{"department":[{"_id":"DEP6020"},{"_id":"DEP5018"}],"status":"public","publication":"PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management","publisher":"VDE","date_created":"2024-10-25T14:02:26Z","conference":{"location":"Nürnberg","start_date":"2023-05-09","end_date":"2023-05-11","name":"PCIM Europe 2023"},"abstract":[{"text":"In this paper a research process to verify thermal management for double-sided cooled SiC-power semiconductors will be discussed. In the context of previous researches a high performance cooling system for these semiconductors was developed. In many cases, prototypes of power semiconductors are used in research projects. This often leads to the fact that only small numbers are available or that they are not available right from the start. Close cooperation with semiconductor manufacturers, like Infineon Technologies AG in this case, within these projects offers the opportunity to get information about the internal structure of the semiconductors and their packages. This information, the use of special PCB manufacturing methods, as well as thermal simulation are used to build up a heat source that mimics the semiconductor including the package and thus gives us the opportunity to verify the performance of our thermal management for high integrated power electronics.","lang":"eng"}],"title":"Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors","publication_status":"published","author":[{"id":"52080","last_name":"Cepin","full_name":"Cepin, Simon","first_name":"Simon"},{"first_name":"Holger","id":"1693","full_name":"Borcherding, Holger","last_name":"Borcherding"}],"corporate_editor":["Mesago Messe Frankfurt"],"citation":{"ieee":"S. Cepin and H. Borcherding, <i>Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors</i>. Berlin: VDE, 2023. doi: <a href=\"https://doi.org/10.30420/566091341\">10.30420/566091341</a>.","van":"Cepin S, Borcherding H. Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors. Mesago Messe Frankfurt, editor. PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Berlin: VDE; 2023.","ufg":"<b>Cepin, Simon/Borcherding, Holger</b>: Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors, hg. von Mesago Messe Frankfurt, Berlin 2023.","mla":"Cepin, Simon, and Holger Borcherding. “Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-Conductors.” <i>PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management</i>, edited by Mesago Messe Frankfurt, VDE, 2023, <a href=\"https://doi.org/10.30420/566091341\">https://doi.org/10.30420/566091341</a>.","short":"S. Cepin, H. Borcherding, Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-Conductors, VDE, Berlin, 2023.","havard":"S. Cepin, H. Borcherding, Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors, VDE, Berlin, 2023.","chicago":"Cepin, Simon, and Holger Borcherding. <i>Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-Conductors</i>. Edited by Mesago Messe Frankfurt. <i>PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management</i>. Berlin: VDE, 2023. <a href=\"https://doi.org/10.30420/566091341\">https://doi.org/10.30420/566091341</a>.","chicago-de":"Cepin, Simon und Holger Borcherding. 2023. <i>Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors</i>. Hg. von Mesago Messe Frankfurt. <i>PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management</i>. Berlin: VDE. doi:<a href=\"https://doi.org/10.30420/566091341\">10.30420/566091341</a>, .","ama":"Cepin S, Borcherding H. <i>Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-Conductors</i>. (Mesago Messe Frankfurt, ed.). VDE; 2023. doi:<a href=\"https://doi.org/10.30420/566091341\">10.30420/566091341</a>","bjps":"<b>Cepin S and Borcherding H</b> (2023) <i>Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-Conductors</i>, Mesago Messe Frankfurt (ed.). Berlin: VDE.","apa":"Cepin, S., &#38; Borcherding, H. (2023). Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors. In Mesago Messe Frankfurt (Ed.), <i>PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management</i>. VDE. <a href=\"https://doi.org/10.30420/566091341\">https://doi.org/10.30420/566091341</a>","din1505-2-1":"<span style=\"font-variant:small-caps;\">Cepin, Simon</span> ; <span style=\"font-variant:small-caps;\">Borcherding, Holger</span> ; <span style=\"font-variant:small-caps;\">Mesago Messe Frankfurt</span> (Hrsg.): <i>Development of Heat Source for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors</i>. Berlin : VDE, 2023"},"date_updated":"2024-10-28T15:23:11Z","doi":"10.30420/566091341","quality_controlled":"1","place":"Berlin","_id":"12007","publication_identifier":{"isbn":["978-3-8007-6091-6"]},"type":"conference_editor_article","language":[{"iso":"eng"}],"user_id":"83781","year":"2023"}