereinigung
Räumliche Elektronische Baugruppen 3-D MID e.V., 2021.
ieee: P. Ehlert, F. Hemmelgarn, T. Mager, C. Jürgenhake, H. Wißbrock, and A. Springer,
Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen. Forschungsvereinigung
Räumliche Elektronische Baugruppen 3-D MID e.V., 2021.
mla: Ehlert, Patrick, et al. Entwicklung maßgeschneiderter Sensorsysteme für
Retrofit-Anwendungen. Forschungsvereinigung Räumliche Elektronische Baugruppen
3-D MID e.V., 2021.
short: P. Ehlert, F. Hemmelgarn, T. Mager, C. Jürgenhake, H. Wißbrock, A. Springer,
Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen, Forschungsvereinigung
Räumliche Elektronische Baugruppen 3-D MID e.V., 2021.
ufg: 'Ehlert, Patrick et. al. (2021): Entwicklung maßgeschneiderter Sensorsysteme
für Retrofit-Anwendungen.'
van: Ehlert P, Hemmelgarn F, Mager T, Jürgenhake C, Wißbrock H, Springer A. Entwicklung
maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen. Forschungsvereinigung
Räumliche Elektronische Baugruppen 3-D MID e.V.; 2021.
conference:
location: Nürnberg
name: 2. MID Summit
start_date: 2021-09-30
date_created: 2022-04-29T15:45:43Z
date_updated: 2023-03-15T13:50:12Z
department:
- _id: DEP7037
language:
- iso: ger
publisher: Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
status: public
title: Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen
type: conference_poster
user_id: '79260'
year: 2021
...
---
_id: '7911'
application_date: 2019-05-20
application_number: 10 2019 113 340
author:
- first_name: Martin
full_name: Stosch, Martin
id: '14633'
last_name: Stosch
- first_name: André
full_name: Springer, André
id: '71733'
last_name: Springer
- first_name: Franz-Josef
full_name: Villmer, Franz-Josef
id: '14290'
last_name: Villmer
- first_name: Matthias
full_name: Meier, Matthias
id: '14025'
last_name: Meier
- first_name: Constanze
full_name: Kiwitt, Constanze
id: '48987'
last_name: Kiwitt
- first_name: Sebastian
full_name: Plate, Sebastian
id: '69110'
last_name: Plate
- first_name: Patrick
full_name: Ehlert, Patrick
id: '62091'
last_name: Ehlert
citation:
ama: Stosch M, Springer A, Villmer FJ, et al. 3D-Druck auf Holz. (DE102019113340A1).
Published online 2020.
apa: Stosch, M., Springer, A., Villmer, F.-J., Meier, M., Kiwitt, C., Plate, S.,
& Ehlert, P. (2020). 3D-Druck auf Holz. (DE102019113340A1).
bjps: Stosch M et al. (2020) 3D-Druck Auf Holz. (DE102019113340A1).
chicago: Stosch, Martin, André Springer, Franz-Josef Villmer, Matthias Meier, Constanze
Kiwitt, Sebastian Plate, and Patrick Ehlert. “3D-Druck Auf Holz. (DE102019113340A1),”
2020.
chicago-de: Stosch, Martin, André Springer, Franz-Josef Villmer, Matthias Meier,
Constanze Kiwitt, Sebastian Plate und Patrick Ehlert. 2020. 3D-Druck auf Holz.
(DE102019113340A1).
din1505-2-1: 'Stosch, Martin ; Springer, André ; Villmer,
Franz-Josef ; Meier, Matthias
; Kiwitt, Constanze ; Plate,
Sebastian ; Ehlert, Patrick:
3D-Druck auf Holz. (DE102019113340A1) (2020)'
havard: M. Stosch, A. Springer, F.-J. Villmer, M. Meier, C. Kiwitt, S. Plate, P.
Ehlert, 3D-Druck auf Holz. (DE102019113340A1), (2020).
ieee: M. Stosch et al., “3D-Druck auf Holz. (DE102019113340A1).” 2020.
mla: Stosch, Martin, et al. 3D-Druck Auf Holz. (DE102019113340A1). 2020.
short: M. Stosch, A. Springer, F.-J. Villmer, M. Meier, C. Kiwitt, S. Plate, P.
Ehlert, (2020).
ufg: 'Stosch, Martin u. a.: 3D-Druck auf Holz. (DE102019113340A1), o. O.
2020.'
van: Stosch M, Springer A, Villmer FJ, Meier M, Kiwitt C, Plate S, et al. 3D-Druck
auf Holz. (DE102019113340A1). 2020.
date_created: 2022-05-03T11:51:40Z
date_updated: 2024-01-18T13:19:32Z
department:
- _id: DEP7037
ipc: B29C 64/118
ipn: DE 10 2019 113 340 A1
main_file_link:
- open_access: '1'
url: https://depatisnet.dpma.de/DepatisNet/depatisnet?action=pdf&docid=DE102019113340A1&xxxfull=1
oa: '1'
page: '19'
publication_date: 2020-11-26
status: public
title: 3D-Druck auf Holz. (DE102019113340A1)
type: patent
user_id: '14633'
year: '2020'
...
---
_id: '573'
abstract:
- lang: eng
text: Additive manufacturing (AM) technologies have not only revolutionized product
development and design by enabling rapid prototyping. They also gained influence
on production in general, mainly because of their direct manufacturing capabilities.
In the context of Industry 4.0 and the related process automation, innovative
and advanced production technologies with completely new approaches are required
[1]. AM technologies contribute to this with their advantages like freedom of
design, cost efficient product individualization, and functional integration.
On the other hand, AM still shows shortcomings in exploiting its full potential.
Most current AM technologies are only applicable for manufacturing with singular
materials. In particular, opportunities for processing of optically or electrically
conductive materials are still missing. This paper contributes to the advancement
of additive manufacturing of two different material variants or even two completely
different materials. A special focus is laid on producing a part that combines
mechanical with optical or electrical functionalities in one process step. The
ultimate goal is to integrate sensor functionalities into an AM object, e.g. strain
gauges. Extrusion processes, predominantly Fused Layer Modeling (FLM), are preferred
in this research due to their mechanically simple machine setup in which additional
functional materials can be adapted easily to the build process. In a first step,
the general manufacturability has been evaluated. Thereafter, the resulting optical
transmission properties have been analyzed. Especially the attenuation has to
remain below a threshold value to accomplish a minimum signal-to-noise ratio.
author:
- first_name: Patrick
full_name: Ehlert, Patrick
id: '62091'
last_name: Ehlert
- first_name: Oliver
full_name: Stübbe, Oliver
id: '51864'
last_name: Stübbe
orcid: https://orcid.org/0000-0001-7293-6893
- first_name: Franz-Josef
full_name: Villmer, Franz-Josef
id: '14290'
last_name: Villmer
citation:
ama: 'Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing
of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department
of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, eds.
Production Engineering and Management. Publication series in direct digital
manufacturing . ; 2017:127-136.'
apa: Ehlert, P., Stübbe, O., & Villmer, F.-J. (2017). Investigation on the Direct
Manufacturing of Waveguides and Sensors Using FLM Technology. In E. Padoano, F.-J.
Villmer, Department of Production Engineering and Management, & Hochschule
Ostwestfalen-Lippe (Eds.), Production Engineering and Management (Issue
1, pp. 127–136).
bjps: Ehlert P, Stübbe O and Villmer F-J (2017) Investigation on the Direct
Manufacturing of Waveguides and Sensors Using FLM Technology. In Padoano E et
al. (eds), Production Engineering and Management. Lemgo, pp. 127–136.
chicago: Ehlert, Patrick, Oliver Stübbe, and Franz-Josef Villmer. “Investigation
on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology.” In
Production Engineering and Management, edited by Elio Padoano, Franz-Josef
Villmer, Department of Production Engineering and Management, and Hochschule Ostwestfalen-Lippe,
127–36. Publication Series in Direct Digital Manufacturing . Lemgo, 2017.
chicago-de: 'Ehlert, Patrick, Oliver Stübbe und Franz-Josef Villmer. 2017. Investigation
on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology. In:
Production Engineering and Management, hg. von Elio Padoano, Franz-Josef
Villmer, Department of Production Engineering and Management, und Hochschule Ostwestfalen-Lippe,
127–136. Publication series in direct digital manufacturing . Lemgo.'
din1505-2-1: 'Ehlert, Patrick ; Stübbe, Oliver ; Villmer,
Franz-Josef: Investigation on the Direct Manufacturing of Waveguides and
Sensors Using FLM Technology. In: Padoano,
E. ; Villmer, F.-J. ; Department of Production Engineering and Management
; Hochschule Ostwestfalen-Lippe
(Hrsg.): Production Engineering and Management, Publication series in
direct digital manufacturing . Lemgo, 2017, S. 127–136'
havard: 'P. Ehlert, O. Stübbe, F.-J. Villmer, Investigation on the Direct Manufacturing
of Waveguides and Sensors Using FLM Technology, in: E. Padoano, F.-J. Villmer,
Department of Production Engineering and Management, Hochschule Ostwestfalen-Lippe
(Eds.), Production Engineering and Management, Lemgo, 2017: pp. 127–136.'
ieee: P. Ehlert, O. Stübbe, and F.-J. Villmer, “Investigation on the Direct Manufacturing
of Waveguides and Sensors Using FLM Technology,” in Production Engineering
and Management, Pordenone, Italy, 2017, no. 1, pp. 127–136.
mla: Ehlert, Patrick, et al. “Investigation on the Direct Manufacturing of Waveguides
and Sensors Using FLM Technology.” Production Engineering and Management,
edited by Elio Padoano et al., no. 1, 2017, pp. 127–36.
short: 'P. Ehlert, O. Stübbe, F.-J. Villmer, in: E. Padoano, F.-J. Villmer, Department
of Production Engineering and Management, Hochschule Ostwestfalen-Lippe (Eds.),
Production Engineering and Management, Lemgo, 2017, pp. 127–136.'
ufg: 'Ehlert, Patrick/Stübbe, Oliver/Villmer, Franz-Josef: Investigation
on the Direct Manufacturing of Waveguides and Sensors Using FLM Technology, in:
Padoano, Elio u. a. (Hgg.): Production Engineering and Management, Lemgo
2017 (Publication series in direct digital manufacturing ), S. 127–136.'
van: 'Ehlert P, Stübbe O, Villmer FJ. Investigation on the Direct Manufacturing
of Waveguides and Sensors Using FLM Technology. In: Padoano E, Villmer FJ, Department
of Production Engineering and Management, Hochschule Ostwestfalen-Lippe, editors.
Production Engineering and Management. Lemgo; 2017. p. 127–36. (Publication series
in direct digital manufacturing ).'
conference:
end_date: 2017-09-29
location: Pordenone, Italy
name: Proceedings7th International Conference
start_date: 2017-09-28
corporate_editor:
- Department of Production Engineering and Management
- Hochschule Ostwestfalen-Lippe
date_created: 2019-02-18T11:16:07Z
date_updated: 2024-04-19T12:58:56Z
department:
- _id: DEP1306
- _id: DEP5020
- _id: DEP5000
- _id: DEP6020
editor:
- first_name: Elio
full_name: Padoano, Elio
last_name: Padoano
- first_name: Franz-Josef
full_name: Villmer, Franz-Josef
id: '14290'
last_name: Villmer
extern: '1'
issue: '1'
keyword:
- Additive manufacturing
- Embedded optical waveguides
- Electrical conductors
- Embedded systems
- FLM technology
- Sensors
language:
- iso: eng
main_file_link:
- open_access: '1'
url: https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf
oa: '1'
page: 127-136
place: Lemgo
publication: Production Engineering and Management
publication_identifier:
isbn:
- 978-3-946856-01-6
publication_status: published
quality_controlled: '1'
related_material:
link:
- relation: contains
url: https://www.hs-owl.de/fileadmin/diman/Veroeffentlichungen/PEM_2017_Proceeding_web.pdf
series_title: 'Publication series in direct digital manufacturing '
status: public
title: Investigation on the Direct Manufacturing of Waveguides and Sensors Using FLM
Technology
type: conference
user_id: '51864'
year: '2017'
...