Detmold, 28 November 2008

The Detmold School of Architecture and Interior Design's fourth symposium addressed innovative technologies in the building envelope. This included the technological side, the use of translucent plastics, composite materials, and the use of adhesive bonds. The process-side planning and construction processes have changed by new technologies, such as parametric design, simulations and logistical improvements.

some impressions of the conference

Photo Gallery