Design of thermal management for double-sided cooled SiC-power semiconductors
S. Cepin, H. Borcherding, R. Kusch, C. Schnückel, A. Lis, Design of Thermal Management for Double-Sided Cooled SiC-Power Semiconductors, VDE Verlag, Berlin, 2022.
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Konferenzband - Beitrag
| Veröffentlicht
| Englisch
Autor*in
Körperschaftlicher Herausgeber
Mesago Messe Frankfurt GmbH
Einrichtung
Abstract
In this paper the thermal management for a traction drive inverter with SiC-MOSFETs will be discussed. The research objective is a high efficiency inverter resulting in a construction space optimized design. A possible approach to achieve these objectives is double-sided liquid cooling for the power modules with high power density. In this paper a three-phase inverter containing three half-bridge SiC power modules will be considered. Several cooling structures and arrangements for the power modules were examined by means of CFD simulation. The performance of the cooling systems is approximately 1 kW with a total power density of the power section of 100 kW per liter.
Erscheinungsjahr
Titel Konferenzband
PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 10-12 May 2022, Nuremberg
Seite
7
Konferenz
PCIM Europe 2022
Konferenzort
Nürnberg
Konferenzdatum
2022-05-10 – 2022-05-12
ISBN
ELSA-ID
Zitieren
Cepin S, Borcherding H, Kusch R, Schnückel C, Lis A. Design of Thermal Management for Double-Sided Cooled SiC-Power Semiconductors. (Mesago Messe Frankfurt GmbH, ed.). VDE Verlag; 2022:7. doi:10.30420/565822127
Cepin, S., Borcherding, H., Kusch, R., Schnückel, C., & Lis, A. (2022). Design of thermal management for double-sided cooled SiC-power semiconductors. In Mesago Messe Frankfurt GmbH (Ed.), PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 10-12 May 2022, Nuremberg (p. 7). VDE Verlag. https://doi.org/10.30420/565822127
Cepin S et al. (2022) Design of Thermal Management for Double-Sided Cooled SiC-Power Semiconductors, Mesago Messe Frankfurt GmbH (ed.). Berlin: VDE Verlag.
Cepin, Simon, Holger Borcherding, Rüdiger Kusch, Christian Schnückel, and Adrian Lis. Design of Thermal Management for Double-Sided Cooled SiC-Power Semiconductors. Edited by Mesago Messe Frankfurt GmbH. PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 10-12 May 2022, Nuremberg . Berlin: VDE Verlag, 2022. https://doi.org/10.30420/565822127.
Cepin, Simon, Holger Borcherding, Rüdiger Kusch, Christian Schnückel und Adrian Lis. 2022. Design of thermal management for double-sided cooled SiC-power semiconductors. Hg. von Mesago Messe Frankfurt GmbH. PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 10-12 May 2022, Nuremberg . Berlin: VDE Verlag. doi:10.30420/565822127, .
Cepin, Simon ; Borcherding, Holger ; Kusch, Rüdiger ; Schnückel, Christian ; Lis, Adrian ; Mesago Messe Frankfurt GmbH (Hrsg.): Design of thermal management for double-sided cooled SiC-power semiconductors. Berlin : VDE Verlag, 2022
S. Cepin, H. Borcherding, R. Kusch, C. Schnückel, A. Lis, Design of thermal management for double-sided cooled SiC-power semiconductors, VDE Verlag, Berlin, 2022.
S. Cepin, H. Borcherding, R. Kusch, C. Schnückel, and A. Lis, Design of thermal management for double-sided cooled SiC-power semiconductors. Berlin: VDE Verlag, 2022, p. 7. doi: 10.30420/565822127.
Cepin, Simon, et al. “Design of Thermal Management for Double-Sided Cooled SiC-Power Semiconductors.” PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 10-12 May 2022, Nuremberg , edited by Mesago Messe Frankfurt GmbH, VDE Verlag, 2022, p. 7, https://doi.org/10.30420/565822127.
Cepin, Simon u. a.: Design of thermal management for double-sided cooled SiC-power semiconductors, hg. von Mesago Messe Frankfurt GmbH, Berlin 2022.
Cepin S, Borcherding H, Kusch R, Schnückel C, Lis A. Design of thermal management for double-sided cooled SiC-power semiconductors. Mesago Messe Frankfurt GmbH, editor. PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 10-12 May 2022, Nuremberg . Berlin: VDE Verlag; 2022.
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