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   	<dc:title>Real-time Wavelet-Based Inline Banknote-in-Bundle Counting for Cut-and-Bundle Machines</dc:title>
   	<dc:creator>Petker, Denis</dc:creator>
   	<dc:creator>Türke, Thomas</dc:creator>
   	<dc:creator>Willeke, Harald</dc:creator>
   	<dc:creator>Schaede, Johannes</dc:creator>
   	<dc:creator>Gillich, Eugen</dc:creator>
   	<dc:creator>Lohweg, Volker</dc:creator>
   	<dc:description>Automatic banknote sheet cut-and-bundle machines are widely used within the scope of banknote production. Beside the cutting-and-bundling, which is a mature technology, image-processing-based quality inspection for this type of machine is attractive. We present in this work a new real-time Touchless Counting and perspective cutting blade quality insurance system, based on a Color-CCD-Camera and a dual-core Computer, for cut-and-bundle applications in banknote production. The system, which applies Wavelet-based multi-scale filtering is able to count banknotes inside a 100-bundle within 200-300 ms depending on the window size.</dc:description>
   	<dc:publisher>San Francisco, California, United States</dc:publisher>
   	<dc:date>2011</dc:date>
   	<dc:type>info:eu-repo/semantics/conferenceObject</dc:type>
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   	<dc:type>text</dc:type>
   	<dc:type>http://purl.org/coar/resource_type/c_5794</dc:type>
   	<dc:identifier>https://www.th-owl.de/elsa/record/2096</dc:identifier>
   	<dc:source>Petker D, Türke T, Willeke H, Schaede J, Gillich E, Lohweg V. Real-time Wavelet-Based Inline Banknote-in-Bundle Counting for Cut-and-Bundle Machines. In: &lt;i&gt;IST/SPIE Electronic Imaging 2011 Conference&lt;/i&gt;. San Francisco, California, United States; 2011. doi:&lt;a href=&quot;https://doi.org/10.1117/12.872357&quot;&gt;https://doi.org/10.1117/12.872357&lt;/a&gt;</dc:source>
   	<dc:language>eng</dc:language>
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