[{"status":"public","year":1993,"title":"Advanced Multichip Module Technologies","citation":{"apa":"Baumgärtner, A., Heck, W., Meier, U., Richter, H., &#38; Springer, J. (1993). <i>Advanced Multichip Module Technologies</i>. <i>Proc. of the 9th Europ. Hybrid Microelectronics Conf., Nice</i>. Europ. Hybrid Microelectronics Conf.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Baumgärtner, A.</span> ; <span style=\"font-variant:small-caps;\">Heck, W.</span> ; <span style=\"font-variant:small-caps;\">Meier, Uwe</span> ; <span style=\"font-variant:small-caps;\">Richter, H.</span> ; <span style=\"font-variant:small-caps;\">Springer, J.</span>: <i>Advanced Multichip Module Technologies</i> : Europ. Hybrid Microelectronics Conf., 1993","havard":"A. Baumgärtner, W. Heck, U. Meier, H. Richter, J. Springer, Advanced Multichip Module Technologies, Europ. Hybrid Microelectronics Conf., 1993.","chicago":"Baumgärtner, A., W. Heck, Uwe Meier, H. Richter, and J. Springer. <i>Advanced Multichip Module Technologies</i>. <i>Proc. of the 9th Europ. Hybrid Microelectronics Conf., Nice</i>. Europ. Hybrid Microelectronics Conf., 1993.","ama":"Baumgärtner A, Heck W, Meier U, Richter H, Springer J. <i>Advanced Multichip Module Technologies</i>. Europ. Hybrid Microelectronics Conf.; 1993.","bjps":"<b>Baumgärtner A <i>et al.</i></b> (1993) <i>Advanced Multichip Module Technologies</i>. Europ. Hybrid Microelectronics Conf.","ieee":"A. Baumgärtner, W. Heck, U. Meier, H. Richter, and J. Springer, <i>Advanced Multichip Module Technologies</i>. Europ. Hybrid Microelectronics Conf., 1993.","ufg":"<b>Baumgärtner, A. et. al. (1993)</b>: Advanced Multichip Module Technologies.","chicago-de":"Baumgärtner, A., W. Heck, Uwe Meier, H. Richter und J. Springer. 1993. <i>Advanced Multichip Module Technologies</i>. <i>Proc. of the 9th Europ. Hybrid Microelectronics Conf., Nice</i>. Europ. Hybrid Microelectronics Conf.","short":"A. Baumgärtner, W. Heck, U. Meier, H. Richter, J. Springer, Advanced Multichip Module Technologies, Europ. Hybrid Microelectronics Conf., 1993.","van":"Baumgärtner A, Heck W, Meier U, Richter H, Springer J. Advanced Multichip Module Technologies. Proc. of the 9th Europ. Hybrid Microelectronics Conf., Nice. Europ. Hybrid Microelectronics Conf.; 1993.","mla":"Baumgärtner, A., et al. “Advanced Multichip Module Technologies.” <i>Proc. of the 9th Europ. Hybrid Microelectronics Conf., Nice</i>, Europ. Hybrid Microelectronics Conf., 1993."},"type":"conference_editor_article","user_id":"1143","language":[{"iso":"eng"}],"_id":"8114","date_created":"2022-05-11T08:24:45Z","extern":"1","author":[{"first_name":"A.","last_name":"Baumgärtner","full_name":"Baumgärtner, A."},{"full_name":"Heck, W.","last_name":"Heck","first_name":"W."},{"full_name":"Meier, Uwe","id":"1143","last_name":"Meier","first_name":"Uwe"},{"first_name":"H.","last_name":"Richter","full_name":"Richter, H."},{"full_name":"Springer, J.","last_name":"Springer","first_name":"J."}],"date_updated":"2023-03-15T13:50:13Z","publication":"Proc. of the 9th Europ. Hybrid Microelectronics Conf., Nice","publisher":"Europ. Hybrid Microelectronics Conf."},{"user_id":"1143","language":[{"iso":"eng"}],"_id":"8115","date_created":"2022-05-11T08:26:47Z","extern":"1","author":[{"first_name":"Uwe","last_name":"Meier","id":"1143","full_name":"Meier, Uwe"},{"full_name":"Müller, H.","first_name":"H.","last_name":"Müller"}],"date_updated":"2023-03-15T13:50:13Z","publication":"Electronics Letters, Vol. 29, No. 25","publisher":"Electronics Letters","status":"public","year":1993,"title":"Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits","citation":{"mla":"Meier, Uwe, and H. Müller. “Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits.” <i>Electronics Letters, Vol. 29, No. 25</i>, Electronics Letters, 1993.","van":"Meier U, Müller H. Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits. Electronics Letters, Vol 29, No 25. 1993;","chicago-de":"Meier, Uwe und H. Müller. 1993. Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits. <i>Electronics Letters, Vol. 29, No. 25</i>.","short":"U. Meier, H. Müller, Electronics Letters, Vol. 29, No. 25 (1993).","ufg":"<b>Meier, Uwe/Müller, H. (1993)</b>: Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits, in: <i>Electronics Letters, Vol. 29, No. 25</i>.","ieee":"U. Meier and H. Müller, “Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits,” <i>Electronics Letters, Vol. 29, No. 25</i>, 1993.","bjps":"<b>Meier U and Müller H</b> (1993) Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits. <i>Electronics Letters, Vol. 29, No. 25</i>.","chicago":"Meier, Uwe, and H. Müller. “Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits.” <i>Electronics Letters, Vol. 29, No. 25</i>, 1993.","ama":"Meier U, Müller H. Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits. <i>Electronics Letters, Vol 29, No 25</i>. 1993.","apa":"Meier, U., &#38; Müller, H. (1993). Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits. <i>Electronics Letters, Vol. 29, No. 25</i>.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Meier, Uwe</span> ; <span style=\"font-variant:small-caps;\">Müller, H.</span>: Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits. In: <i>Electronics Letters, Vol. 29, No. 25</i>, Electronics Letters (1993)","havard":"U. Meier, H. Müller, Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits, Electronics Letters, Vol. 29, No. 25. (1993)."},"type":"scientific_journal_article"}]