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1 Publikation
2022 | Konferenzband - Beitrag | ELSA-ID: 7844
Borcherding, H., Springer, A., Müller, T., Ehlert, P., & Tolksdorf, A. (2022). Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID). In VDE ETG (Ed.), ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany (Vol. 165, pp. 500–507). VDE-Verlag.
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