@misc{7841,
  author       = {{Hemmelgarn, Florian and Ehlert, Patrick and Mager, Thomas and Jurgenhake, Christoph and Dumitrescu, Roman and Springer, André}},
  booktitle    = {{14th International Congress Molded Interconnect Devices (MID)}},
  location     = {{Amberg}},
  publisher    = {{IEEE}},
  title        = {{{Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications}}},
  doi          = {{10.1109/mid50463.2021.9361628}},
  year         = {{2021}},
}