---
_id: '7841'
author:
- first_name: Florian
  full_name: Hemmelgarn, Florian
  last_name: Hemmelgarn
- first_name: Patrick
  full_name: Ehlert, Patrick
  id: '62091'
  last_name: Ehlert
- first_name: Thomas
  full_name: Mager, Thomas
  last_name: Mager
- first_name: Christoph
  full_name: Jurgenhake, Christoph
  last_name: Jurgenhake
- first_name: Roman
  full_name: Dumitrescu, Roman
  last_name: Dumitrescu
- first_name: André
  full_name: Springer, André
  id: '71733'
  last_name: Springer
citation:
  ama: Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. <i>Evaluation
    of Different Additive Manufacturing Technologies for MIDs in the Context of Smart
    Sensor Systems for Retrofit Applications</i>. IEEE; 2021. doi:<a href="https://doi.org/10.1109/mid50463.2021.9361628">10.1109/mid50463.2021.9361628</a>
  apa: 'Hemmelgarn, F., Ehlert, P., Mager, T., Jurgenhake, C., Dumitrescu, R., &#38;
    Springer, A. (2021). <i>Evaluation of different additive manufacturing technologies
    for MIDs in the context of smart sensor systems for retrofit applications</i>.
    <i>14th International Congress Molded Interconnect Devices (MID)</i>. Amberg:
    IEEE. <a href="https://doi.org/10.1109/mid50463.2021.9361628">https://doi.org/10.1109/mid50463.2021.9361628</a>'
  bjps: <b>Hemmelgarn F <i>et al.</i></b> (2021) <i>Evaluation of Different Additive
    Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for
    Retrofit Applications</i>. IEEE.
  chicago: Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake,
    Roman Dumitrescu, and André Springer. <i>Evaluation of Different Additive Manufacturing
    Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications</i>.
    <i>14th International Congress Molded Interconnect Devices (MID)</i>. IEEE, 2021.
    <a href="https://doi.org/10.1109/mid50463.2021.9361628">https://doi.org/10.1109/mid50463.2021.9361628</a>.
  chicago-de: Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake,
    Roman Dumitrescu und André Springer. 2021. <i>Evaluation of different additive
    manufacturing technologies for MIDs in the context of smart sensor systems for
    retrofit applications</i>. <i>14th International Congress Molded Interconnect
    Devices (MID)</i>. IEEE. doi:<a href="https://doi.org/10.1109/mid50463.2021.9361628,">10.1109/mid50463.2021.9361628,</a>
    .
  din1505-2-1: '<span style="font-variant:small-caps;">Hemmelgarn, Florian</span>
    ; <span style="font-variant:small-caps;">Ehlert, Patrick</span> ; <span style="font-variant:small-caps;">Mager,
    Thomas</span> ; <span style="font-variant:small-caps;">Jurgenhake, Christoph</span>
    ; <span style="font-variant:small-caps;">Dumitrescu, Roman</span> ; <span style="font-variant:small-caps;">Springer,
    André</span>: <i>Evaluation of different additive manufacturing technologies for
    MIDs in the context of smart sensor systems for retrofit applications</i> : IEEE,
    2021'
  havard: F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer,
    Evaluation of different additive manufacturing technologies for MIDs in the context
    of smart sensor systems for retrofit applications, IEEE, 2021.
  ieee: F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, and A. Springer,
    <i>Evaluation of different additive manufacturing technologies for MIDs in the
    context of smart sensor systems for retrofit applications</i>. IEEE, 2021.
  mla: Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing
    Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.”
    <i>14th International Congress Molded Interconnect Devices (MID)</i>, IEEE, 2021,
    doi:<a href="https://doi.org/10.1109/mid50463.2021.9361628">10.1109/mid50463.2021.9361628</a>.
  short: F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer,
    Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context
    of Smart Sensor Systems for Retrofit Applications, IEEE, 2021.
  ufg: '<b>Hemmelgarn, Florian et. al. (2021)</b>: Evaluation of different additive
    manufacturing technologies for MIDs in the context of smart sensor systems for
    retrofit applications.'
  van: Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation
    of different additive manufacturing technologies for MIDs in the context of smart
    sensor systems for retrofit applications. 14th International Congress Molded Interconnect
    Devices (MID). IEEE; 2021.
conference:
  end_date: 2021-02-10
  location: Amberg
  name: 14th International Congress Molded Interconnect Devices (MID)
  start_date: 2021-02-09
date_created: 2022-04-29T15:22:37Z
date_updated: 2023-03-15T13:50:12Z
department:
- _id: DEP7037
doi: 10.1109/mid50463.2021.9361628
language:
- iso: eng
publication: 14th International Congress Molded Interconnect Devices (MID)
publication_status: published
publisher: IEEE
status: public
title: Evaluation of different additive manufacturing technologies for MIDs in the
  context of smart sensor systems for retrofit applications
type: conference_editor_article
user_id: '79260'
year: 2021
...