2022 | Konferenzband - Beitrag | ELSA-ID: 7844
Borcherding H, Springer A, Müller T, Ehlert P, Tolksdorf A. Integration of power electronic circuits using Coated Metal Interconnect Devices (CMID). VDE ETG, editor. ETG-Fb. 165: CIPS 2022 : 12th International Conference on Integrated Power Electronics Systems, Proceedings, March, 15 – 17, 2022, Berlin, Germany. Berlin: VDE-Verlag; 2022. ( ETG-Fachberichte; vol. 165).
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