---
_id: '12007'
abstract:
- lang: eng
  text: In this paper a research process to verify thermal management for double-sided
    cooled SiC-power semiconductors will be discussed. In the context of previous
    researches a high performance cooling system for these semiconductors was developed.
    In many cases, prototypes of power semiconductors are used in research projects.
    This often leads to the fact that only small numbers are available or that they
    are not available right from the start. Close cooperation with semiconductor manufacturers,
    like Infineon Technologies AG in this case, within these projects offers the opportunity
    to get information about the internal structure of the semiconductors and their
    packages. This information, the use of special PCB manufacturing methods, as well
    as thermal simulation are used to build up a heat source that mimics the semiconductor
    including the package and thus gives us the opportunity to verify the performance
    of our thermal management for high integrated power electronics.
author:
- first_name: Simon
  full_name: Cepin, Simon
  id: '52080'
  last_name: Cepin
- first_name: Holger
  full_name: Borcherding, Holger
  id: '1693'
  last_name: Borcherding
citation:
  ama: Cepin S, Borcherding H. <i>Development of Heat Source for Performance Verification
    of Thermal Management for Double-Sided Cooled SiC-Power Semi-Conductors</i>. (Mesago
    Messe Frankfurt, ed.). VDE; 2023. doi:<a href="https://doi.org/10.30420/566091341">10.30420/566091341</a>
  apa: Cepin, S., &#38; Borcherding, H. (2023). Development of Heat Source for Performance
    Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors.
    In Mesago Messe Frankfurt (Ed.), <i>PCIM Europe 2023; International Exhibition
    and Conference for Power Electronics, Intelligent Motion, Renewable Energy and
    Energy Management</i>. VDE. <a href="https://doi.org/10.30420/566091341">https://doi.org/10.30420/566091341</a>
  bjps: '<b>Cepin S and Borcherding H</b> (2023) <i>Development of Heat Source for
    Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power
    Semi-Conductors</i>, Mesago Messe Frankfurt (ed.). Berlin: VDE.'
  chicago: 'Cepin, Simon, and Holger Borcherding. <i>Development of Heat Source for
    Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power
    Semi-Conductors</i>. Edited by Mesago Messe Frankfurt. <i>PCIM Europe 2023; International
    Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable
    Energy and Energy Management</i>. Berlin: VDE, 2023. <a href="https://doi.org/10.30420/566091341">https://doi.org/10.30420/566091341</a>.'
  chicago-de: 'Cepin, Simon und Holger Borcherding. 2023. <i>Development of Heat Source
    for Performance Verification of Thermal Management for Double-Sided Cooled SiC-Power
    Semi-conductors</i>. Hg. von Mesago Messe Frankfurt. <i>PCIM Europe 2023; International
    Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable
    Energy and Energy Management</i>. Berlin: VDE. doi:<a href="https://doi.org/10.30420/566091341">10.30420/566091341</a>,
    .'
  din1505-2-1: '<span style="font-variant:small-caps;">Cepin, Simon</span> ; <span
    style="font-variant:small-caps;">Borcherding, Holger</span> ; <span style="font-variant:small-caps;">Mesago
    Messe Frankfurt</span> (Hrsg.): <i>Development of Heat Source for Performance
    Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors</i>.
    Berlin : VDE, 2023'
  havard: S. Cepin, H. Borcherding, Development of Heat Source for Performance Verification
    of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors, VDE,
    Berlin, 2023.
  ieee: 'S. Cepin and H. Borcherding, <i>Development of Heat Source for Performance
    Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors</i>.
    Berlin: VDE, 2023. doi: <a href="https://doi.org/10.30420/566091341">10.30420/566091341</a>.'
  mla: Cepin, Simon, and Holger Borcherding. “Development of Heat Source for Performance
    Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-Conductors.”
    <i>PCIM Europe 2023; International Exhibition and Conference for Power Electronics,
    Intelligent Motion, Renewable Energy and Energy Management</i>, edited by Mesago
    Messe Frankfurt, VDE, 2023, <a href="https://doi.org/10.30420/566091341">https://doi.org/10.30420/566091341</a>.
  short: S. Cepin, H. Borcherding, Development of Heat Source for Performance Verification
    of Thermal Management for Double-Sided Cooled SiC-Power Semi-Conductors, VDE,
    Berlin, 2023.
  ufg: '<b>Cepin, Simon/Borcherding, Holger</b>: Development of Heat Source for Performance
    Verification of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors,
    hg. von Mesago Messe Frankfurt, Berlin 2023.'
  van: 'Cepin S, Borcherding H. Development of Heat Source for Performance Verification
    of Thermal Management for Double-Sided Cooled SiC-Power Semi-conductors. Mesago
    Messe Frankfurt, editor. PCIM Europe 2023; International Exhibition and Conference
    for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management.
    Berlin: VDE; 2023.'
conference:
  end_date: 2023-05-11
  location: Nürnberg
  name: PCIM Europe 2023
  start_date: 2023-05-09
corporate_editor:
- Mesago Messe Frankfurt
date_created: 2024-10-25T14:02:26Z
date_updated: 2024-10-28T15:23:11Z
department:
- _id: DEP6020
- _id: DEP5018
doi: 10.30420/566091341
language:
- iso: eng
place: Berlin
publication: PCIM Europe 2023; International Exhibition and Conference for Power Electronics,
  Intelligent Motion, Renewable Energy and Energy Management
publication_identifier:
  isbn:
  - 978-3-8007-6091-6
publication_status: published
publisher: VDE
quality_controlled: '1'
status: public
title: Development of Heat Source for Performance Verification of Thermal Management
  for Double-Sided Cooled SiC-Power Semi-conductors
type: conference_editor_article
user_id: '83781'
year: '2023'
...