{"_id":"7841","author":[{"full_name":"Hemmelgarn, Florian","last_name":"Hemmelgarn","first_name":"Florian"},{"id":"62091","last_name":"Ehlert","full_name":"Ehlert, Patrick","first_name":"Patrick"},{"first_name":"Thomas","last_name":"Mager","full_name":"Mager, Thomas"},{"last_name":"Jurgenhake","full_name":"Jurgenhake, Christoph","first_name":"Christoph"},{"first_name":"Roman","full_name":"Dumitrescu, Roman","last_name":"Dumitrescu"},{"id":"71733","last_name":"Springer","full_name":"Springer, André","first_name":"André"}],"publication_status":"published","status":"public","doi":"10.1109/mid50463.2021.9361628","type":"conference_editor_article","language":[{"iso":"eng"}],"conference":{"start_date":"2021-02-09","name":"14th International Congress Molded Interconnect Devices (MID)","end_date":"2021-02-10","location":"Amberg"},"date_created":"2022-04-29T15:22:37Z","publisher":"IEEE","year":2021,"date_updated":"2023-03-15T13:50:12Z","department":[{"_id":"DEP7037"}],"citation":{"mla":"Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” <i>14th International Congress Molded Interconnect Devices (MID)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/mid50463.2021.9361628\">10.1109/mid50463.2021.9361628</a>.","chicago-de":"Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu und André Springer. 2021. <i>Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications</i>. <i>14th International Congress Molded Interconnect Devices (MID)</i>. IEEE. doi:<a href=\"https://doi.org/10.1109/mid50463.2021.9361628,\">10.1109/mid50463.2021.9361628,</a> .","din1505-2-1":"<span style=\"font-variant:small-caps;\">Hemmelgarn, Florian</span> ; <span style=\"font-variant:small-caps;\">Ehlert, Patrick</span> ; <span style=\"font-variant:small-caps;\">Mager, Thomas</span> ; <span style=\"font-variant:small-caps;\">Jurgenhake, Christoph</span> ; <span style=\"font-variant:small-caps;\">Dumitrescu, Roman</span> ; <span style=\"font-variant:small-caps;\">Springer, André</span>: <i>Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications</i> : IEEE, 2021","chicago":"Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu, and André Springer. <i>Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications</i>. <i>14th International Congress Molded Interconnect Devices (MID)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/mid50463.2021.9361628\">https://doi.org/10.1109/mid50463.2021.9361628</a>.","short":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications, IEEE, 2021.","ieee":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, and A. Springer, <i>Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications</i>. IEEE, 2021.","bjps":"<b>Hemmelgarn F <i>et al.</i></b> (2021) <i>Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications</i>. IEEE.","ufg":"<b>Hemmelgarn, Florian et. al. (2021)</b>: Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications.","van":"Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). IEEE; 2021.","havard":"F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications, IEEE, 2021.","ama":"Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. <i>Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/mid50463.2021.9361628\">10.1109/mid50463.2021.9361628</a>","apa":"Hemmelgarn, F., Ehlert, P., Mager, T., Jurgenhake, C., Dumitrescu, R., &#38; Springer, A. (2021). <i>Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications</i>. <i>14th International Congress Molded Interconnect Devices (MID)</i>. Amberg: IEEE. <a href=\"https://doi.org/10.1109/mid50463.2021.9361628\">https://doi.org/10.1109/mid50463.2021.9361628</a>"},"publication":"14th International Congress Molded Interconnect Devices (MID)","title":"Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications","user_id":"79260"}