---
_id: '8114'
author:
- first_name: A.
  full_name: Baumgärtner, A.
  last_name: Baumgärtner
- first_name: W.
  full_name: Heck, W.
  last_name: Heck
- first_name: Uwe
  full_name: Meier, Uwe
  id: '1143'
  last_name: Meier
- first_name: H.
  full_name: Richter, H.
  last_name: Richter
- first_name: J.
  full_name: Springer, J.
  last_name: Springer
citation:
  ama: Baumgärtner A, Heck W, Meier U, Richter H, Springer J. <i>Advanced Multichip
    Module Technologies</i>. Europ. Hybrid Microelectronics Conf.; 1993.
  apa: Baumgärtner, A., Heck, W., Meier, U., Richter, H., &#38; Springer, J. (1993).
    <i>Advanced Multichip Module Technologies</i>. <i>Proc. of the 9th Europ. Hybrid
    Microelectronics Conf., Nice</i>. Europ. Hybrid Microelectronics Conf.
  bjps: <b>Baumgärtner A <i>et al.</i></b> (1993) <i>Advanced Multichip Module Technologies</i>.
    Europ. Hybrid Microelectronics Conf.
  chicago: Baumgärtner, A., W. Heck, Uwe Meier, H. Richter, and J. Springer. <i>Advanced
    Multichip Module Technologies</i>. <i>Proc. of the 9th Europ. Hybrid Microelectronics
    Conf., Nice</i>. Europ. Hybrid Microelectronics Conf., 1993.
  chicago-de: Baumgärtner, A., W. Heck, Uwe Meier, H. Richter und J. Springer. 1993.
    <i>Advanced Multichip Module Technologies</i>. <i>Proc. of the 9th Europ. Hybrid
    Microelectronics Conf., Nice</i>. Europ. Hybrid Microelectronics Conf.
  din1505-2-1: '<span style="font-variant:small-caps;">Baumgärtner, A.</span> ; <span
    style="font-variant:small-caps;">Heck, W.</span> ; <span style="font-variant:small-caps;">Meier,
    Uwe</span> ; <span style="font-variant:small-caps;">Richter, H.</span> ; <span
    style="font-variant:small-caps;">Springer, J.</span>: <i>Advanced Multichip Module
    Technologies</i> : Europ. Hybrid Microelectronics Conf., 1993'
  havard: A. Baumgärtner, W. Heck, U. Meier, H. Richter, J. Springer, Advanced Multichip
    Module Technologies, Europ. Hybrid Microelectronics Conf., 1993.
  ieee: A. Baumgärtner, W. Heck, U. Meier, H. Richter, and J. Springer, <i>Advanced
    Multichip Module Technologies</i>. Europ. Hybrid Microelectronics Conf., 1993.
  mla: Baumgärtner, A., et al. “Advanced Multichip Module Technologies.” <i>Proc.
    of the 9th Europ. Hybrid Microelectronics Conf., Nice</i>, Europ. Hybrid Microelectronics
    Conf., 1993.
  short: A. Baumgärtner, W. Heck, U. Meier, H. Richter, J. Springer, Advanced Multichip
    Module Technologies, Europ. Hybrid Microelectronics Conf., 1993.
  ufg: '<b>Baumgärtner, A. et. al. (1993)</b>: Advanced Multichip Module Technologies.'
  van: Baumgärtner A, Heck W, Meier U, Richter H, Springer J. Advanced Multichip Module
    Technologies. Proc. of the 9th Europ. Hybrid Microelectronics Conf., Nice. Europ.
    Hybrid Microelectronics Conf.; 1993.
date_created: 2022-05-11T08:24:45Z
date_updated: 2023-03-15T13:50:13Z
extern: '1'
language:
- iso: eng
publication: Proc. of the 9th Europ. Hybrid Microelectronics Conf., Nice
publisher: Europ. Hybrid Microelectronics Conf.
status: public
title: Advanced Multichip Module Technologies
type: conference_editor_article
user_id: '1143'
year: 1993
...
---
_id: '8115'
author:
- first_name: Uwe
  full_name: Meier, Uwe
  id: '1143'
  last_name: Meier
- first_name: H.
  full_name: Müller, H.
  last_name: Müller
citation:
  ama: Meier U, Müller H. Substrate Integrated Transition Between a Planar Millimetre
    Wave Antenna and Hermetically Sealed Integrated Circuits. <i>Electronics Letters,
    Vol 29, No 25</i>. 1993.
  apa: Meier, U., &#38; Müller, H. (1993). Substrate Integrated Transition Between
    a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits.
    <i>Electronics Letters, Vol. 29, No. 25</i>.
  bjps: <b>Meier U and Müller H</b> (1993) Substrate Integrated Transition Between
    a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits.
    <i>Electronics Letters, Vol. 29, No. 25</i>.
  chicago: Meier, Uwe, and H. Müller. “Substrate Integrated Transition Between a Planar
    Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits.” <i>Electronics
    Letters, Vol. 29, No. 25</i>, 1993.
  chicago-de: Meier, Uwe und H. Müller. 1993. Substrate Integrated Transition Between
    a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits.
    <i>Electronics Letters, Vol. 29, No. 25</i>.
  din1505-2-1: '<span style="font-variant:small-caps;">Meier, Uwe</span> ; <span style="font-variant:small-caps;">Müller,
    H.</span>: Substrate Integrated Transition Between a Planar Millimetre Wave Antenna
    and Hermetically Sealed Integrated Circuits. In: <i>Electronics Letters, Vol.
    29, No. 25</i>, Electronics Letters (1993)'
  havard: U. Meier, H. Müller, Substrate Integrated Transition Between a Planar Millimetre
    Wave Antenna and Hermetically Sealed Integrated Circuits, Electronics Letters,
    Vol. 29, No. 25. (1993).
  ieee: U. Meier and H. Müller, “Substrate Integrated Transition Between a Planar
    Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits,” <i>Electronics
    Letters, Vol. 29, No. 25</i>, 1993.
  mla: Meier, Uwe, and H. Müller. “Substrate Integrated Transition Between a Planar
    Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits.” <i>Electronics
    Letters, Vol. 29, No. 25</i>, Electronics Letters, 1993.
  short: U. Meier, H. Müller, Electronics Letters, Vol. 29, No. 25 (1993).
  ufg: '<b>Meier, Uwe/Müller, H. (1993)</b>: Substrate Integrated Transition Between
    a Planar Millimetre Wave Antenna and Hermetically Sealed Integrated Circuits,
    in: <i>Electronics Letters, Vol. 29, No. 25</i>.'
  van: Meier U, Müller H. Substrate Integrated Transition Between a Planar Millimetre
    Wave Antenna and Hermetically Sealed Integrated Circuits. Electronics Letters,
    Vol 29, No 25. 1993;
date_created: 2022-05-11T08:26:47Z
date_updated: 2023-03-15T13:50:13Z
extern: '1'
language:
- iso: eng
publication: Electronics Letters, Vol. 29, No. 25
publisher: Electronics Letters
status: public
title: Substrate Integrated Transition Between a Planar Millimetre Wave Antenna and
  Hermetically Sealed Integrated Circuits
type: scientific_journal_article
user_id: '1143'
year: 1993
...