{"language":[{"iso":"eng"}],"conference":{"start_date":"2021-09-21","location":"online","end_date":"2021-09-23","name":"13th Expert Forum Electric Vehicle Drives (E-Motive)"},"date_created":"2022-07-05T08:03:50Z","year":2021,"date_updated":"2023-03-15T13:50:15Z","_id":"8415","publication_status":"published","author":[{"first_name":"Holger","id":"1693","full_name":"Borcherding, Holger","last_name":"Borcherding"},{"first_name":"Simon","full_name":"Cepin, Simon","last_name":"Cepin","id":"52080"}],"status":"public","type":"conference_speech","title":"Heatsink design for direct double-sided liquid cooling of SiC power semiconductors","user_id":"64800","citation":{"mla":"Borcherding, Holger, and Simon Cepin. <i>Heatsink Design for Direct Double-Sided Liquid Cooling of SiC Power Semiconductors</i>. 2021.","van":"Borcherding H, Cepin S. Heatsink design for direct double-sided liquid cooling of SiC power semiconductors. 2021.","havard":"H. Borcherding, S. Cepin, Heatsink design for direct double-sided liquid cooling of SiC power semiconductors, 2021.","ieee":"H. Borcherding and S. Cepin, <i>Heatsink design for direct double-sided liquid cooling of SiC power semiconductors</i>. 2021.","short":"H. Borcherding, S. Cepin, Heatsink Design for Direct Double-Sided Liquid Cooling of SiC Power Semiconductors, 2021.","ufg":"<b>Borcherding, Holger/Cepin, Simon (2021)</b>: Heatsink design for direct double-sided liquid cooling of SiC power semiconductors.","bjps":"<b>Borcherding H and Cepin S</b> (2021) <i>Heatsink Design for Direct Double-Sided Liquid Cooling of SiC Power Semiconductors</i>. .","apa":"Borcherding, H., &#38; Cepin, S. (2021). <i>Heatsink design for direct double-sided liquid cooling of SiC power semiconductors</i>. Presented at the 13th Expert Forum Electric Vehicle Drives (E-Motive), online.","ama":"Borcherding H, Cepin S. <i>Heatsink Design for Direct Double-Sided Liquid Cooling of SiC Power Semiconductors</i>.; 2021.","chicago":"Borcherding, Holger, and Simon Cepin. <i>Heatsink Design for Direct Double-Sided Liquid Cooling of SiC Power Semiconductors</i>, 2021.","din1505-2-1":"<span style=\"font-variant:small-caps;\">Borcherding, Holger</span> ; <span style=\"font-variant:small-caps;\">Cepin, Simon</span>: <i>Heatsink design for direct double-sided liquid cooling of SiC power semiconductors</i>, 2021","chicago-de":"Borcherding, Holger und Simon Cepin. 2021. <i>Heatsink design for direct double-sided liquid cooling of SiC power semiconductors</i>."},"department":[{"_id":"DEP6020"},{"_id":"DEP5018"}]}