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1 Publikation


2024 | Konferenzband - Beitrag | ELSA-ID: 12891
Bünting, Karolin ; Shukla, Abhay Rammurti ; Song, Jian ; Institute of Electrical and Electronics Engineers ; IEEE Electronics Packaging Society (Hrsg.): The Influence of Long Term Thermal and Mechanical Loads on the Young’s Modulus of Cu-Alloys - Determination of Stress Relaxation in Electrical Connectors. [Piscataway, NJ] : IEEE, 2024
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Zitationsstil: Din 1505-2

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