Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications

thesis Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications published Florian Hemmelgarn author Patrick Ehlert author 62091 Thomas Mager author Christoph Jurgenhake author Roman Dumitrescu author André Springer author 71733 DEP7037 department 14th International Congress Molded Interconnect Devices (MID) IEEE2021Amberg eng 14th International Congress Molded Interconnect Devices (MID)10.1109/mid50463.2021.9361628 Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” 14th International Congress Molded Interconnect Devices (MID), IEEE, 2021, doi:<a href="https://doi.org/10.1109/mid50463.2021.9361628">10.1109/mid50463.2021.9361628</a>. Hemmelgarn, Florian et. al. (2021): Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. Hemmelgarn, F., Ehlert, P., Mager, T., Jurgenhake, C., Dumitrescu, R., & Springer, A. (2021). Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). Amberg: IEEE. <a href="https://doi.org/10.1109/mid50463.2021.9361628">https://doi.org/10.1109/mid50463.2021.9361628</a> F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications, IEEE, 2021. Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications. IEEE; 2021. doi:<a href="https://doi.org/10.1109/mid50463.2021.9361628">10.1109/mid50463.2021.9361628</a>

Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu und André Springer. 2021. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). IEEE. doi:<a href="https://doi.org/10.1109/mid50463.2021.9361628,">10.1109/mid50463.2021.9361628,</a> .

Hemmelgarn F et al. (2021) Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications. IEEE. F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications, IEEE, 2021.

Hemmelgarn, Florian ; Ehlert, Patrick ; Mager, Thomas ; Jurgenhake, Christoph ; Dumitrescu, Roman ; Springer, André: Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications : IEEE, 2021

Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu, and André Springer. Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications. 14th International Congress Molded Interconnect Devices (MID). IEEE, 2021. <a href="https://doi.org/10.1109/mid50463.2021.9361628">https://doi.org/10.1109/mid50463.2021.9361628</a>. F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, and A. Springer, Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. IEEE, 2021. Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). IEEE; 2021. 78412022-04-29T15:22:37Z2023-03-15T13:50:12Z