Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications

F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications, IEEE, 2021.

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Konferenzband - Beitrag | Veröffentlicht | Englisch
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Titel Konferenzband
14th International Congress Molded Interconnect Devices (MID)
Konferenz
14th International Congress Molded Interconnect Devices (MID)
Konferenzort
Amberg
Konferenzdatum
2021-02-09 – 2021-02-10
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Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications. IEEE; 2021. doi:10.1109/mid50463.2021.9361628
Hemmelgarn, F., Ehlert, P., Mager, T., Jurgenhake, C., Dumitrescu, R., & Springer, A. (2021). Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). Amberg: IEEE. https://doi.org/10.1109/mid50463.2021.9361628
Hemmelgarn F et al. (2021) Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications. IEEE.
Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu, and André Springer. Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications. 14th International Congress Molded Interconnect Devices (MID). IEEE, 2021. https://doi.org/10.1109/mid50463.2021.9361628.
Hemmelgarn, Florian, Patrick Ehlert, Thomas Mager, Christoph Jurgenhake, Roman Dumitrescu und André Springer. 2021. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). IEEE. doi:10.1109/mid50463.2021.9361628, .
Hemmelgarn, Florian ; Ehlert, Patrick ; Mager, Thomas ; Jurgenhake, Christoph ; Dumitrescu, Roman ; Springer, André: Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications : IEEE, 2021
F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, A. Springer, Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications, IEEE, 2021.
F. Hemmelgarn, P. Ehlert, T. Mager, C. Jurgenhake, R. Dumitrescu, and A. Springer, Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. IEEE, 2021.
Hemmelgarn, Florian, et al. “Evaluation of Different Additive Manufacturing Technologies for MIDs in the Context of Smart Sensor Systems for Retrofit Applications.” 14th International Congress Molded Interconnect Devices (MID), IEEE, 2021, doi:10.1109/mid50463.2021.9361628.
Hemmelgarn, Florian et. al. (2021): Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications.
Hemmelgarn F, Ehlert P, Mager T, Jurgenhake C, Dumitrescu R, Springer A. Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. 14th International Congress Molded Interconnect Devices (MID). IEEE; 2021.

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