{"page":"500-507","corporate_editor":["VDE ETG"],"title":"Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)","department":[{"_id":"DEP6020"},{"_id":"DEP7037"},{"_id":"DEP5018"}],"type":"conference_editor_article","user_id":"83781","quality_controlled":"1","volume":165,"year":"2022","date_created":"2022-04-29T15:50:44Z","abstract":[{"lang":"eng","text":"The CMID (Coated Metal Interconnected Device) technology described here has its origins in MID (Moulded Intercon-\r\nnected Device) technology, which in itself is based on laser direct structuring (LDS). CMIDs are metallic base bodies \r\ncoated with LDS-compatiblepowder, allowing conductor paths to be structured and metallised on the coating. The metallic base bodies enable the heat management to be optimised and allow power electronic topologies to be implemented in addition to control electronics. Furthermore, in the context of 3D electronics, miniaturisation can be advanced through the use of unused spaces and housing parts. This is shown by manufacturing techniques and demonstrators of motor integrated inverters."}],"date_updated":"2024-08-08T13:37:57Z","place":"Berlin","status":"public","conference":{"location":"Berlin","start_date":"2022-03-15","end_date":"2022-03-17","name":"12th Int. Conference on Integrated Power Electronics Systems"},"author":[{"last_name":"Borcherding","id":"1693","first_name":"Holger","full_name":"Borcherding, Holger"},{"full_name":"Springer, André","first_name":"André","id":"71733","last_name":"Springer"},{"full_name":"Müller, Tobias","id":"59014","last_name":"Müller","first_name":"Tobias"},{"full_name":"Ehlert, Patrick","first_name":"Patrick","last_name":"Ehlert","id":"62091"},{"full_name":"Tolksdorf, Andreas","first_name":"Andreas","last_name":"Tolksdorf"}],"language":[{"iso":"eng"}],"_id":"7844","publisher":"VDE-Verlag","publication_status":"published","publication_identifier":{"eisbn":["978-3-8007-5758-9"],"isbn":["978-3-8007-5757-2"]},"series_title":" ETG-Fachberichte","publication":"\t ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany","main_file_link":[{"url":"https://content-select.com/goto/62610b94-22cc-42ee-a46f-3c198677ec64/514/language:de"}],"intvolume":"       165","citation":{"van":"Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID). VDE ETG, editor.   ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany. Berlin: VDE-Verlag; 2022. ( ETG-Fachberichte; vol. 165).","bjps":"<b>Borcherding H <i>et al.</i></b> (2022) <i>Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID)</i>, VDE ETG (ed.). Berlin: VDE-Verlag.","apa":"Borcherding, H., Springer, A., Müller, T., Ehlert, P., &#38; Tolksdorf, A. (2022). Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID). In VDE ETG (Ed.), <i>  ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany</i> (Vol. 165, pp. 500–507). VDE-Verlag.","ieee":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, and A. Tolksdorf, <i>Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)</i>, vol. 165. Berlin: VDE-Verlag, 2022, pp. 500–507.","chicago":"Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert, and Andreas Tolksdorf. <i>Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID)</i>. Edited by VDE ETG. <i>  ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany</i>. Vol. 165.  ETG-Fachberichte. Berlin: VDE-Verlag, 2022.","chicago-de":"Borcherding, Holger, André Springer, Tobias Müller, Patrick Ehlert und Andreas Tolksdorf. 2022. <i>Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)</i>. Hg. von VDE ETG. <i>  ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany</i>. Bd. 165.  ETG-Fachberichte. Berlin: VDE-Verlag.","havard":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID), VDE-Verlag, Berlin, 2022.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Borcherding, Holger</span> ; <span style=\"font-variant:small-caps;\">Springer, André</span> ; <span style=\"font-variant:small-caps;\">Müller, Tobias</span> ; <span style=\"font-variant:small-caps;\">Ehlert, Patrick</span> ; <span style=\"font-variant:small-caps;\">Tolksdorf, Andreas</span> ; <span style=\"font-variant:small-caps;\">VDE ETG</span> (Hrsg.): <i>Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID)</i>, <i> ETG-Fachberichte</i>. Bd. 165. Berlin : VDE-Verlag, 2022","ufg":"<b>Borcherding, Holger u. a.</b>: Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID), Bd. 165, hg. von VDE ETG, Berlin 2022 ( ETG-Fachberichte).","mla":"Borcherding, Holger, et al. “Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID).” <i>  ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany</i>, edited by VDE ETG, vol. 165, VDE-Verlag, 2022, pp. 500–07.","short":"H. Borcherding, A. Springer, T. Müller, P. Ehlert, A. Tolksdorf, Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID), VDE-Verlag, Berlin, 2022.","ama":"Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. <i>Integration of Power Electronic Circuits Using Coated Metal Interconnect Devices (CMID)</i>. Vol 165. (VDE ETG, ed.). VDE-Verlag; 2022:500-507."}}