{"author":[{"id":"76831","first_name":"Kevin","full_name":"Krüger, Kevin","last_name":"Krüger"},{"first_name":"Jian","id":"5297","full_name":"Song, Jian","last_name":"Song"}],"type":"scientific_journal_article","_id":"9207","language":[{"iso":"eng"}],"title":"The influence of thermal cycling test parameters on the failure rate of electrical connectors","department":[{"_id":"DEP6012"}],"doi":"https://doi.org/10.1016/j.microrel.2022.114633","publication":"Microelectronics Reliability","volume":138,"date_created":"2022-12-11T13:17:29Z","publisher":"Elsevier","status":"public","issue":"November 2022","year":2022,"intvolume":"       138","user_id":"79260","date_updated":"2023-03-15T13:50:17Z"}