[{"department":[{"_id":"DEP7037"},{"_id":"DEP5018"}],"author":[{"last_name":"Borcherding","first_name":"Holger","full_name":"Borcherding, Holger","id":"1693"},{"full_name":"Springer, André","id":"71733","first_name":"André","last_name":"Springer"},{"full_name":"Müller, Tobias","first_name":"Tobias","id":"59014","last_name":"Müller"},{"last_name":"Ehlert","full_name":"Ehlert, Patrick","id":"62091","first_name":"Patrick"}],"year":"2023","publisher":"Technische Hochschule Ostwestfalen-Lippe","page":"26","status":"public","title":"3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC²B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22","publication_status":"published","citation":{"ieee":"H. Borcherding, A. Springer, T. Müller, and P. Ehlert, 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische Hochschule Ostwestfalen-Lippe, 2023. doi: 10.2314/KXP:1881717380.","ama":"Borcherding H, Springer A, Müller T, Ehlert P. 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Technische Hochschule Ostwestfalen-Lippe; 2023. doi:10.2314/KXP:1881717380","chicago":"Borcherding, Holger, André Springer, Tobias Müller, and Patrick Ehlert. 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische Hochschule Ostwestfalen-Lippe, 2023. https://doi.org/10.2314/KXP:1881717380.","apa":"Borcherding, H., Springer, A., Müller, T., & Ehlert, P. (2023). 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Technische Hochschule Ostwestfalen-Lippe. https://doi.org/10.2314/KXP:1881717380","bjps":"Borcherding H et al. (2023) 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische Hochschule Ostwestfalen-Lippe.","havard":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22, Technische Hochschule Ostwestfalen-Lippe, Lemgo, 2023.","mla":"Borcherding, Holger, et al. 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Technische Hochschule Ostwestfalen-Lippe, 2023, https://doi.org/10.2314/KXP:1881717380.","ufg":"Borcherding, Holger u. a.: 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22, Lemgo 2023.","van":"Borcherding H, Springer A, Müller T, Ehlert P. 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische Hochschule Ostwestfalen-Lippe; 2023. 26 p.","din1505-2-1":"Borcherding, Holger ; Springer, André ; Müller, Tobias ; Ehlert, Patrick: 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo : Technische Hochschule Ostwestfalen-Lippe, 2023","chicago-de":"Borcherding, Holger, André Springer, Tobias Müller und Patrick Ehlert. 2023. 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22. Lemgo: Technische Hochschule Ostwestfalen-Lippe. doi:10.2314/KXP:1881717380, .","short":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, 3D-Metalcore-LDS-Circuit-Board; 3D-Leiterkartenaufbau mittels Polymerbeschichtungen von Metallsubstraten und Laser-Direkt-Strukturierung für kompakte leistungselektronische Applikationen : FHprofUnt 2018 : 3D-MC2B : Schlussbericht : Laufzeit des Vorhabens: 01.08.19 bis 31.10.22, Technische Hochschule Ostwestfalen-Lippe, Lemgo, 2023."},"doi":"10.2314/KXP:1881717380","_id":"12049","language":[{"iso":"ger"}],"place":"Lemgo","report_number":"13FH160PX8","type":"research_paper","date_created":"2024-11-22T13:52:34Z","date_updated":"2024-11-27T14:18:19Z","user_id":"83781"},{"conference":{"name":"48. International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz)","location":"Montreal, Canada","end_date":"2023-09-22","start_date":"2023-09-17"},"department":[{"_id":"DEP5020"},{"_id":"DEP6020"},{"_id":"DEP5000"}],"author":[{"full_name":"Shrotri, Abhijeet Narendra","first_name":"Abhijeet Narendra","id":"74090","last_name":"Shrotri","orcid":"0000-0003-2116-156X"},{"first_name":"Amlan kusum","full_name":"Mukherjee, Amlan kusum","last_name":"Mukherjee"},{"first_name":"Sven","full_name":"Lohöfener, Sven","id":"46531","last_name":"Lohöfener"},{"first_name":"André","full_name":"Springer, André","last_name":"Springer","id":"71733"},{"full_name":"Stübbe, Oliver","id":"51864","last_name":"Stübbe","first_name":"Oliver","orcid":"https://orcid.org/0000-0001-7293-6893"},{"full_name":"Preu, Sascha","last_name":"Preu","first_name":"Sascha"}],"year":"2023","abstract":[{"text":"Additive manufacturing provides a lucrative alternative for manufacturing of functional prototypes. This paper emonstrates the manufacturing and characterization of hollow core waveguide prototypes with circular cross section using suitable metal and polymers for Terahertz sensing applications. These additively manufactured waveguide prototypes are characterized from 0.1 to 1.25 THz to evaluate the attenuation and coupling losses.","lang":"eng"}],"status":"public","publisher":"IEEE","title":"Additive manufacturing and characterization of hollow core metal and topas waveguides for Terahertz sensor systems","publication_status":"published","citation":{"chicago":"Shrotri, Abhijeet Narendra, Amlan kusum Mukherjee, Sven Lohöfener, André Springer, Oliver Stübbe, and Sascha Preu. Additive Manufacturing and Characterization of Hollow Core Metal and Topas Waveguides for Terahertz Sensor Systems. Edited by David G. Cooke. IRMMW-THz 2023 : 48th International Conference on Infrared, Millimeter and Terahertz Waves : 17-22 September 2023, Montreal, Quebec, Canada. [Piscataway, NJ]: IEEE, 2023. https://doi.org/10.1109/IRMMW-THz57677.2023.10299134.","apa":"Shrotri, A. N., Mukherjee, A. kusum, Lohöfener, S., Springer, A., Stübbe, O., & Preu, S. (2023). Additive manufacturing and characterization of hollow core metal and topas waveguides for Terahertz sensor systems. In D. G. Cooke (Ed.), IRMMW-THz 2023 : 48th International Conference on Infrared, Millimeter and Terahertz Waves : 17-22 September 2023, Montreal, Quebec, Canada. IEEE. https://doi.org/10.1109/IRMMW-THz57677.2023.10299134","ieee":"A. N. Shrotri, A. kusum Mukherjee, S. Lohöfener, A. Springer, O. Stübbe, and S. Preu, Additive manufacturing and characterization of hollow core metal and topas waveguides for Terahertz sensor systems. [Piscataway, NJ]: IEEE, 2023. doi: 10.1109/IRMMW-THz57677.2023.10299134.","ufg":"Shrotri, Abhijeet Narendra u. a.: Additive manufacturing and characterization of hollow core metal and topas waveguides for Terahertz sensor systems, hg. von Cooke, David G., [Piscataway, NJ] 2023.","bjps":"Shrotri AN et al. (2023) Additive Manufacturing and Characterization of Hollow Core Metal and Topas Waveguides for Terahertz Sensor Systems, Cooke DG (ed.). [Piscataway, NJ]: IEEE.","mla":"Shrotri, Abhijeet Narendra, et al. “Additive Manufacturing and Characterization of Hollow Core Metal and Topas Waveguides for Terahertz Sensor Systems.” IRMMW-THz 2023 : 48th International Conference on Infrared, Millimeter and Terahertz Waves : 17-22 September 2023, Montreal, Quebec, Canada, edited by David G. Cooke, IEEE, 2023, https://doi.org/10.1109/IRMMW-THz57677.2023.10299134.","havard":"A.N. Shrotri, A. kusum Mukherjee, S. Lohöfener, A. Springer, O. Stübbe, S. Preu, Additive manufacturing and characterization of hollow core metal and topas waveguides for Terahertz sensor systems, IEEE, [Piscataway, NJ], 2023.","van":"Shrotri AN, Mukherjee A kusum, Lohöfener S, Springer A, Stübbe O, Preu S. Additive manufacturing and characterization of hollow core metal and topas waveguides for Terahertz sensor systems. Cooke DG, editor. IRMMW-THz 2023 : 48th International Conference on Infrared, Millimeter and Terahertz Waves : 17-22 September 2023, Montreal, Quebec, Canada. [Piscataway, NJ]: IEEE; 2023.","ama":"Shrotri AN, Mukherjee A kusum, Lohöfener S, Springer A, Stübbe O, Preu S. Additive Manufacturing and Characterization of Hollow Core Metal and Topas Waveguides for Terahertz Sensor Systems. (Cooke DG, ed.). IEEE; 2023. doi:10.1109/IRMMW-THz57677.2023.10299134","din1505-2-1":"Shrotri, Abhijeet Narendra ; Mukherjee, Amlan kusum ; Lohöfener, Sven ; Springer, André ; Stübbe, Oliver ; Preu, Sascha ; Cooke, D. G. (Hrsg.): Additive manufacturing and characterization of hollow core metal and topas waveguides for Terahertz sensor systems. [Piscataway, NJ] : IEEE, 2023","chicago-de":"Shrotri, Abhijeet Narendra, Amlan kusum Mukherjee, Sven Lohöfener, André Springer, Oliver Stübbe und Sascha Preu. 2023. Additive manufacturing and characterization of hollow core metal and topas waveguides for Terahertz sensor systems. Hg. von David G. Cooke. IRMMW-THz 2023 : 48th International Conference on Infrared, Millimeter and Terahertz Waves : 17-22 September 2023, Montreal, Quebec, Canada. [Piscataway, NJ]: IEEE. doi:10.1109/IRMMW-THz57677.2023.10299134, .","short":"A.N. Shrotri, A. kusum Mukherjee, S. Lohöfener, A. Springer, O. Stübbe, S. Preu, Additive Manufacturing and Characterization of Hollow Core Metal and Topas Waveguides for Terahertz Sensor Systems, IEEE, [Piscataway, NJ], 2023."},"language":[{"iso":"eng"}],"place":"[Piscataway, NJ]","doi":"10.1109/IRMMW-THz57677.2023.10299134","_id":"10545","date_created":"2023-09-29T12:34:37Z","type":"conference_editor_article","publication":"IRMMW-THz 2023 : 48th International Conference on Infrared, Millimeter and Terahertz Waves : 17-22 September 2023, Montreal, Quebec, Canada","publication_identifier":{"eissn":["2162-2035 "],"isbn":["979-8-3503-3660-3","979-8-3503-3661-0"],"issn":["2162-2027 "]},"date_updated":"2025-06-12T13:48:00Z","user_id":"83781","editor":[{"full_name":"Cooke, David G.","last_name":"Cooke","first_name":"David G."}]},{"publication_status":"published","series_title":" ETG-Fachberichte","publisher":"VDE-Verlag","quality_controlled":"1","department":[{"_id":"DEP6020"},{"_id":"DEP7037"},{"_id":"DEP5018"}],"conference":{"end_date":"2022-03-17","start_date":"2022-03-15","location":"Berlin","name":"12th Int. Conference on Integrated Power Electronics Systems"},"abstract":[{"text":"The CMID (Coated Metal Interconnected Device) technology described here has its origins in MID (Moulded Intercon-\r\nnected Device) technology, which in itself is based on laser direct structuring (LDS). CMIDs are metallic base bodies \r\ncoated with LDS-compatiblepowder, allowing conductor paths to be structured and metallised on the coating. The metallic base bodies enable the heat management to be optimised and allow power electronic topologies to be implemented in addition to control electronics. Furthermore, in the context of 3D electronics, miniaturisation can be advanced through the use of unused spaces and housing parts. This is shown by manufacturing techniques and demonstrators of motor integrated inverters.","lang":"eng"}],"user_id":"83781","intvolume":" 165","type":"conference_editor_article","place":"Berlin","_id":"7844","citation":{"ieee":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, and A. Tolksdorf, Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID), vol. 165. Berlin: VDE-Verlag, 2022, pp. 500–507.","ama":"Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID). Vol 165. (VDE ETG, ed.). VDE-Verlag; 2022:500-507.","chicago":"Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert, and Andreas Tolksdorf. Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID). Edited by VDE ETG. ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany. Vol. 165. ETG-Fachberichte. Berlin: VDE-Verlag, 2022.","apa":"Borcherding, H., Springer, A., Müller, T., Ehlert, P., & Tolksdorf, A. (2022). Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID). In VDE ETG (Ed.), ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany (Vol. 165, pp. 500–507). VDE-Verlag.","ufg":"Borcherding, Holger u. a.: Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID), Bd. 165, hg. von VDE ETG, Berlin 2022 ( ETG-Fachberichte).","bjps":"Borcherding H et al. (2022) Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID), VDE ETG (ed.). Berlin: VDE-Verlag.","havard":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID), VDE-Verlag, Berlin, 2022.","mla":"Borcherding, Holger, et al. “Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID).” ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany, edited by VDE ETG, vol. 165, VDE-Verlag, 2022, pp. 500–07.","van":"Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID). VDE ETG, editor. ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany. Berlin: VDE-Verlag; 2022. ( ETG-Fachberichte; vol. 165).","din1505-2-1":"Borcherding, Holger ; Springer, André ; Müller, Tobias ; Ehlert, Patrick ; Tolksdorf, Andreas ; VDE ETG (Hrsg.): Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID), ETG-Fachberichte. Bd. 165. Berlin : VDE-Verlag, 2022","chicago-de":"Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert und Andreas Tolksdorf. 2022. Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID). Hg. von VDE ETG. ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany. Bd. 165. ETG-Fachberichte. Berlin: VDE-Verlag.","short":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID), VDE-Verlag, Berlin, 2022."},"volume":165,"title":"Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)","status":"public","page":"500-507","main_file_link":[{"url":"https://content-select.com/goto/62610b94-22cc-42ee-a46f-3c198677ec64/514/language:de"}],"author":[{"id":"1693","full_name":"Borcherding, Holger","first_name":"Holger","last_name":"Borcherding"},{"full_name":"Springer, André","last_name":"Springer","id":"71733","first_name":"André"},{"last_name":"Müller","full_name":"Müller, Tobias","id":"59014","first_name":"Tobias"},{"first_name":"Patrick","last_name":"Ehlert","full_name":"Ehlert, Patrick","id":"62091"},{"last_name":"Tolksdorf","first_name":"Andreas","full_name":"Tolksdorf, Andreas"}],"year":"2022","date_updated":"2024-08-08T13:37:57Z","corporate_editor":["VDE ETG"],"publication_identifier":{"eisbn":["978-3-8007-5758-9"],"isbn":["978-3-8007-5757-2"]},"publication":"\t ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany","date_created":"2022-04-29T15:50:44Z","language":[{"iso":"eng"}]},{"language":[{"iso":"eng"}],"doi":"10.1109/mid50463.2021.9361628","_id":"7841","date_updated":"2023-03-15T13:50:12Z","user_id":"79260","type":"conference_editor_article","date_created":"2022-04-29T15:22:37Z","publication":"14th International Congress Molded Interconnect Devices (MID)","status":"public","publisher":"IEEE","conference":{"name":"14th International Congress Molded Interconnect Devices (MID)","location":"Amberg","end_date":"2021-02-10","start_date":"2021-02-09"},"department":[{"_id":"DEP7037"}],"year":2021,"author":[{"first_name":"Florian","full_name":"Hemmelgarn, Florian","last_name":"Hemmelgarn"},{"id":"62091","last_name":"Ehlert","first_name":"Patrick","full_name":"Ehlert, Patrick"},{"full_name":"Mager, Thomas","last_name":"Mager","first_name":"Thomas"},{"last_name":"Jurgenhake","full_name":"Jurgenhake, Christoph","first_name":"Christoph"},{"last_name":"Dumitrescu","first_name":"Roman","full_name":"Dumitrescu, Roman"},{"last_name":"Springer","id":"71733","full_name":"Springer, André","first_name":"André"}],"publication_status":"published","citation":{"ama":"Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications. IEEE; 2021. doi:10.1109/mid50463.2021.9361628","ieee":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, and A. Springer, Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. IEEE, 2021.","van":"Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). IEEE; 2021.","bjps":"Hemmelgarn F et al. (2021) Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications. IEEE.","mla":"Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” 14th International Congress Molded Interconnect Devices (MID), IEEE, 2021, doi:10.1109/mid50463.2021.9361628.","havard":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications, IEEE, 2021.","ufg":"Hemmelgarn, Florian et. al. (2021): Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications.","apa":"Hemmelgarn, F., Ehlert, P., Mager, T., Jurgenhake, C., Dumitrescu, R., & Springer, A. (2021). Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). Amberg: IEEE. https://doi.org/10.1109/mid50463.2021.9361628","chicago":"Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu, and André Springer. Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications. 14th International Congress Molded Interconnect Devices (MID). IEEE, 2021. https://doi.org/10.1109/mid50463.2021.9361628.","short":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications, IEEE, 2021.","chicago-de":"Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu und André Springer. 2021. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). IEEE. doi:10.1109/mid50463.2021.9361628, .","din1505-2-1":"Hemmelgarn, Florian ; Ehlert, Patrick ; Mager, Thomas ; Jurgenhake, Christoph ; Dumitrescu, Roman ; Springer, André: Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications : IEEE, 2021"},"title":"Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications"},{"date_updated":"2023-03-15T13:50:12Z","user_id":"79260","type":"conference_poster","date_created":"2022-04-29T15:45:43Z","_id":"7843","language":[{"iso":"ger"}],"citation":{"chicago-de":"Ehlert, Patrick, Florian Hemmelgarn, Thomas Mager, Christoph Jürgenhake, Horst Wißbrock und André Springer. 2021. Entwicklung maßgeschneiderter Sensorsysteme für Retrofit-Anwendungen. 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Krämer et al., “Design considerations for a novel shape-memory-plate osteosynthesis allowing for non-invasive alteration of bending stiffness,” Journal of the Mechanical Behavior of Biomedical Materials, vol. 75, no. November, pp. 558–566, 2017.","ama":"Krämer M, Müller CW, Hermann M, et al. Design considerations for a novel shape-memory-plate osteosynthesis allowing for non-invasive alteration of bending stiffness. Journal of the Mechanical Behavior of Biomedical Materials. 2017;75(November):558-566. doi:10.1016/j.jmbbm.2017.08.024","chicago":"Krämer, Manuel, Christian W. Müller, Maike Hermann, Sebastian Decker, André Springer, Ludger Overmeyer, Christof Hurschler, and Ronny Pfeifer. “Design Considerations for a Novel Shape-Memory-Plate Osteosynthesis Allowing for Non-Invasive Alteration of Bending Stiffness.” Journal of the Mechanical Behavior of Biomedical Materials 75, no. November (2017): 558–66. https://doi.org/10.1016/j.jmbbm.2017.08.024.","apa":"Krämer, M., Müller, C. W., Hermann, M., Decker, S., Springer, A., Overmeyer, L., … Pfeifer, R. (2017). Design considerations for a novel shape-memory-plate osteosynthesis allowing for non-invasive alteration of bending stiffness. Journal of the Mechanical Behavior of Biomedical Materials, 75(November), 558–566. https://doi.org/10.1016/j.jmbbm.2017.08.024","ufg":"Krämer, Manuel et. al. (2017): Design considerations for a novel shape-memory-plate osteosynthesis allowing for non-invasive alteration of bending stiffness, in: Journal of the Mechanical Behavior of Biomedical Materials 75 (November), S. 558–566.","mla":"Krämer, Manuel, et al. “Design Considerations for a Novel Shape-Memory-Plate Osteosynthesis Allowing for Non-Invasive Alteration of Bending Stiffness.” Journal of the Mechanical Behavior of Biomedical Materials, vol. 75, no. November, Elsevier, 2017, pp. 558–66, doi:10.1016/j.jmbbm.2017.08.024.","bjps":"Krämer M et al. (2017) Design Considerations for a Novel Shape-Memory-Plate Osteosynthesis Allowing for Non-Invasive Alteration of Bending Stiffness. Journal of the Mechanical Behavior of Biomedical Materials 75, 558–566.","havard":"M. Krämer, C.W. Müller, M. Hermann, S. Decker, A. Springer, L. Overmeyer, C. Hurschler, R. Pfeifer, Design considerations for a novel shape-memory-plate osteosynthesis allowing for non-invasive alteration of bending stiffness, Journal of the Mechanical Behavior of Biomedical Materials. 75 (2017) 558–566.","van":"Krämer M, Müller CW, Hermann M, Decker S, Springer A, Overmeyer L, et al. Design considerations for a novel shape-memory-plate osteosynthesis allowing for non-invasive alteration of bending stiffness. Journal of the Mechanical Behavior of Biomedical Materials. 2017;75(November):558–66.","chicago-de":"Krämer, Manuel, Christian W. Müller, Maike Hermann, Sebastian Decker, André Springer, Ludger Overmeyer, Christof Hurschler und Ronny Pfeifer. 2017. Design considerations for a novel shape-memory-plate osteosynthesis allowing for non-invasive alteration of bending stiffness. Journal of the Mechanical Behavior of Biomedical Materials 75, Nr. November: 558–566. doi:10.1016/j.jmbbm.2017.08.024, .","din1505-2-1":"Krämer, Manuel ; Müller, Christian W. ; Hermann, Maike ; Decker, Sebastian ; Springer, André ; Overmeyer, Ludger ; Hurschler, Christof ; Pfeifer, Ronny: Design considerations for a novel shape-memory-plate osteosynthesis allowing for non-invasive alteration of bending stiffness. In: Journal of the Mechanical Behavior of Biomedical Materials Bd. 75, Elsevier (2017), Nr. November, S. 558–566","short":"M. Krämer, C.W. Müller, M. Hermann, S. Decker, A. Springer, L. Overmeyer, C. Hurschler, R. Pfeifer, Journal of the Mechanical Behavior of Biomedical Materials 75 (2017) 558–566."},"volume":75,"extern":"1","title":"Design considerations for a novel shape-memory-plate osteosynthesis allowing for non-invasive alteration of bending stiffness","page":"558-566","status":"public","author":[{"full_name":"Krämer, Manuel","first_name":"Manuel","last_name":"Krämer"},{"last_name":"Müller","first_name":"Christian W.","full_name":"Müller, Christian W."},{"last_name":"Hermann","first_name":"Maike","full_name":"Hermann, Maike"},{"full_name":"Decker, Sebastian","first_name":"Sebastian","last_name":"Decker"},{"last_name":"Springer","id":"71733","first_name":"André","full_name":"Springer, André"},{"full_name":"Overmeyer, Ludger","last_name":"Overmeyer","first_name":"Ludger"},{"full_name":"Hurschler, Christof","first_name":"Christof","last_name":"Hurschler"},{"full_name":"Pfeifer, Ronny","first_name":"Ronny","last_name":"Pfeifer"}],"year":2017},{"title":"Investigation of the joining zone of laser welded and cross wedge rolled hybrid parts","extern":"1","citation":{"din1505-2-1":"Blohm, Thoms ; Nothdurft, Sarah ; Mildebrath, Maximilian ; Ohrdes, Hendrik ; Richter, Johannes ; Stonis, Malte ; Langner, Jan ; Springer, André ; u. a.: Investigation of the joining zone of laser welded and cross wedge rolled hybrid parts. In: International journal of material forming : official Journal of the European Scientific Association for material FORMing (ESAFORM) . Paris [u.a.] , Springer (2017), Nr. 11, S. 829–837","chicago-de":"Blohm, Thoms, Sarah Nothdurft, Maximilian Mildebrath, Hendrik Ohrdes, Johannes Richter, Malte Stonis, Jan Langner, u. a. 2017. Investigation of the joining zone of laser welded and cross wedge rolled hybrid parts. International journal of material forming : official Journal of the European Scientific Association for material FORMing (ESAFORM) , Nr. 11: 829–837. doi:10.1007/s12289-017-1393-0, .","short":"T. Blohm, S. Nothdurft, M. Mildebrath, H. Ohrdes, J. Richter, M. Stonis, J. Langner, A. Springer, S. Kaierle, T. Hassel, J. Wallaschek, L. Overmeyer, B.-A. Behrens, International Journal of Material Forming : Official Journal of the European Scientific Association for Material FORMing (ESAFORM) (2017) 829–837.","chicago":"Blohm, Thoms, Sarah Nothdurft, Maximilian Mildebrath, Hendrik Ohrdes, Johannes Richter, Malte Stonis, Jan Langner, et al. “Investigation of the Joining Zone of Laser Welded and Cross Wedge Rolled Hybrid Parts.” International Journal of Material Forming : Official Journal of the European Scientific Association for Material FORMing (ESAFORM) , no. 11 (2017): 829–37. https://doi.org/10.1007/s12289-017-1393-0.","apa":"Blohm, T., Nothdurft, S., Mildebrath, M., Ohrdes, H., Richter, J., Stonis, M., Langner, J., Springer, A., Kaierle, S., Hassel, T., Wallaschek, J., Overmeyer, L., & Behrens, B.-A. (2017). Investigation of the joining zone of laser welded and cross wedge rolled hybrid parts. International Journal of Material Forming : Official Journal of the European Scientific Association for Material FORMing (ESAFORM) , 11, 829–837. https://doi.org/10.1007/s12289-017-1393-0","ufg":"Blohm, Thoms u. a.: Investigation of the joining zone of laser welded and cross wedge rolled hybrid parts, in: International journal of material forming : official Journal of the European Scientific Association for material FORMing (ESAFORM) (2017), H. 11, S. 829–837.","bjps":"Blohm T et al. (2017) Investigation of the Joining Zone of Laser Welded and Cross Wedge Rolled Hybrid Parts. International journal of material forming : official Journal of the European Scientific Association for material FORMing (ESAFORM) 829–837.","mla":"Blohm, Thoms, et al. “Investigation of the Joining Zone of Laser Welded and Cross Wedge Rolled Hybrid Parts.” International Journal of Material Forming : Official Journal of the European Scientific Association for Material FORMing (ESAFORM) , no. 11, 2017, pp. 829–37, https://doi.org/10.1007/s12289-017-1393-0.","havard":"T. Blohm, S. Nothdurft, M. Mildebrath, H. Ohrdes, J. Richter, M. Stonis, J. Langner, A. Springer, S. Kaierle, T. Hassel, J. Wallaschek, L. Overmeyer, B.-A. Behrens, Investigation of the joining zone of laser welded and cross wedge rolled hybrid parts, International Journal of Material Forming : Official Journal of the European Scientific Association for Material FORMing (ESAFORM) . (2017) 829–837.","van":"Blohm T, Nothdurft S, Mildebrath M, Ohrdes H, Richter J, Stonis M, et al. Investigation of the joining zone of laser welded and cross wedge rolled hybrid parts. International journal of material forming : official Journal of the European Scientific Association for material FORMing (ESAFORM) . 2017;(11):829–37.","ieee":"T. Blohm et al., “Investigation of the joining zone of laser welded and cross wedge rolled hybrid parts,” International journal of material forming : official Journal of the European Scientific Association for material FORMing (ESAFORM) , no. 11, pp. 829–837, 2017, doi: 10.1007/s12289-017-1393-0.","ama":"Blohm T, Nothdurft S, Mildebrath M, et al. Investigation of the joining zone of laser welded and cross wedge rolled hybrid parts. International journal of material forming : official Journal of the European Scientific Association for material FORMing (ESAFORM) . 2017;(11):829-837. doi:10.1007/s12289-017-1393-0"},"year":"2017","author":[{"last_name":"Blohm","full_name":"Blohm, Thoms","first_name":"Thoms"},{"last_name":"Nothdurft","full_name":"Nothdurft, Sarah","first_name":"Sarah"},{"last_name":"Mildebrath","full_name":"Mildebrath, Maximilian","first_name":"Maximilian"},{"first_name":"Hendrik","last_name":"Ohrdes","full_name":"Ohrdes, Hendrik"},{"first_name":"Johannes","last_name":"Richter","full_name":"Richter, Johannes"},{"first_name":"Malte","last_name":"Stonis","full_name":"Stonis, Malte"},{"last_name":"Langner","first_name":"Jan","full_name":"Langner, Jan"},{"full_name":"Springer, André","id":"71733","last_name":"Springer","first_name":"André"},{"first_name":"Stefan","last_name":"Kaierle","full_name":"Kaierle, Stefan"},{"last_name":"Hassel","first_name":"Thomas","full_name":"Hassel, Thomas"},{"first_name":"Jörg","last_name":"Wallaschek","full_name":"Wallaschek, Jörg"},{"last_name":"Overmeyer","first_name":"Ludger","full_name":"Overmeyer, Ludger"},{"last_name":"Behrens","full_name":"Behrens, Bernd-Arno","first_name":"Bernd-Arno"}],"status":"public","page":"829-837","publication":" \t International journal of material forming : official Journal of the European Scientific Association for material FORMing (ESAFORM) ","publication_identifier":{"eissn":["1960-6214"],"issn":["1960-6206"]},"date_created":"2022-04-29T16:12:14Z","date_updated":"2025-02-24T15:28:40Z","keyword":["Process chain","Laser welding","Hybrid parts","Dissimilar joints","Cross wedge rolling"],"language":[{"iso":"eng"}],"publication_status":"published","abstract":[{"text":"Most of today’s technical parts and components are made of monolithic materials. These mono-material components produced in established production processes reach their limits due to their respective material characteristics. Thus, a significant increase in production quality and efficiency can only be achieved by combining different materials in one part. Bulk forming of previously joined semi-finished products to net shape hybrid components that consist of two different materials is a promising method to produce parts with locally optimized characteristics. This new production process chain offers a number of advantages compared to conventional manufacturing technologies. Examples are the production of specific load-adapted forged parts with a high level of material utilization and an impact on the joining zone caused by the following forming process. This paper describes the production process of serially arranged hybrid steel parts, produced by combining a laser welding process with a subsequent cross wedge rolling process. The presented results are only a first approach in order to get first insights in the forming behaviour of laser welded and cross wedge rolled parts. The investigated material combination is C22 (1.0402) and 20MnCr5 (1.7147). This innovative process chain enables the production of hybrid parts. To evaluate the developed process chain, the weld and the joining zone is analysed before and after cross wedge rolling. Main results are that the joining process using laser welding enables a strong bonding between the two materials with a higher hardness in the joining zone than for the individual materials. After the forming process, the bonding of the joining zone is still present, while the hardness decreased but remains higher than of the materials themselves.","lang":"eng"}],"issue":"11","department":[{"_id":"DEP7037"}],"publisher":"Springer","quality_controlled":"1","type":"scientific_journal_article","user_id":"83781","_id":"7851","doi":"10.1007/s12289-017-1393-0","place":"Paris [u.a.] "},{"publication_status":"published","department":[{"_id":"DEP7037"}],"publisher":"Laser Institute of America (LIA)","quality_controlled":"1","type":"industry_journal_article","intvolume":" 29","user_id":"79260","_id":"7852","doi":"10.2351/1.4983241","article_number":"022414","title":"Investigations on remote laser beam welding of dissimilar joints of aluminum alloys and steel with varying sheet thicknesses for car body construction","extern":"1","volume":29,"citation":{"short":"O. Seffer, A. Springer, S. Kaierle, Journal of Laser Applications 29 (2017).","din1505-2-1":"Seffer, Oliver ; Springer, André ; Kaierle, Stefan: Investigations on remote laser beam welding of dissimilar joints of aluminum alloys and steel with varying sheet thicknesses for car body construction. In: Journal of Laser Applications Bd. 29, Laser Institute of America (LIA) (2017)","chicago-de":"Seffer, Oliver, André Springer und Stefan Kaierle. 2017. Investigations on remote laser beam welding of dissimilar joints of aluminum alloys and steel with varying sheet thicknesses for car body construction. Journal of Laser Applications 29. doi:10.2351/1.4983241, .","van":"Seffer O, Springer A, Kaierle S. Investigations on remote laser beam welding of dissimilar joints of aluminum alloys and steel with varying sheet thicknesses for car body construction. Journal of Laser Applications. 2017;29.","ufg":"Seffer, Oliver et. al. (2017): Investigations on remote laser beam welding of dissimilar joints of aluminum alloys and steel with varying sheet thicknesses for car body construction, in: Journal of Laser Applications 29.","havard":"O. Seffer, A. Springer, S. Kaierle, Investigations on remote laser beam welding of dissimilar joints of aluminum alloys and steel with varying sheet thicknesses for car body construction, Journal of Laser Applications. 29 (2017).","bjps":"Seffer O, Springer A and Kaierle S (2017) Investigations on Remote Laser Beam Welding of Dissimilar Joints of Aluminum Alloys and Steel with Varying Sheet Thicknesses for Car Body Construction. Journal of Laser Applications 29.","mla":"Seffer, Oliver, et al. “Investigations on Remote Laser Beam Welding of Dissimilar Joints of Aluminum Alloys and Steel with Varying Sheet Thicknesses for Car Body Construction.” Journal of Laser Applications, vol. 29, 022414, Laser Institute of America (LIA), 2017, doi:10.2351/1.4983241.","apa":"Seffer, O., Springer, A., & Kaierle, S. (2017). Investigations on remote laser beam welding of dissimilar joints of aluminum alloys and steel with varying sheet thicknesses for car body construction. Journal of Laser Applications, 29. https://doi.org/10.2351/1.4983241","chicago":"Seffer, Oliver, André Springer, and Stefan Kaierle. “Investigations on Remote Laser Beam Welding of Dissimilar Joints of Aluminum Alloys and Steel with Varying Sheet Thicknesses for Car Body Construction.” Journal of Laser Applications 29 (2017). https://doi.org/10.2351/1.4983241.","ama":"Seffer O, Springer A, Kaierle S. Investigations on remote laser beam welding of dissimilar joints of aluminum alloys and steel with varying sheet thicknesses for car body construction. Journal of Laser Applications. 2017;29. doi:10.2351/1.4983241","ieee":"O. Seffer, A. Springer, and S. Kaierle, “Investigations on remote laser beam welding of dissimilar joints of aluminum alloys and steel with varying sheet thicknesses for car body construction,” Journal of Laser Applications, vol. 29, 2017."},"author":[{"first_name":"Oliver","last_name":"Seffer","full_name":"Seffer, Oliver"},{"full_name":"Springer, André","id":"71733","first_name":"André","last_name":"Springer"},{"last_name":"Kaierle","first_name":"Stefan","full_name":"Kaierle, Stefan"}],"year":2017,"status":"public","publication":"Journal of Laser Applications","publication_identifier":{"issn":["1042-346X","1938-1387"]},"date_created":"2022-04-29T16:13:00Z","date_updated":"2023-03-15T13:50:12Z","language":[{"iso":"eng"}]},{"status":"public","publisher":"Woodhead Publishing Ltd","author":[{"first_name":"Sarah","last_name":"Nothdurft","full_name":"Nothdurft, Sarah"},{"id":"71733","full_name":"Springer, André","last_name":"Springer","first_name":"André"},{"last_name":"Kaierle","full_name":"Kaierle, Stefan","first_name":"Stefan"}],"year":2017,"department":[{"_id":"DEP7037"}],"citation":{"ama":"Nothdurft S, Springer A, Kaierle S. Influencing the weld pool during laser welding. In: Lawrence JR, ed. Advances in Laser Materials Processing. 2nd ed. Cambridge: Woodhead Publishing Ltd; 2017.","ieee":"S. Nothdurft, A. Springer, and S. Kaierle, “Influencing the weld pool during laser welding,” in Advances in Laser Materials Processing, 2nd ed., J. R. Lawrence, Ed. Cambridge: Woodhead Publishing Ltd, 2017.","short":"S. Nothdurft, A. Springer, S. Kaierle, in: J.R. Lawrence (Ed.), Advances in Laser Materials Processing, 2nd ed., Woodhead Publishing Ltd, Cambridge, 2017.","chicago-de":"Nothdurft, Sarah, André Springer und Stefan Kaierle. 2017. Influencing the weld pool during laser welding. In: Advances in Laser Materials Processing, hg. von Jonathan R. Lawrence. 2nd ed. Cambridge: Woodhead Publishing Ltd.","din1505-2-1":"Nothdurft, Sarah ; Springer, André ; Kaierle, Stefan: Influencing the weld pool during laser welding. In: Lawrence, J. R. (Hrsg.): Advances in Laser Materials Processing. 2nd ed. Cambridge : Woodhead Publishing Ltd, 2017","van":"Nothdurft S, Springer A, Kaierle S. Influencing the weld pool during laser welding. In: Lawrence JR, editor. Advances in Laser Materials Processing. 2nd ed. Cambridge: Woodhead Publishing Ltd; 2017.","ufg":"Nothdurft, Sarah et. al. (2017): Influencing the weld pool during laser welding, in: Jonathan R. Lawrence (Hg.): Advances in Laser Materials Processing, Cambridge, 2nd ed.","havard":"S. Nothdurft, A. Springer, S. Kaierle, Influencing the weld pool during laser welding, in: J.R. Lawrence (Ed.), Advances in Laser Materials Processing, 2nd ed., Woodhead Publishing Ltd, Cambridge, 2017.","mla":"Nothdurft, Sarah, et al. “Influencing the Weld Pool during Laser Welding.” Advances in Laser Materials Processing, edited by Jonathan R. Lawrence, 2nd ed., Woodhead Publishing Ltd, 2017.","bjps":"Nothdurft S, Springer A and Kaierle S (2017) Influencing the Weld Pool during Laser Welding. In Lawrence JR (ed.), Advances in Laser Materials Processing, 2nd ed. Cambridge: Woodhead Publishing Ltd.","apa":"Nothdurft, S., Springer, A., & Kaierle, S. (2017). Influencing the weld pool during laser welding. In J. R. Lawrence (Ed.), Advances in Laser Materials Processing (2nd ed.). Cambridge: Woodhead Publishing Ltd.","chicago":"Nothdurft, Sarah, André Springer, and Stefan Kaierle. “Influencing the Weld Pool during Laser Welding.” In Advances in Laser Materials Processing, edited by Jonathan R. Lawrence, 2nd ed. Cambridge: Woodhead Publishing Ltd, 2017."},"publication_status":"published","title":"Influencing the weld pool during laser welding","extern":"1","place":"Cambridge","language":[{"iso":"eng"}],"_id":"7869","user_id":"79260","date_updated":"2023-03-15T13:50:12Z","editor":[{"first_name":"Jonathan R.","full_name":"Lawrence, Jonathan R.","last_name":"Lawrence"}],"publication_identifier":{"eisbn":["9780081012536"],"isbn":["978-0-08-101252-9"]},"publication":"Advances in Laser Materials Processing","date_created":"2022-05-02T12:09:34Z","type":"book_chapter","edition":"2nd ed."},{"volume":69,"citation":{"short":"S. Nothdurft, O. Seffer, R. Pfeifer, A. Springer, S. Kaierle, Schweißen Und Schneiden 69 (2017) 600–607.","din1505-2-1":"Nothdurft, Sarah ; Seffer, Oliver ; Pfeifer, Ronny ; Springer, André ; Kaierle, Stefan: Leichtbau durch laserstrahlgefügte Stahl-Aluminium-Mischverbindungen. In: Schweißen und Schneiden Bd. 69, DVS Media (2017), Nr. 9, S. 600–607","chicago-de":"Nothdurft, Sarah, Oliver Seffer, Ronny Pfeifer, André Springer und Stefan Kaierle. 2017. Leichtbau durch laserstrahlgefügte Stahl-Aluminium-Mischverbindungen. Schweißen und Schneiden 69, Nr. 9: 600–607.","apa":"Nothdurft, S., Seffer, O., Pfeifer, R., Springer, A., & Kaierle, S. (2017). Leichtbau durch laserstrahlgefügte Stahl-Aluminium-Mischverbindungen. Schweißen Und Schneiden, 69(9), 600–607.","ieee":"S. Nothdurft, O. Seffer, R. Pfeifer, A. Springer, and S. Kaierle, “Leichtbau durch laserstrahlgefügte Stahl-Aluminium-Mischverbindungen,” Schweißen und Schneiden, vol. 69, no. 9, pp. 600–607, 2017.","chicago":"Nothdurft, Sarah, Oliver Seffer, Ronny Pfeifer, André Springer, and Stefan Kaierle. “Leichtbau Durch Laserstrahlgefügte Stahl-Aluminium-Mischverbindungen.” Schweißen Und Schneiden 69, no. 9 (2017): 600–607.","van":"Nothdurft S, Seffer O, Pfeifer R, Springer A, Kaierle S. Leichtbau durch laserstrahlgefügte Stahl-Aluminium-Mischverbindungen. Schweißen und Schneiden. 2017;69(9):600–7.","ama":"Nothdurft S, Seffer O, Pfeifer R, Springer A, Kaierle S. Leichtbau durch laserstrahlgefügte Stahl-Aluminium-Mischverbindungen. Schweißen und Schneiden. 2017;69(9):600-607.","ufg":"Nothdurft, Sarah et. al. (2017): Leichtbau durch laserstrahlgefügte Stahl-Aluminium-Mischverbindungen, in: Schweißen und Schneiden 69 (9), S. 600–607.","havard":"S. Nothdurft, O. Seffer, R. Pfeifer, A. Springer, S. Kaierle, Leichtbau durch laserstrahlgefügte Stahl-Aluminium-Mischverbindungen, Schweißen Und Schneiden. 69 (2017) 600–607.","mla":"Nothdurft, Sarah, et al. “Leichtbau Durch Laserstrahlgefügte Stahl-Aluminium-Mischverbindungen.” Schweißen Und Schneiden, vol. 69, no. 9, DVS Media, 2017, pp. 600–07.","bjps":"Nothdurft S et al. (2017) Leichtbau Durch Laserstrahlgefügte Stahl-Aluminium-Mischverbindungen. 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