{"user_id":"74222","year":2013,"type":"conference","language":[{"iso":"eng"}],"place":"Bochum, Germany","_id":"4650","date_updated":"2023-03-15T13:49:54Z","title":"Scalability of OPC-UA Down to the Chip Level Enables \"Internet of Things\"","author":[{"last_name":"Imtiaz","full_name":"Imtiaz, Jahanzaib","first_name":"Jahanzaib"},{"last_name":"Jasperneite","full_name":"Jasperneite, Jürgen","id":"1899","first_name":"Jürgen"}],"citation":{"havard":"J. Imtiaz, J. Jasperneite, Scalability of OPC-UA Down to the Chip Level Enables “Internet of Things,” in: 11th International IEEE Conference on Industrial Informatics 2013, Bochum, Germany, 2013.","ama":"Imtiaz J, Jasperneite J. Scalability of OPC-UA Down to the Chip Level Enables “Internet of Things.” In: <i>11th International IEEE Conference on Industrial Informatics 2013</i>. Bochum, Germany; 2013.","bjps":"<b>Imtiaz J and Jasperneite J</b> (2013) Scalability of OPC-UA Down to the Chip Level Enables ‘Internet of Things’. <i>11th International IEEE Conference on Industrial Informatics 2013</i>. Bochum, Germany.","chicago-de":"Imtiaz, Jahanzaib und Jürgen Jasperneite. 2013. Scalability of OPC-UA Down to the Chip Level Enables „Internet of Things“. In: <i>11th International IEEE Conference on Industrial Informatics 2013</i>. Bochum, Germany.","chicago":"Imtiaz, Jahanzaib, and Jürgen Jasperneite. “Scalability of OPC-UA Down to the Chip Level Enables ‘Internet of Things.’” In <i>11th International IEEE Conference on Industrial Informatics 2013</i>. Bochum, Germany, 2013.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Imtiaz, Jahanzaib</span> ; <span style=\"font-variant:small-caps;\">Jasperneite, Jürgen</span>: Scalability of OPC-UA Down to the Chip Level Enables „Internet of Things“. In: <i>11th International IEEE Conference on Industrial Informatics 2013</i>. Bochum, Germany, 2013","apa":"Imtiaz, J., &#38; Jasperneite, J. (2013). Scalability of OPC-UA Down to the Chip Level Enables “Internet of Things.” In <i>11th International IEEE Conference on Industrial Informatics 2013</i>. Bochum, Germany.","ieee":"J. Imtiaz and J. Jasperneite, “Scalability of OPC-UA Down to the Chip Level Enables ‘Internet of Things,’” in <i>11th International IEEE Conference on Industrial Informatics 2013</i>, 2013.","van":"Imtiaz J, Jasperneite J. Scalability of OPC-UA Down to the Chip Level Enables “Internet of Things.” In: 11th International IEEE Conference on Industrial Informatics 2013. Bochum, Germany; 2013.","mla":"Imtiaz, Jahanzaib, and Jürgen Jasperneite. “Scalability of OPC-UA Down to the Chip Level Enables ‘Internet of Things.’” <i>11th International IEEE Conference on Industrial Informatics 2013</i>, 2013.","short":"J. Imtiaz, J. Jasperneite, in: 11th International IEEE Conference on Industrial Informatics 2013, Bochum, Germany, 2013.","ufg":"<b>Imtiaz, Jahanzaib/Jasperneite, Jürgen (2013)</b>: Scalability of OPC-UA Down to the Chip Level Enables „Internet of Things“, in: <i>11th International IEEE Conference on Industrial Informatics 2013</i>, Bochum, Germany."},"date_created":"2021-01-28T11:14:52Z","department":[{"_id":"DEP5023"},{"_id":"DEP5019"}],"publication":"11th International IEEE Conference on Industrial Informatics 2013","status":"public"}